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1. 发明申请

US20050067975A1 Method of operating a discharge lamp system and a discharge lamp system using a combination radial and longitudinal acoustic mode to reduce vertical segregation 有权
标题翻译：使用组合的径向和纵向声学模式来操作放电灯系统和放电灯系统以减少垂直偏析的方法
公开(公告)号：US20050067975A1
公开(公告)日：2005-03-31
申请号：US10670647
申请日：2003-09-25
申请人： Nancy Chen , Scott Butler , Joseph Olsen
发明人： Nancy Chen , Scott Butler , Joseph Olsen
IPC分类号： H05B41/24 , H05B41/292 , H05B37/02
CPC分类号： H05B41/2928 , Y02B20/208
摘要： A discharge lamp system and method of operating a discharge lamp system in which vertical segregation of vapor phase species is reduced. Lamp power is modulated with an arc-straightening frequency and with a frequency that excites a combination radial plus longitudinal acoustic mode of the lamp. The combination radial plus longitudinal acoustic mode may be a combination first radial mode and nth longitudinal acoustic mode and may be excited with a single power frequency or a swept power frequency range. The two frequencies may be provided at the same time, or separately where the modulation at the arc-straightening frequency is 2 to 16 times longer than a subsequent modulation at the combination radial plus longitudinal acoustic mode.
摘要翻译：一种放电灯系统和操作放电灯系统的方法，其中气相物质的垂直偏析减小。灯功率用弧矫正频率和频率激发灯的组合放射加纵向声学模式进行调制。组合径向加纵向声学模式可以是第一径向模式和第n纵向声学模式的组合，并且可以用单个功率频率或扫频功率频率范围来激励。两个频率可以同时提供，或者单独地在弧矫正频率处的调制比组合放射加纵向声学模式下的后续调制的2至16倍更长。

2. 发明授权

US6012231A Soldered integrated circuit connections 失效
公开(公告)号：US6012231A
公开(公告)日：2000-01-11
申请号：US986541
申请日：1997-12-08
申请人： Richard Regner , Scott Butler , Carey Blue
发明人： Richard Regner , Scott Butler , Carey Blue
IPC分类号： H05K3/34 , G01B5/14 , F23J3/00
CPC分类号： H05K3/3484 , H05K3/3442 , H01L2224/11472 , H01L2924/00014 , H05K2201/10636 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T428/12063 , Y10T428/12361 , Y10T428/12382
摘要： Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.

3. 发明授权

US06391468B2 Soldered integrated circuit connections 失效
标题翻译：焊接集成电路连接
公开(公告)号：US06391468B2
公开(公告)日：2002-05-21
申请号：US09822551
申请日：2001-03-30
申请人： Richard Regner , Scott Butler , Carey Blue
发明人： Richard Regner , Scott Butler , Carey Blue
IPC分类号： B22F510
CPC分类号： H05K3/3484 , H01L2224/11472 , H01L2924/00014 , H05K3/3442 , H05K2201/10636 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T428/12063 , Y10T428/12361 , Y10T428/12382 , H01L2224/0401
摘要： Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
摘要翻译：使用具有凹入边缘的孔的焊料模板来沉积焊膏，以减少焊球的形成。焊料沉积物可以形成在焊盘上，使得膏体具有凹形边缘。焊膏沉积物可以在相邻的焊盘上制成，凹面彼此面对。

4. 发明授权

US6094832A Method for depositing solder paste on a pad 有权
标题翻译：在焊盘上沉积焊膏的方法
公开(公告)号：US6094832A
公开(公告)日：2000-08-01
申请号：US270695
申请日：1999-03-17
申请人： Richard Regner , Scott Butler , Carey Blue
发明人： Richard Regner , Scott Butler , Carey Blue
IPC分类号： H05K3/34 , G01B5/14 , F23J3/00
CPC分类号： H05K3/3484 , H05K3/3442 , H01L2224/11472 , H01L2924/00014 , H05K2201/10636 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T428/12063 , Y10T428/12361 , Y10T428/12382
摘要： Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
摘要翻译：使用具有凹入边缘的孔的焊料模板来沉积焊膏，以减少焊球的形成。焊料沉积物可以形成在焊盘上，使得膏体具有凹形边缘。焊膏沉积物可以在相邻的焊盘上制成，凹面彼此面对。

5. 外观设计

USD938141S1 Reversible vest 有权
公开(公告)号：USD938141S1
公开(公告)日：2021-12-14
申请号：US29712408
申请日：2019-11-07
申请人： Christy Butler , Scott Butler
设计人： Christy Butler , Scott Butler

6. 发明授权

US5344815A Fabrication of high T.sub.C superconducting helical resonator coils 失效
标题翻译：高TC超导螺旋谐振器线圈的制造
公开(公告)号：US5344815A
公开(公告)日：1994-09-06
申请号：US875905
申请日：1992-04-29
申请人： Sophia R. Su , Margaret O'Connor , Scott Butler
发明人： Sophia R. Su , Margaret O'Connor , Scott Butler
IPC分类号： H01L39/24 , H01L39/12
CPC分类号： H01L39/248 , Y10S505/705 , Y10S505/739 , Y10S505/74 , Y10S505/742
摘要： A method for producing a superconducting copper oxide based helical resonator coil exhibiting improved quality factor, Q. A copper oxide based superconductor powder is mixed with a binder melt at about 45-65% solids by volume. The binder is an RCOOR' ester wax with R and R' each a long chain hydrocarbon group of at least 6 carbons. The ester wax has a melting point of about 40.degree.-100.degree. C. and a viscosity of about 94-2000 centipoise at its melting point. The binder/powder mixture is extruded and wrapped around a mandrel to form a helical coil. The coil is embedded in a setter powder and heated in an oxidizing atmosphere at up to about 2.degree. C./min to about 450.degree.-650.degree. C., and held for a time sufficient to remove the binder. The coil is then heated in the oxidizing atmosphere at up to about 3.degree. C./min to at least about 920.degree. C., and held at about 920.degree.-990.degree. C. for a time sufficient to achieve a density of at least about 93% of theoretical density. The densified coil is cooled in the oxidizing atmosphere at below about 2.degree. C./min to at or below about 550.degree. C., and annealed at about 450-550.degree. C. in flowing oxygen for a time sufficient to convert the crystal structure of the coil to at least 50 v/o high T.sub.c phase superconducting perovskite crystal. The geometry of the extruded, wrapped helical coil is selected to produce, after subsequent densification, a helical resonator coil about 3-17 mm in inner diameter, of a total length n .lambda./2, wherein n is an integer and .lambda. is the operating wavelength of the helical resonator coil.
摘要翻译：一种制造出具有改善的品质因数的超导氧化铜基螺旋共振器线圈的方法.Q。将基于氧化铜的超导体粉末与约45-65％体积固体的粘合剂熔体混合。粘合剂是RCOOR'酯蜡，其中R和R'各自具有至少6个碳的长链烃基。酯蜡的熔点约为40°-100℃，熔点约为94-2000厘泊。将粘合剂/粉末混合物挤出并缠绕在心轴上以形成螺旋线圈。将线圈嵌入固定器粉末中并在高达约2℃/分钟至约450-650℃的氧化气氛中加热，并保持足够的时间以除去粘合剂。然后将线圈在氧化气氛中以约3℃/分钟加热至至少约920℃，并保持在约920-990℃达一至少达到至少的密度约93％的理论密度。致密线圈在氧化气氛中在低于约2℃/分钟下冷却至约550℃或低于约550℃，并在约450-550℃下在流动的氧气中退火足以转化晶体结构的时间的线圈到至少50v / o的高Tc相超导体钙钛矿晶体。挤出的包裹的螺旋线圈的几何形状被选择以在随后的致密化之后产生总长度为nλ/ 2的内径约3-17mm的螺旋谐振器线圈，其中n是整数，λ是操作螺旋谐振器线圈的波长。

7. 发明授权

US08127417B1 Bearing assembly removal system and method 有权
标题翻译：轴承组装拆卸系统及方法
公开(公告)号：US08127417B1
公开(公告)日：2012-03-06
申请号：US11678966
申请日：2007-02-26
申请人： Scott Butler , Michael P. Alvey , Bryan Alan Brown
发明人： Scott Butler , Michael P. Alvey , Bryan Alan Brown
IPC分类号： B23P19/04
CPC分类号： B23P19/025 , B25B27/06 , F01D25/16 , F01D25/285 , F05D2230/70 , F05D2240/50 , F16C35/062 , F16C2360/23 , Y02T50/671 , Y10T29/53843 , Y10T29/53961 , Y10T29/53978
摘要： A system and method according to which a bearing assembly is removed from a casing. In several exemplary embodiments, the bearing assembly is removed from a turbine casing such as, for example, a gas-turbine casing in a jet engine.
摘要翻译：一种从壳体移除轴承组件的系统和方法。在几个示例性实施例中，轴承组件从涡轮机壳体例如喷气发动机中的燃气涡轮机壳体移除。

8. 发明申请

US20060066241A1 Ignition Aid for High Intensity Discharge Lamp 失效
标题翻译：高强度放电灯点火辅助
公开(公告)号：US20060066241A1
公开(公告)日：2006-03-30
申请号：US10711582
申请日：2004-09-27
申请人： Scott Butler , Arlene Hecker
发明人： Scott Butler , Arlene Hecker
IPC分类号： H01J17/46 , H01J61/30 , H01J61/35 , H01J61/54
CPC分类号： H01J61/54
摘要： An arc tube for a high intensity discharge lamp comprising a translucent body defining a discharge space and including spaced-apart electrodes; an arc generating and sustaining medium within the discharge space; and a starting aid contained within the discharge space, the starting aid comprising an electrically conductive stripe formed from a mixture of an electrically conductive material and the high temperature material.
摘要翻译：一种用于高强度放电灯的电弧管，包括限定放电空间并且包括间隔开的电极的半透明体; 放电空间内的电弧产生和维持介质; 以及包含在放电空间内的起始辅助剂，起始助剂包括由导电材料和高温材料的混合物形成的导电条纹。

9. 发明授权

US06248452B1 Soldered integrated circuit connections 有权
标题翻译：焊接集成电路连接
公开(公告)号：US06248452B1
公开(公告)日：2001-06-19
申请号：US09550784
申请日：2000-04-17
申请人： Richard Regner , Scott Butler , Carey Blue
发明人： Richard Regner , Scott Butler , Carey Blue
IPC分类号： B22F510
CPC分类号： H05K3/3484 , H01L2224/11472 , H01L2924/00014 , H05K3/3442 , H05K2201/10636 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T428/12063 , Y10T428/12361 , Y10T428/12382 , H01L2224/0401
摘要： Solder paste is deposited using a solder stencil with an aperture having a concave edge in order to reduce the formation of solder balls. The solder deposit may be formed on a pad such that the paste has a concave edge. Solder paste deposits may be made on adjacent pads with the concave surfaces facing one another.
摘要翻译：使用具有凹入边缘的孔的焊料模板来沉积焊膏，以减少焊球的形成。焊料沉积物可以形成在焊盘上，使得膏体具有凹形边缘。焊膏沉积物可以在相邻的焊盘上制成，凹面彼此面对。

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