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1. 发明授权

US11205542B2 Multilayer ceramic electronic component 有权
公开(公告)号：US11205542B2
公开(公告)日：2021-12-21
申请号：US16897322
申请日：2020-06-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai , Yosuke Terashita , Atsushi Nakamoto
IPC分类号： H01G4/232 , H01G4/008 , H01B1/22 , H01G4/30 , H01G4/12
摘要： A multilayer ceramic electronic component includes a ceramic element assembly and outer electrodes provided on respective end surfaces of the ceramic element assembly. Each outer electrode includes an underlying electrode layer that is provided on the ceramic element assembly and that includes a sintered metal and glass and a conductive resin layer that is provided on the underlying electrode layer and that includes a metal filler and a resin. The underlying electrode layer satisfies at least one condition of a condition that a maximum exposure length of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 3.8 μm or less and a condition that an exposure rate of the glass exposed at the interface between the underlying electrode layer and the conductive resin layer is about 10.1% or less.

2. 发明授权

US10242802B2 Electronic component with an external electrode including a conductive material-containing resin layer 有权
公开(公告)号：US10242802B2
公开(公告)日：2019-03-26
申请号：US15285535
申请日：2016-10-05
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai
IPC分类号： H01G4/248 , H01G4/005 , H01G4/224 , H01G4/30 , H01G4/232 , H01G4/012 , H01G4/12 , H01G4/008
摘要： An electronic component body includes an internal electrode that is partially extended to a surface of the electronic component body and is connected to an external electrode including a conductive material-containing resin layer including a conductive material and a resin layer and a plated layer covering the conductive material-containing resin layer. The conductive material-containing resin layer includes metal particles as the conductive material, and the plated layer extends from the surface of the conductive material-containing resin layer into the conductive material-containing resin layer such that the plated layer coats at least some of the metal particles.

3. 发明授权

US09520236B2 Multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US09520236B2
公开(公告)日：2016-12-13
申请号：US14677059
申请日：2015-04-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Jun Ikeda , Kota Zenzai
IPC分类号： H01G4/232 , H01G4/30 , H01G4/012 , H01G4/12 , H01G4/248
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/2325 , H01G4/248
摘要： A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.
摘要翻译：多层陶瓷电子部件包括陶瓷元件体，其包括内部电极和与各自的内部电极电连接的外部电极。每个外部电极包括包括玻璃和金属的烧结金属层和包括树脂和金属颗粒的导电树脂层。在多层陶瓷电容器的截面中，在烧结金属层与导电性树脂层之间的界面处存在具有内部尺寸大于入口尺寸的形状的凹部，L1 / L2为约0.2以上且约1.5以下，其中，L1是沿着烧结金属层的玻璃在界面露出的界面的长度，L2是沿烧结金属的金属的界面的长度金属层在界面处露出。

4. 发明授权

US11581137B2 Multilayer ceramic electronic component and electrically conductive paste for resin electrode 有权
公开(公告)号：US11581137B2
公开(公告)日：2023-02-14
申请号：US16897323
申请日：2020-06-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai
IPC分类号： B22F1/00 , C08L63/00 , H01B1/22 , H01G4/008 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/30 , H05K1/09 , B22F1/16
摘要： A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

5. 发明授权

US11017950B2 Method for producing a ceramic electronic component 有权
公开(公告)号：US11017950B2
公开(公告)日：2021-05-25
申请号：US15272680
申请日：2016-09-22
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号： H01G7/00 , H01G4/30 , H01G4/12 , H01G4/005 , H01F27/29 , H01F17/00 , H01G4/008 , H01G4/012 , H01G4/248
摘要： A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.

6. 发明授权

US09799452B2 Ceramic electronic component and method of manufacturing the same 有权
公开(公告)号：US09799452B2
公开(公告)日：2017-10-24
申请号：US14305117
申请日：2014-06-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Kenichi Hamanaka , Kota Zenzai , Taku Dekura , Kiyotaka Maegawa
IPC分类号： H01G4/30 , H01G4/232 , H01G4/12
CPC分类号： H01G4/30 , H01G4/12 , H01G4/232 , H01G4/2325 , Y10T29/435
摘要： A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. The inner external electrode includes a plurality of holes. An average opening diameter of the plurality of holes is not greater than about 2.5 μm. Some or all of the plurality of holes are embedded with the metal component of the outer external electrode.

7. 发明申请

US20150364256A1 CONDUCTIVE RESIN PASTE AND CERAMIC ELECTRONIC COMPONENT 审中-公开
标题翻译：导电树脂和陶瓷电子元件
公开(公告)号：US20150364256A1
公开(公告)日：2015-12-17
申请号：US14735434
申请日：2015-06-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai , Yosuke Terashita
IPC分类号： H01G4/008 , H01G4/30 , H01G4/12 , C09D5/24
摘要： A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.
摘要翻译：一种导电性树脂糊剂，其包含导电性成分和树脂成分，其中，所述导电成分至少含有Ag，Cu，所述Ag与所述导电性成分中所含的Ag，Cu的总量的比例在所述导电性成分的范围内， 11.6质量％〜28.8质量％。作为导电组分，使用具有至少部分涂覆有Ag的表面的Cu粉末的Ag涂覆的Cu粉末。

8. 发明授权

US10453613B2 Conductive resin paste and ceramic electronic component 有权
公开(公告)号：US10453613B2
公开(公告)日：2019-10-22
申请号：US14735434
申请日：2015-06-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Kota Zenzai , Yosuke Terashita
IPC分类号： H01G4/30 , C09D5/24 , H01G4/232 , H01G4/12
摘要： A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag.

9. 发明授权

US10062514B2 Multilayer ceramic capacitor 有权
公开(公告)号：US10062514B2
公开(公告)日：2018-08-28
申请号：US15484370
申请日：2017-04-11
申请人： Murata Manufacturing Co., Ltd.
发明人： Seiji Katsuta , Yosuke Terashita , Takayoshi Yamamoto , Atsushi Ishida , Kota Zenzai
IPC分类号： H01G4/30 , H01G4/232 , H01G4/012 , H01G4/10 , H01G4/12
CPC分类号： H01G4/30 , H01G4/012 , H01G4/10 , H01G4/12 , H01G4/1227 , H01G4/1236 , H01G4/232 , H01G4/2325
摘要： In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.

10. 发明授权

US10008331B2 Multilayer ceramic electronic component 有权
公开(公告)号：US10008331B2
公开(公告)日：2018-06-26
申请号：US15345571
申请日：2016-11-08
申请人： Murata Manufacturing Co., Ltd.
发明人： Jun Ikeda , Kota Zenzai
IPC分类号： H01G4/30 , H01G4/232 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/005 , H01G4/228
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/2325 , H01G4/248
摘要： A multilayer ceramic electronic component includes a ceramic element body including internal electrodes and external electrodes electrically connected to respective internal electrodes. Each of the external electrodes includes a sintered metal layer including glass and metal and a conductive resin layer including resin and metal particles. In a cross section of the multilayer ceramic capacitor, at an interface between the sintered metal layer and the conductive resin layer, recesses having a shape in which a dimension of an inner portion is larger than a dimension of an inlet are present, and L1/L2 is about 0.2 or more and about 1.5 or less, where L1 is a length along the interface at which the glass of the sintered metal layer is exposed at the interface, and L2 is a length along the interface at which the metal of the sintered metal layer is exposed at the interface.

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