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1. 发明授权

US08779195B2 Polyamine derivatives 失效
标题翻译：多胺衍生物
公开(公告)号：US08779195B2
公开(公告)日：2014-07-15
申请号：US12514540
申请日：2007-11-12
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07C303/00 , C07C307/00 , C07C309/00 , C07C311/00
CPC分类号： C07C311/18 , C07C311/05
摘要： A compound having the general formula (I) or a pharmacologically acceptable salt thereof: X—NH—Y—NH—R1 (I) [wherein X represents R2—SO2— in which R2 represents an optionally substituted lower alkyl group or phenyl group; Y represents a group selected from the group consisting of —R3—NH—R4—, —R5—NH—R6—NH—R7—, —R8—NH—R9—NH—R10—NH—R11—and —R12—NH—R13—NH—R14—NH—R15— in which R3 to R15 each independently represent a C3 to C5 alkylene group; and R1 represents hydrogen or an optionally substituted lower alkyl group, with the proviso that the case where X represents a tosyl group, Y represents —(CH2)3—NH—(CH2)4—NH—(CH2)3—and R1 represents hydrogen is excepted].
摘要翻译：具有通式（I）的化合物或其药学上可接受的盐：X-NH-Y-NH-R1（I）[其中X表示R2-SO2-，其中R2表示任选取代的低级烷基或苯基; Y表示选自-R 3 -NH-R 4 - ，-R 5-NH-R 6 -NH-R 7 - ， - R 8 -NH-R 9 -NH-R 10 -NH-R 11 - 和-R 12-NH -R13-NH-R14-NH-R15-，其中R3至R15各自独立地表示C3至C5亚烷基; 并且R 1表示氢或任选取代的低级烷基，条件是X表示甲苯磺酰基，Y表示 - （CH 2）3 -NH-（CH 2）4 -NH-（CH 2）3 - 并且R 1表示氢除外]。

2. 发明申请

US20100063322A1 NOVEL POLYAMINE DERIVATIVES 失效
标题翻译：新型聚氨酯衍生物
公开(公告)号：US20100063322A1
公开(公告)日：2010-03-11
申请号：US12514540
申请日：2007-11-12
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07C311/16 , C07C311/03
CPC分类号： C07C311/18 , C07C311/05
摘要： A compound having the general formula (I) or a pharmacologically acceptable salt thereof: X—NH—Y—NH—R1 (I) [wherein X represents R2—SO2— in which R2 represents an optionally substituted lower alkyl group or phenyl group; Y represents a group selected from the group consisting of —R3—NH—R4—, —R5—NH—R6—NH—R7—, —R8—NH—R9—NH—R10—NH—R11— and —R12—NH—R13—NH—R14—NH—R15— in which R3 to R15 each independently represent a C3 to C5 alkylene group; and R1 represents hydrogen or an optionally substituted lower alkyl group, with the proviso that the case where X represents a tosyl group, Y represents —(CH2)3—NH—(CH2)4—NH—(CH2)3— and R1 represents hydrogen is excepted].
摘要翻译：具有通式（I）的化合物或其药学上可接受的盐：X-NH-Y-NH-R1（I）[其中X表示R2-SO2-，其中R2表示任选取代的低级烷基或苯基; Y表示选自-R 3 -NH-R 4 - ，-R 5-NH-R 6 -NH-R 7 - ， - R 8 -NH-R 9 -NH-R 10 -NH-R 11 - 和-R 12-NH -R13-NH-R14-NH-R15-，其中R3至R15各自独立地表示C3至C5亚烷基; 并且R 1表示氢或任选取代的低级烷基，条件是其中X表示甲苯磺酰基，Y表示 - （CH2）3-NH-（CH2）4-NH-（CH2）3-，R1表示氢除外]。

3. 发明授权

US08895564B2 Biguanide derivative compound 有权
标题翻译：双胍衍生物
公开(公告)号：US08895564B2
公开(公告)日：2014-11-25
申请号：US13991344
申请日：2011-12-01
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07D241/34 , C07D241/28 , A61K31/4965
CPC分类号： C07D241/34 , A61K31/4965 , C07D241/28
摘要： Provided is a novel compound which simultaneously inhibits both NMDA receptors and ASIC1a, which are associated with neurodegenerative disease and so on, and thus is useful for the prevention and treatment of various nervous system diseases. A biguanide derivative represented by the following general formula (1), a salt thereof, or a hydrate of the derivative or the salt: wherein, X1 represents a halogen atom, R1 represents an alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group.
摘要翻译：提供同时抑制与神经变性疾病等相关的NMDA受体和ASIC1a的新型化合物，因此可用于预防和治疗各种神经系统疾病。由以下通式（1）表示的双胍衍生物，其盐或其衍生物或盐的水合物：其中，X1表示卤素原子，R1表示烷基，任选取代的芳基或任意取代的芳基取代的芳烷基。

4. 发明申请

US20130281464A1 BIGUANIDE DERIVATIVE COMPOUND 有权
标题翻译： BIGUANIDE衍生化合物
公开(公告)号：US20130281464A1
公开(公告)日：2013-10-24
申请号：US13991344
申请日：2011-12-01
申请人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
发明人： Muneharu Miyake , Tadashi Kusama , Takashi Masuko
IPC分类号： C07D241/34
CPC分类号： C07D241/34 , A61K31/4965 , C07D241/28
摘要： Provided is a novel compound which simultaneously inhibits both NMDA receptors and ASIC1a, which are associated with neurodegenerative disease and so on, and thus is useful for the prevention and treatment of various nervous system diseases. A biguanide derivative represented by the following general formula (1), a salt thereof, or a hydrate of the derivative or the salt: wherein, X1 represents a halogen atom, R1 represents an alkyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group.
摘要翻译：提供同时抑制与神经变性疾病等相关的NMDA受体和ASIC1a的新型化合物，因此可用于预防和治疗各种神经系统疾病。由以下通式（1）表示的双胍衍生物，其盐或其衍生物或盐的水合物：其中，X1表示卤素原子，R1表示烷基，任选取代的芳基或任意取代的芳基取代的芳烷基。

5. 发明申请

US20120263946A1 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER 审中-公开
标题翻译：半导体器件，制造半导体器件的方法和具有粘合层的半导体器件
公开(公告)号：US20120263946A1
公开(公告)日：2012-10-18
申请号：US13509362
申请日：2010-11-10
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Shinjiro Fujii
IPC分类号： B32B7/12 , C09J7/02 , H01L21/50
CPC分类号： H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
摘要翻译：本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。

6. 发明申请

US20110121435A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：光敏性粘合剂组合物，胶粘剂，粘合片，粘合剂图案，具有粘合层的半导体滤波器，半导体器件以及用于制造半导体器件的方法
公开(公告)号：US20110121435A1
公开(公告)日：2011-05-26
申请号：US12863068
申请日：2009-01-09
申请人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
发明人： Kazuyuki Mitsukura , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
IPC分类号： H01L25/00 , C08J3/28 , B32B3/30 , H01L21/50
CPC分类号： C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
摘要翻译：一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％组合物中的整个光引发剂混合物为200℃或更高。

7. 发明申请

US20080176167A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART 有权
标题翻译：感光性粘合剂组合物，使用它们，粘合膜，粘合片，具有粘合层的半导体膜，半导体器件和电子部件
公开(公告)号：US20080176167A1
公开(公告)日：2008-07-24
申请号：US11969358
申请日：2008-01-04
申请人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
发明人： Takashi Kawamori , Takashi Masuko , Shigeki Katogi , Masaaki Yasuda
IPC分类号： G03F7/004 , G03F7/26
CPC分类号： H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
摘要翻译：一种感光性粘合剂组合物，其包含：（A）具有羧基作为侧链的聚酰亚胺，其酸值为80〜180mg / KOH; （B）光聚合性化合物; 和（C）光聚合引发剂。

8. 发明授权

US07387914B2 Semiconductor device and process for fabrication thereof 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US07387914B2
公开(公告)日：2008-06-17
申请号：US11379921
申请日：2006-04-24
申请人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
发明人： Shinji Takeda , Takashi Masuko , Masami Yusa , Tooru Kikuchi , Yasuo Miyadera , Iwao Maekawa , Mitsuo Yamasaki , Akira Kageyama , Aizou Kaneda
IPC分类号： H01L21/48 , H01L21/50
CPC分类号： H01L24/27 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/743 , H01L24/83 , H01L24/97 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83805 , H01L2224/8385 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12044 , H01L2924/181 , Y10T428/28 , H01L2924/00 , H01L2924/01014 , H01L2224/83 , H01L2224/85 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
摘要翻译：将半导体芯片与吸水率为1.5体积％以下的薄膜状有机芯片接合材料贴合在引线框架上; 具有1.0体积％以下的饱和吸湿性，在250℃的温度下具有不大于3.0重量％的残留挥发组分，弹性模量为10MPa以下。半导体装置这样获得的半导体器件的封装的回流焊接期间不会发生回流裂纹。

9. 发明申请

US20070098995A1 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device 审中-公开
标题翻译：粘合膜及其制备方法以及粘合片和半导体器件
公开(公告)号：US20070098995A1
公开(公告)日：2007-05-03
申请号：US10560073
申请日：2004-06-10
申请人： Takashi Masuko , Keisuke Ookubo , Keiichi Hatakeyama , Masami Yusa
发明人： Takashi Masuko , Keisuke Ookubo , Keiichi Hatakeyama , Masami Yusa
IPC分类号： B32B27/00 , C08L63/00 , C08L79/08 , B32B37/00
CPC分类号： H01L21/6835 , C09J7/10 , C09J7/35 , C09J2201/36 , C09J2463/00 , C09J2479/08 , H01L21/67132 , H01L21/6836 , H01L24/27 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2221/6839 , H01L2221/68395 , H01L2224/274 , H01L2224/27436 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/83856 , H01L2224/8388 , H01L2224/83885 , H01L2224/92 , H01L2224/92247 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01067 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00014
摘要： An object of the present invention is to provide a die-adhering adhesive film which can be laminated on a back of a wafer at a temperature lower than a softening temperature of a protecting tape for an ultra-thin wafer, or a dicing tape to be laminated, can reduce a thermal stress such as warpage of a wafer, can simplify a step of manufacturing a semiconductor device, and is excellent in heat resistance and humidity resistance reliance, an adhesive sheet in which the adhesive film and a dicing tape are laminated, as well as a semiconductor device.
摘要翻译：本发明的目的是提供一种芯片粘附粘合剂膜，其可以在低于超薄晶片的保护带的软化温度或切割胶带的温度下层压在晶片的背面上可以降低晶片的翘曲等热应力，能够简化半导体装置的制造工序，耐热性和耐湿性依赖性优异，粘贴薄膜和切割胶带的粘合片层叠，以及半导体器件。

10. 发明申请

US20050001044A1 Thermostat for two-system cooling device 失效
标题翻译：双系统冷却装置恒温器
公开(公告)号：US20050001044A1
公开(公告)日：2005-01-06
申请号：US10494047
申请日：2003-06-18
申请人： Takashi Masuko , Akira Mori , Toru Yoshihara
发明人： Takashi Masuko , Akira Mori , Toru Yoshihara
IPC分类号： F01P7/16 , F16K31/68 , G05D23/13 , G05D23/02
CPC分类号： F16K11/02 , F01P7/16 , F01P2003/027 , F01P2037/02 , G05D23/134
摘要： A thermostat independently controlling cooling water passages of two circuits, including a first valve body having first and second passages in constant communication. A third passage is selectively connected to those passages. Communication of the third passage is disconnected when the cooling water temperature is below a prescribed temperature, and the valve is opened when the cooling water temperature is equal to or higher than the prescribed temperature. A second valve body, having fourth and fifth passages selectively in communication, closes the valve to disconnect those passages when the cooling water temperature is below the prescribed temperature, and opens the valve by operating the first valve body to link the passages when the cooling water temperature is equal to or higher than the prescribed temperature. A tubular sleeve prevents first and second control chambers, respectively including the first and second valve bodies, from communicating with each other.
摘要翻译：一种独立控制两个电路的冷却水通道的恒温器，包括具有恒定连通的第一和第二通道的第一阀体。选择性地连接到第三通道。当冷却水温度低于规定温度时，第三通道的通信断开，当冷却水温度等于或高于规定温度时，阀门打开。具有选择性连通的第四和第五通道的第二阀体在冷却水温度低于规定温度时关闭阀门以断开这些通道，并且当冷却水通过操作第一阀体连接通道而打开阀门温度等于或高于规定温度。管状套筒防止分别包括第一和第二阀体的第一和第二控制室彼此连通。

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