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    • 1. 发明授权
    • Method and system for performing built-in-self-test routines using an accumulator to store fault information
    • 使用累加器来执行内置自检程序来存储故障信息的方法和系统
    • US07493541B1
    • 2009-02-17
    • US11824264
    • 2007-06-29
    • Ghasi R. AgrawalMukesh K. PuriWilliam Schwarz
    • Ghasi R. AgrawalMukesh K. PuriWilliam Schwarz
    • G01R31/28
    • G11C29/56G11C29/56008
    • A test system includes a built-in self-test (BIST) circuit and a stress applicator for use in analyzing a memory array. The stress applicator applies a selective set of stress factors to the memory array, such as temperature and voltage conditions. The BIST circuit executes a test routine on the memory array to detect the presence of any faulty memory address locations that may arise under the prevailing stress condition. A full testing cycle involves iterative repetition of the functions performed by the stress applicator and BIST circuit, with variations in the stress factors across the testing iterations. An accumulator cumulatively stores the fault information generated by the BIST circuit during each testing iteration. Following completion of the testing cycle, a repair operation is performed by a built-in self-repair (BISR) circuit to remap the faulty memory address locations indicated by the accumulator to redundant memory address locations.
    • 测试系统包括内置的自检(BIST)电路和用于分析存储器阵列的应力施加器。 应力施加器向存储器阵列施加选择性的一组应力因子,例如温度和电压条件。 BIST电路在存储器阵列上执行测试程序,以检测在当前应力条件下可能出现的任何故障存储器地址位置的存在。 完整的测试周期包括由应力施加器和BIST电路执行的功能的迭代重复,并且跨越测试迭代的应力因子的变化。 累加器在每个测试迭代期间累积地存储由BIST电路产生的故障信息。 在完成测试周期之后,通过内置自修复(BISR)电路执行修复操作,将由累加器指示的故障存储器地址位置重新映射到冗余存储器地址位置。
    • 2. 发明授权
    • Method and system for performing built-in self-test routines using an accumulator to store fault information
    • 使用累加器执行内置自检程序来存储故障信息的方法和系统
    • US07260758B1
    • 2007-08-21
    • US09949399
    • 2001-09-07
    • Ghasi R. AgrawalMukesh K. PuriWilliam Schwarz
    • Ghasi R. AgrawalMukesh K. PuriWilliam Schwarz
    • G01R31/28
    • G11C29/56G11C29/56008
    • A test system includes a built-in self-test (BIST) circuit and a stress applicator for use in analyzing a memory array. The stress applicator applies a selective set of stress factors to the memory array, such as temperature and voltage conditions. The BIST circuit executes a test routine on the memory array to detect the presence of any faulty memory address locations that may arise under the prevailing stress condition. A full testing cycle involves iterative repetition of the functions performed by the stress applicator and BIST circuit, with variations in the stress factors across the testing iterations. An accumulator cumulatively stores the fault information generated by the BIST circuit during each testing iteration. Following completion of the testing cycle, a repair operation is performed by a built-in self-repair (BISR) circuit to remap the faulty memory address locations indicated by the accumulator to redundant memory address locations.
    • 测试系统包括内置自检(BIST)电路和用于分析存储器阵列的应力施加器。 应力施加器向存储器阵列施加选择性的一组应力因子,例如温度和电压条件。 BIST电路在存储器阵列上执行测试程序,以检测在当前应力条件下可能出现的任何故障存储器地址位置的存在。 完整的测试周期包括由应力施加器和BIST电路执行的功能的迭代重复,并且跨越测试迭代的应力因子的变化。 累加器在每个测试迭代期间累积地存储由BIST电路产生的故障信息。 在完成测试周期之后,通过内置自修复(BISR)电路执行修复操作,将由累加器指示的故障存储器地址位置重新映射到冗余存储器地址位置。
    • 4. 发明授权
    • Method for testing semiconductor devices having built-in self repair (BISR) memory
    • 用于测试具有内置自修复(BISR)存储器的半导体器件的方法
    • US07076699B1
    • 2006-07-11
    • US09956302
    • 2001-09-19
    • Mukesh K. PuriGhasi R. AgrawalWilliam Schwarz
    • Mukesh K. PuriGhasi R. AgrawalWilliam Schwarz
    • G11C29/00
    • G11C17/165G11C29/027G11C29/12015G11C29/44G11C29/4401G11C29/50G11C29/50012G11C29/50016G11C2029/4402
    • A method for testing semiconductor devices advantageously increases manufacturing yields. The method includes generating memory repair data for a wafer die by writing at least one predetermined digital bit pattern into a memory on the wafer die, reading the at least one predetermined digital bit pattern back out of the memory, comparing the at least one predetermined digital bit pattern read out from the memory against the at least one predetermined digital bit pattern written into the memory, and storing results of the comparison as the memory repair data. The writing and reading are performed a plurality of times, each time with a different voltage and clock frequency combination being applied to the wafer die. The memory repair data is programmed into the wafer die, and the wafer die is assembled into a packaged semiconductor device. The packaged semiconductor device is tested by causing the memory repair data programmed within the packaged semiconductor device to be transferred into the memory a plurality of times, each time with a different voltage and clock frequency combination being applied to the packaged semiconductor device.
    • 用于测试半导体器件的方法有利地提高了制造成品率。 该方法包括通过将至少一个预定的数字位模式写入晶片管芯上的存储器来产生晶片管芯的存储器修复数据,将至少一个预定的数字位模式读出存储器,将至少一个预定的数字位模式 从写入存储器的至少一个预定的数字位模式从存储器读出的位模式,并将比较的结果存储为存储器修复数据。 执行写入和读取多次,每次以不同的电压和时钟频率组合施加到晶片管芯。 将存储器修复数据编程到晶片管芯中,将晶片管芯组装成封装的半导体器件。 通过使封装的半导体器件中编程的存储器修复数据被多次传送到封装的半导体器件中,每次都将不同的电压和时钟频率组合应用于封装的半导体器件。
    • 5. 发明授权
    • Hard BISR scheme allowing field repair and usage of reliability controller
    • 硬BISR方案允许现场维修和使用可靠性控制器
    • US07536611B2
    • 2009-05-19
    • US10700177
    • 2003-11-03
    • Mukesh K. PuriGhasi R. AgrawalTuan L. Phan
    • Mukesh K. PuriGhasi R. AgrawalTuan L. Phan
    • G11C29/00
    • G11C29/44G11C29/4401
    • A BISR scheme which provides for on-chip assessment of the amount of repair on a given memory and for the flagging of any device as a fail when the device exceeds a pre-determined limit. Preferably, a counter is built and loaded through a test pattern during production testing, and the counter establishes the threshold for pass/fail criteria. The BISR is configured to load a repair solution and then test the memories for any additional failures and if there are any, repair them (provided enough redundant elements are available). In addition, a reliability controller for BISR designs can be provided, where the reliability controller contains a register set and a number of counters at the chip-level which can be loaded through a test pattern during production tests, where one of the counters contains the number of memories to be allowed for repair.
    • BISR方案,用于在给定存储器上进行片上修复量的评估,以及当设备超过预定限制时将任何设备标记为失败。 优选地,在生产测试期间通过测试图案构建计数器并加载计数器,并且计数器建立通过/失败准则的阈值。 BISR被配置为加载修复解决方案,然后测试存储器的任何其他故障,如果有的话,修复它们(只要有足够的冗余元素可用)。 此外,可以提供用于BISR设计的可靠性控制器,其中可靠性控制器包含在芯片级的寄存器组和多个计数器,其可以在生产测试期间通过测试模式加载,其中一个计数器包含 允许修复的记忆数量。
    • 6. 发明授权
    • Scan method for built-in-self-repair (BISR)
    • 内置自我修复扫描方法(BISR)
    • US06928598B1
    • 2005-08-09
    • US09880675
    • 2001-06-13
    • Ghasi R. AgrawalMukesh K. Puri
    • Ghasi R. AgrawalMukesh K. Puri
    • G01R31/28G01R31/3185G11C29/00
    • G11C29/4401G01R31/318555G11C29/72G11C2029/3202
    • A system and method for protecting the values stored in a BISR repair block and, optionally, debugging the BISR repair logic without altering normal test flow is implemented by a circuit including a plurality of soft latches within the BISR repair block, the soft latches being coupled together to form a BISR scan chain for holding BISR repair information. A chip level scan enable signal and a scan hold control signal cooperate to control connection of the BISR scan chain to other scan chains during a scan test, so that the BSR repair information is held within the soft latches. A diagnose enable signal cooperating with the chip level scan enable signal and the scan hold control signal for enabling debugging of logic connecting the BISR scan chains.
    • 用于保护存储在BISR修复块中的值以及可选地调试BISR修复逻辑而不改变正常测试流的系统和方法由包括BISR修复块内的多个软锁存器的电路实现,所述软锁存器被耦合 一起形成一个BISR扫描链,用于保存BISR修复信息。 在扫描测试期间,芯片级扫描使能信号和扫描保持控制信号协调控制BISR扫描链与其他扫描链的连接,使得BSR修复信息保持在软锁存器内。 诊断使能信号与芯片级扫描使能信号和扫描保持控制信号协同工作,以实现连接BISR扫描链的逻辑调试。
    • 7. 发明授权
    • Sharing fuse blocks between memories in hard-BISR
    • 在硬BISR中的内存之间共享熔丝块
    • US06898143B2
    • 2005-05-24
    • US10647993
    • 2003-08-26
    • Mukesh K. PuriGhasi R. Agrawal
    • Mukesh K. PuriGhasi R. Agrawal
    • G11C7/00G11C29/00
    • G11C29/88G11C29/4401G11C29/802
    • A BISR scheme which provides that fuse blocks are shared between memories to reduce hard-BISR implementation costs. The scheme includes a plurality of memories serially connected to a fuse controller. A plurality of fuse blocks are also serially connected to the fuse controller. There are more memory instances than there are fuse blocks, and the fuse controller is configured to allow the fuse blocks to be shared between memories. Preferably, each fuse block includes fuse elements which can be programmed with the memory instance number which needs to be repaired. The fuse block reduces routing congestion and is preferably configured to provide the flexibility of assigning any fuse block to any instance that needs repair. The programmable fuse elements are preferably loaded into a counter (which is preferably part of the fuse controller) which ensures that the correct block information gets loaded into the corresponding memory instance.
    • 一种BISR方案,其提供了在存储器之间共享的熔丝块,以减少硬性BISR的实施成本。 该方案包括串联连接到熔丝控制器的多个存储器。 多个熔丝块也串联连接到熔丝控制器。 存在比存在熔丝块更多的存储器实例,并且熔丝控制器被配置为允许熔丝块在存储器之间共享。 优选地,每个保险丝盒包括可以用需要修复的存储器实例编号的熔丝元件。 熔断器块减少了路由拥塞,并且优选地被配置为提供将任何熔丝块分配给需要修复的任何实例的灵活性。 可编程保险丝元件优选地被加载到计数器(其优选地是熔丝控制器的一部分),其确保正确的块信息被加载到相应的存储器实例中。
    • 10. 发明授权
    • Low power high density asynchronous memory architecture
    • 低功耗高密度异步存储器架构
    • US06404700B1
    • 2002-06-11
    • US09880491
    • 2001-06-13
    • Ghasi R. Agrawal
    • Ghasi R. Agrawal
    • G11C800
    • G11C8/16
    • An architecture for a low power, high density (smaller area) asynchronous memory comprises memory cells including a forward inverter and a feedback inverter disposed in a back-to-back arrangement (i.e., back-to-back inverters), two write access transistors, a read inverter, and a read access transistor. The architecture employs a double ended write into the memory cells wherein Write Bit Lines coupled to write access transistors are precharged to Vdd−Vtn, or, alternately Vdd, when the signal Write Enable (WE) is low (i.e., “0”).
    • 用于低功率,高密度(较小面积)异步存储器的架构包括存储单元,其包括以背对背布置(即背对背反向器)设置的正向反相器和反馈反相器,两个写入存取晶体管 读取反相器和读取存取晶体管。 该结构采用双端写入存储器单元,其中耦合到写存取晶体管的写位线被预充电到Vdd-Vtn,或者当信号写使能(WE)为低(即“0”)时交替地为Vdd。