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1. 发明授权

US06690081B2 Compliant wafer-level packaging devices and methods of fabrication 失效
标题翻译：符合晶圆级封装的器件和制造方法
公开(公告)号：US06690081B2
公开(公告)日：2004-02-10
申请号：US09993100
申请日：2001-11-19
申请人： Muhannad S. Bakir , Hollie Reed , Paul Kohl , Chirag S. Patel , Kevin P. Martin , James Meindl
发明人： Muhannad S. Bakir , Hollie Reed , Paul Kohl , Chirag S. Patel , Kevin P. Martin , James Meindl
IPC分类号： H01L2900
CPC分类号： H01L23/49811 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.
摘要翻译：公开了其制造的装置及其制造方法。代表性的装置包括一个或多个引线封装。引线封装包括包括多个管芯焊盘，外涂层聚合物层，设置在基板和外涂层聚合物层之间的多个牺牲聚合物层以及多个引线的基板。每个引线设置在具有设置在管芯焊盘上的第一部分的外涂层聚合物层上。可以除去牺牲聚合物层以形成一个或多个气隙。

2. 发明申请

US20050257709A1 Systems and methods for three-dimensional lithography and nano-indentation 审中-公开
标题翻译：三维光刻和纳米压痕的系统和方法
公开(公告)号：US20050257709A1
公开(公告)日：2005-11-24
申请号：US10699287
申请日：2003-10-31
申请人： Tony Mule , Paul Kohl , Muhannad Bakir , Kevin Martin , James Meindl , Hiren Thacker
发明人： Tony Mule , Paul Kohl , Muhannad Bakir , Kevin Martin , James Meindl , Hiren Thacker
IPC分类号： B41F1/00 , B81C1/00 , G03F7/00
CPC分类号： G03F7/00 , B81B2201/042 , B81B2201/047 , B81B2201/058 , B81B2203/0384 , B81C1/00119 , B81C2201/0108 , B81C2201/0152 , B81C2201/0159 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0015
摘要： Systems and methods for three dimensional lithography, nano-indentation, and combinations thereof are disclosed. One exemplary three dimensional lithography method, among others, includes: providing a substrate having at least one optical element, wherein the optical element is selected from a refractive element and a diffractive element; disposing a polymer layer on the substrate and the at least one optical element, wherein the polymer layer includes a polymer material selected from a positive-tone polymer material and a negative-tone polymer material; positioning a mask adjacent the polymer layer, wherein the mask does not cover at least one directly exposed portion of the polymer material directly overlaying the at least one element; and exposing the at least one directly exposed portion of the polymer material to optical energy, wherein the optical energy passes through the at least one directly exposed portion of the polymer material and interacts with the element, and the element redirects the optical energy through the polymer material forming at least one area of indirectly exposed polymer material.
摘要翻译：公开了用于三维光刻，纳米压痕及其组合的系统和方法。一种示例性的三维光刻方法，其中包括：提供具有至少一个光学元件的衬底，其中所述光学元件选自折射元件和衍射元件; 在所述基板和所述至少一个光学元件上设置聚合物层，其中所述聚合物层包括选自正性聚合物材料和负性聚合物材料的聚合物材料; 将掩模定位在所述聚合物层附近，其中所述掩模不覆盖直接覆盖所述至少一个元件的聚合物材料的至少一个直接暴露部分; 并且将所述聚合物材料的至少一个直接暴露部分暴露于光能，其中所述光能通过所述聚合物材料的所述至少一个直接暴露部分并且与所述元件相互作用，并且所述元件将所述光能重定向通过所述聚合物形成间接暴露的聚合物材料的至少一个区域的材料。

3. 发明申请

US20080003528A1 PHOTO-MASKS AND METHODS OF FABRICATING SURFACE-RELIEF GRATING DIFFRACTIVE DEVICES 有权
标题翻译：制作表面消光衍射衍射装置的照片和方法
公开(公告)号：US20080003528A1
公开(公告)日：2008-01-03
申请号：US11767372
申请日：2007-06-22
申请人： Thomas Gaylord , Justin Stay , Jonathan Maikisch , James Meindl
发明人： Thomas Gaylord , Justin Stay , Jonathan Maikisch , James Meindl
IPC分类号： G03C5/56 , B29D11/00 , G02B27/42 , G02B27/44
CPC分类号： G02B5/1857 , G02B27/4238
摘要： Photo-masks for fabricating surface-relief grating diffractive devices and methods of fabricating surface-relief grating diffractive devices are described. The photo-mask can include refractive elements and/or diffractive elements contained in or on a body element. The photo-mask can be used to simultaneously produce multiple surface-relief grating diffractive devices in a recording material. The photo-mask enables the surface-relief grating diffractive devices to be produced in large quantities while significantly reducing the cost and labor required.
摘要翻译：描述了用于制造表面浮雕光栅衍射装置的照相掩模和制造表面浮雕光栅衍射装置的方法。光掩模可以包括包含在体元件中或其上的折射元件和/或衍射元件。光掩模可用于在记录材料中同时产生多个表面浮雕光栅衍射装置。光掩模使得能够大量地生产表面浮雕光栅衍射装置，同时显着降低所需的成本和劳动。

4. 发明申请

US20070106964A1 Optimized microchip and related methods 审中-公开
标题翻译：优化微芯片及相关方法
公开(公告)号：US20070106964A1
公开(公告)日：2007-05-10
申请号：US11445026
申请日：2006-06-01
申请人： James Meindl , Deepak Sekar
发明人： James Meindl , Deepak Sekar
IPC分类号： G06F17/50 , H01L25/00
CPC分类号： G06F17/505 , G06F2217/78 , H01L2924/0002 , H01L2924/00
摘要： Various embodiments of an optimized microchip and methods of fabricating and operating the same are provided. One microchip embodiment, among others, comprises a repeater-type transistor located in a first path corresponding to a first path type, the repeater-type transistor having a parameter at a first design value, and a logic-type transistor located in the first path or a different path, each of the paths corresponding to the first path type, the logic-type transistor having the parameter at a second design value.
摘要翻译：提供优化的微芯片的各种实施例及其制造和操作方法。一个微芯片实施例尤其包括位于与第一路径类型对应的第一路径的中继器型晶体管，具有第一设计值的参数的中继器型晶体管和位于第一路径中的逻辑型晶体管或不同的路径，每个路径对应于第一路径类型，逻辑型晶体管具有第二设计值的参数。

5. 发明申请

US20060109015A1 Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication 失效
标题翻译：用于测试具有电和光输入/输出互连的芯片的探针模块，使用方法和制造方法
公开(公告)号：US20060109015A1
公开(公告)日：2006-05-25
申请号：US11216645
申请日：2005-08-31
申请人： Hiren Thacker , Oluwafemi Ogunsola , James Meindl
发明人： Hiren Thacker , Oluwafemi Ogunsola , James Meindl
IPC分类号： G01R31/02
CPC分类号： G01R31/311 , G01R1/07314 , G01R31/2889 , G02B6/12 , G02B6/12004 , G02B6/4214
摘要： Probe modules, methods of use of probe modules, and methods of preparing probe modules, are disclosed.
摘要翻译：公开了探针模块，探针模块的使用方法和制备探针模块的方法。

6. 发明申请

US20060209519A1 Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof 有权
公开(公告)号：US20060209519A1
公开(公告)日：2006-09-21
申请号：US11416686
申请日：2006-05-03
申请人： Muhannad Bakir , Kevin Martin , James Meindl
发明人： Muhannad Bakir , Kevin Martin , James Meindl
IPC分类号： H01R9/00
CPC分类号： G01R31/2863 , G01R1/0491 , G02B6/12002 , G02B6/42 , G02B6/43 , G02B2006/12107 , H01L23/49811 , H01L2224/81141 , H01L2224/81193 , H05K3/303 , H05K3/326 , H05K2203/167 , Y02P70/613
摘要： Devices having one or more of the following: an input/output (I/O) interconnect system, an optical I/O interconnect, an electrical I/O interconnect, a radio frequency I/O interconnect, are disclosed. A representative I/O interconnect system includes a first substrate and a second substrate. The first substrate includes a compliant pillar vertically extending from the first substrate. The compliant pillar is constructed a first material. The second substrate includes a compliant socket adapted to receive the compliant pillar. The compliant socket is constructed of a second material.

7. 发明申请

US20060104566A1 Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof 有权
标题翻译：微流体，光学和电输入输出互连，其制造方法及其使用方法
公开(公告)号：US20060104566A1
公开(公告)日：2006-05-18
申请号：US11261149
申请日：2005-10-28
申请人： Muhannad Bakir , James Meindl
发明人： Muhannad Bakir , James Meindl
IPC分类号： G02B6/12
CPC分类号： B81B7/0006 , B01J2219/0081 , B01L3/502715 , B01L2200/027 , B81B2201/058 , B81B2207/07 , G02B6/24
摘要： Input/output (I/O) interconnects, fluidic I/O interconnects, electrical, optical, and fluidic I/O interconnects, devices incorporating the I/O interconnects, systems incorporating the I/O interconnects, and methods of fabricating the I/O interconnects, devices, and systems, are described herein.
摘要翻译：输入/输出（I / O）互连，流体I / O互连，电气，光学和流体I / O互连，并入I / O互连的设备，并入I / O互连的系统，以及制造I / O互连，设备和系统。

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