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    • 4. 发明授权
    • Multiple step switched translation loop for power amplifier feedback control
    • 用于功率放大器反馈控制的多步切换平移环路
    • US06792282B1
    • 2004-09-14
    • US09666698
    • 2000-09-21
    • William J. DominoDmitriy RozenblitMorten DamgaardNooshin D. Vakilian
    • William J. DominoDmitriy RozenblitMorten DamgaardNooshin D. Vakilian
    • H04B102
    • H03G3/3047H03G2201/103H03G2201/202H03G2201/206H03G2201/307
    • A translation loop modulator and power amplifier in a phase and amplitude modulated transmission environment includes a translation loop having a phase locked loop and that is configured to receive a first modulated signal (PM) and that is also configured to provide a frequency specific modulated signal. The invention also includes a power amplifier configured to receive the frequency specific modulated signal, a variable gain element configured to provide a second modulated signal (AM) to the power amplifier and a switching element configured to receive a portion of an output of the translation loop and a portion of an output power of the power amplifier. The switching element is configured to apply the output portion of the translation loop to an input of the translation loop during a first time period and apply the detected output power portion of the power amplifier to the input of the translation loop during a second time period, thus allowing the phase locked loop in the translation loop to correct for any phase shift caused by the power amplifier.
    • 在相位和幅度调制传输环境中的平移环路调制器和功率放大器包括具有锁相环的平移环路,并且被配置为接收第一调制信号(PM),并且还被配置为提供频率特定调制信号。 本发明还包括被配置为接收频率特定调制信号的功率放大器,被配置为向功率放大器提供第二调制信号(AM)的可变增益元件和被配置为接收转换回路的输出的一部分的开关元件 和功率放大器的输出功率的一部分。 开关元件被配置为在第一时间段期间将平移环路的输出部分施加到平移环路的输入端,并且在第二时间周期期间将功率放大器的检测输出功率部分施加到平移环路的输入端, 从而允许平移环路中的锁相环校正由功率放大器引起的任何相移。
    • 6. 发明授权
    • Surface acoustic wave filter packaging
    • 表面声波滤波器包装
    • US06754471B1
    • 2004-06-22
    • US09455108
    • 1999-12-06
    • Nooshin D. Vakilian
    • Nooshin D. Vakilian
    • H04B146
    • H03H9/0542H01L2224/16225H03H9/059H03H9/1085
    • A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted. This air gap ensures proper operation of the surface acoustic wave filter. In addition, a passivation layer is deposited on the surface acoustic wave filter side of the surface acoustic wave filter before it is mounted in the “flip chip” configuration, thereby provided a degree of protection of the surface acoustic wave filter side of the surface acoustic wave filter.
    • 提供用于表面声波滤波器的封装的系统,使得表面声波滤波器能够与集成基板上的多个附加电子器件集成。 表面声波滤波器安装在“倒装芯片”结构中,使得表面声波滤波器的表面在表面声波滤波器和包含在集成基板上的其它电路的封装期间和之后能够被模制化合物保护 。 表面声波滤波器的封装方式大大降低了集成基板的成本和占用空间,因为表面声波滤波器的安装方式不需要常规使用的陶瓷封装 表面声波滤波器。 表面声波滤波器的表面声波滤波器侧与安装在其上的集成基板之间保持气隙。 该气隙确保表面声波滤波器的正常工作。 此外,在安装在“倒装芯片”构造之前,在表面声波滤波器的表面声波滤波器侧上沉积钝化层,从而提供表面声波滤波器侧的表面声波滤波器侧的保护程度 滤波器。
    • 7. 发明授权
    • Surface acoustic wave filter packaging
    • 表面声波滤波器包装
    • US07016655B2
    • 2006-03-21
    • US10860448
    • 2004-06-03
    • Nooshin D. Vakilian
    • Nooshin D. Vakilian
    • H04B1/46
    • H03H9/0542H01L2224/16225H03H9/059H03H9/1085
    • A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a “flip chip” configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted. This air gap ensures proper operation of the surface acoustic wave filter. In addition, a passivation layer is deposited on the surface acoustic wave filter side of the surface acoustic wave filter before it is mounted in the “flip chip” configuration, thereby provided a degree of protection of the surface acoustic wave filter side of the surface acoustic wave filter.
    • 提供用于表面声波滤波器的封装的系统,使得表面声波滤波器能够与集成基板上的多个附加电子器件集成。 表面声波滤波器安装在“倒装芯片”结构中,使得表面声波滤波器的表面在表面声波滤波器和包含在集成基板上的其它电路的封装期间和之后能够被模制化合物保护 。 表面声波滤波器的封装方式大大降低了集成基板的成本和占用空间,因为表面声波滤波器的安装方式不需要常规使用的陶瓷封装 表面声波滤波器。 表面声波滤波器的表面声波滤波器侧与安装在其上的集成基板之间保持气隙。 该气隙确保表面声波滤波器的正常工作。 此外,在安装在“倒装芯片”构造之前,在表面声波滤波器的表面声波滤波器侧上沉积钝化层,从而提供表面声波滤波器侧的表面声波滤波器侧的保护程度 滤波器。