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    • 2. 发明授权
    • Calibration of temperature control system for semiconductor processing chamber
    • 半导体处理室温度控制系统校准
    • US08047706B2
    • 2011-11-01
    • US12273440
    • 2008-11-18
    • Matthew G. GoodmanMark HawkinsRavinder AggarwalMichael GivensEric HillGregory Bartlett
    • Matthew G. GoodmanMark HawkinsRavinder AggarwalMichael GivensEric HillGregory Bartlett
    • G01K15/00
    • G01K15/00
    • Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.
    • 用于校准气相沉积室中的温度控制系统的方法和系统。 温度传感器感测半导体处理室内的温度并产生输出信号。 温度控制系统通过基于输出信号控制加热装置来控制室温度。 一种方法包括指示控制系统目标设定点温度,以及通过气相沉积工艺将一层材料沉积在腔室的表面上。 在沉积层时测量该层的性质的变化,已知随着层的厚度周期性变化的性质增加。 允许测量的特性循环变化一个或多个循环。 如果一个或多个循环的时间段与与设定点温度相关联的期望时间段之间存在差异,则基于该差异来调整温度控制系统。