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    • 1. 发明授权
    • Ultra fast temperature ramp up and down in a furnace using interleaving
shutters
    • 使用交错百叶窗在炉内上下高速升温
    • US6054684A
    • 2000-04-25
    • US964515
    • 1997-11-05
    • Michael F. PasC. Rinn CleavelinSylvia D. Pas
    • Michael F. PasC. Rinn CleavelinSylvia D. Pas
    • H01L21/22C30B31/12H01L21/324F27B5/14
    • C30B31/12
    • One embodiment of the instant invention is a process chamber for heating a semiconductor wafer, the process chamber comprising: heating elements (elements 104 of FIG. 2a) for providing heating energy; means for holding (means 112 of FIG. 2a) the semiconductor wafer; and shutters situated between the heating elements and the means for holding the semiconductor wafer, the shutters (shutters 108 of FIGS. 2a and 2b and shutters of FIGS. 2c and 2d for blocking the heating energy from getting to the semiconductor wafer when the shutters are in a closed position and for directing the heating energy to the semiconductor wafer when in an open position. Preferably, the shutters are comprised of: an outer surface which is coated with a material which reflects the heating energy back towards the heating elements when the shutters are in the closed position; an inner surface which faces the means for holding the semiconductor wafer when the shutters are in the dosed position; an axis which the shutters revolve around so as to open and close; and an insulating material situated between the inner and outer surfaces.
    • 本发明的一个实施例是用于加热半导体晶片的处理室,所述处理室包括:加热元件(图2a的元件104),用于提供加热能量; 用于保持(图2a的装置112)半导体晶片的装置; 和位于加热元件和用于保持半导体晶片的装置之间的快门,快门(图2a和2b的快门108和图2c和2d的快门,用于当快门为快门时阻止加热能量进入半导体晶片 在闭合位置,并且当处于打开位置时将加热能量引导到半导体晶片。优选地,快门由以下部件构成:外表面涂覆有当快门反射加热能量时朝向加热元件反射的材料 处于关闭位置;当快门处于计量位置时面对用于保持半导体晶片的装置的内表面;快门围绕着开启和关闭的轴线;以及绝缘材料,位于内部和 外表面。
    • 8. 发明授权
    • Method to improve SRAM performance and stability
    • 提高SRAM性能和稳定性的方法
    • US07189627B2
    • 2007-03-13
    • US10921532
    • 2004-08-19
    • Zhiqiang WuShaofeng YuC. Rinn Cleavelin
    • Zhiqiang WuShaofeng YuC. Rinn Cleavelin
    • H01L21/76
    • H01L27/1104G11C11/412H01L27/11
    • A technique is disclosed for increasing the width of a transistor (300) while the transistor itself may be scaled down. The transistor width (382) is increased by forming recesses (352) within shallow trench isolation (STI) regions (328) adjacent to the transistor (300). The recesses (352) provide an area that wraps around the transistor and thereby increases the width (382) of the transistor (300). This wraparound area provides additional space for dopant atom deposition, which facilitates a reduction in random dopant fluctuation (RDF). In this manner, transistors formed in accordance with one or more aspects of the present invention, may yield improved performance when incorporated into SRAM since the probability that such transistors will be more closely matched is increased.
    • 公开了一种用于增加晶体管(300)的宽度的技术,同时可以缩小晶体管本身。 通过在与晶体管(300)相邻的浅沟槽隔离(STI)区域(328)内形成凹槽(352)来增加晶体管宽度(382)。 凹部(352)提供围绕晶体管的区域,从而增加晶体管(300)的宽度(382)。 该环绕区域为掺杂剂原子沉积提供了额外的空间,这有助于随机掺杂剂波动(RDF)的减少。 以这种方式,根据本发明的一个或多个方面形成的晶体管可以在并入SRAM时产生改善的性能,因为这种晶体管将更加紧密匹配的可能性增加。
    • 9. 发明申请
    • METHOD FOR RESETTING A RESISTIVE CHANGE MEMORY ELEMENT
    • 复位电阻变化记忆元件的方法
    • US20110038195A1
    • 2011-02-17
    • US12618448
    • 2009-11-13
    • Darlene HamiltonC. Rinn Cleavelin
    • Darlene HamiltonC. Rinn Cleavelin
    • G11C11/00G11C7/06
    • G11C5/06B82Y10/00G11C5/147G11C11/5614G11C11/5678G11C11/5685G11C13/0004G11C13/0007G11C13/0009G11C13/0011G11C13/0061G11C13/0064G11C13/0069G11C13/0097G11C13/025G11C2013/0076G11C2013/0092G11C2213/71G11C2213/79
    • A method of resetting a resistive change memory element is disclosed. The method comprises performing a series of programming operations—for example, a programming pulse of a predetermined voltage level and pulse width—on a resistive change memory element in order to incrementally increase the resistance of the memory element above some predefined threshold. Prior to each programming operation, the resistive state of the memory element is measured and used to determine the parameters used in that programming operation. If this measured resistance value is above a first threshold value, the memory element is determined to already be in a reset state and no further programming operation is performed. If this measured resistance value is below a second threshold value, this second threshold value being less than the first threshold value, a first set of programming parameters are used within the programming operation. If this initial value is above the second threshold value but below the first threshold value, a second set of programming parameters are used within the programming operation.
    • 公开了一种复位电阻变化存储元件的方法。 该方法包括执行一系列编程操作 - 例如,电阻变化存储器元件上的预定电压电平和脉冲宽度的编程脉冲,以便将存储器元件的电阻递增地增加到高于某个预定阈值。 在每个编程操作之前,测量存储元件的电阻状态并用于确定在该编程操作中使用的参数。 如果该测量的电阻值高于第一阈值,则确定存储元件已经处于复位状态,并且不执行进一步的编程操作。 如果该测量的电阻值低于第二阈值,该第二阈值小于第一阈值,则在编程操作中使用第一组编程参数。 如果该初始值高于第二阈值但低于第一阈值,则在编程操作中使用第二组编程参数。
    • 10. 发明授权
    • System and method for circuit repair
    • 电路修复的系统和方法
    • US06205239B1
    • 2001-03-20
    • US08866553
    • 1997-05-30
    • YouLing LinA. Kathleen HennesseyRamakrishna PattikondaRajasekar ReddyVeera S. KhajaC. Rinn Cleavelin
    • YouLing LinA. Kathleen HennesseyRamakrishna PattikondaRajasekar ReddyVeera S. KhajaC. Rinn Cleavelin
    • G06K900
    • G06T7/001G01N21/95607G06T7/0002G06T2207/10056G06T2207/30148H01L22/20H01L2924/014
    • A system and method for repairing a defect on a manufactured object, which may be a semiconductor wafer, uses a computer and a repair tool. The method includes placing the manufactured device on a moveable stage; capturing and preparing a digital-pixel-based representation of the image; symbolically decomposing the digital-pixel-based representation of an image to create a primitive-based representation of the image; analyzing the primitive-based representation of the image to detect and locate an anomaly; isolating primitives associated with the anomaly; comparing the isolated primitives associated with the anomaly with primitives in a knowledgebase to locate a set of primitives in the knowledgebase that are most like the isolated primitives associated with the anomaly; assigning a defect-type label associated with the set of primitives in the knowledge base that was most similar to the isolated primitives associated with the anomaly; and using a repair tool to repair the defect based on defect-type label for the anomaly.
    • 用于修复可以是半导体晶片的制造对象上的缺陷的系统和方法使用计算机和修理工具。 该方法包括将制造的装置放置在可移动台上; 捕获和准备图像的基于数字像素的表示; 象征性地分解图像的基于数字像素的表示以创建图像的基于图元的表示; 分析图像的基于图元的表示以检测和定位异常; 隔离与异常相关的原语; 将与异常相关联的孤立原语与知识库中的原语进行比较,以定位知识库中最像是与异常相关联的孤立原语的一组原语; 分配与所述知识库中与所述异常相关联的所述孤立原语最相似的所述原始集合相关联的缺陷类型标签; 并使用维修工具根据异常的缺陷型标签修复缺陷。