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1. 发明授权

US5560752A Process for activation of metal hydrides 失效
标题翻译：金属氢化物的活化方法
公开(公告)号：US5560752A
公开(公告)日：1996-10-01
申请号：US292556
申请日：1994-08-18
申请人： Michael E. Badding , Mark T. McCormack , Donald W. Murphy , Brijesh Vyas
发明人： Michael E. Badding , Mark T. McCormack , Donald W. Murphy , Brijesh Vyas
IPC分类号： C01B3/00 , C22C19/00 , C22C27/06 , H01M4/24 , H01M4/26 , H01M4/38 , H01M6/00 , C01B6/00 , C22C1/00
CPC分类号： H01M4/242 , H01M4/26 , H01M4/383 , Y02E60/327 , Y10S420/90 , Y10T29/49108
摘要： Metals useful in the formation of hydrides for applications such as batteries are advantageously activated by hydriding/dehydriding process. This process involves repeatedly stepping the potential of metal/metal hydride electrodes in electrochemical cells. The process activates hydrogen-storing materials that are difficult to activate by conventional means.
摘要翻译：用于形成用于诸如电池的应用的氢化物的金属有利地通过氢化/脱氢方法活化。该过程涉及重复地步进电化学电池中金属/金属氢化物电极的电位。该方法激活难以通过常规方法活化的储氢材料。

2. 发明授权

US5549977A Article comprising magnetoresistive material 失效
标题翻译：文章包括磁阻材料
公开(公告)号：US5549977A
公开(公告)日：1996-08-27
申请号：US228168
申请日：1994-04-15
申请人： Sungho Jin , Mark T. McCormack , Ramamoorthy Ramesh
发明人： Sungho Jin , Mark T. McCormack , Ramamoorthy Ramesh
IPC分类号： G01R33/09 , H01L43/08 , H01L43/10 , H01L43/12 , G11B5/66 , B05D5/12 , C23C14/00
CPC分类号： H01L43/10 , Y10S428/90 , Y10S428/928 , Y10T428/1107
摘要： A magnetoresistance ratio of 200% (absolute value) or more at room temperature in a field of 6T can be achieved in a layer of material of nominal composition XMnO.sub.y (X is La and at least one of Ca, Sr and Ba, y in the range 2-3.5), if, after formation of the layer, the layer is heat treated in an oxygen-rich (O.sub.2 partial pressure greater than that of air) atmosphere, typically in flowing O.sub.2. The temperature and duration of the heat treatment are in the range 300.degree.-850.degree.C. and 10 minutes-12 hours, and are selected to result in the desired ratio of 200% or more.
摘要翻译：在标称组成XMnOy（X是La）和Ca，Sr和Ba，y中的至少一个的材料层中，可以在6T的场中在室温下达到200％（绝对值）或更高的磁阻比范围2-3.5），如果在层的形成之后，该层在富氧（O 2分压大于空气的气氛）气氛中，通常在流动的O 2中进行热处理。热处理的温度和持续时间在300℃-850℃和10分钟-12小时的范围内，并且选择达到所需比例为200％以上。

3. 发明授权

US5509815A Solder medium for circuit interconnection 失效
标题翻译：焊接介质用于电路互连
公开(公告)号：US5509815A
公开(公告)日：1996-04-23
申请号：US255687
申请日：1994-06-08
申请人： Sungho Jin , Mark T. McCormack
发明人： Sungho Jin , Mark T. McCormack
IPC分类号： B23K35/02 , B23K35/14 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： B23K35/0222 , H05K3/3436 , B23K35/0227 , B23K35/0244 , H01L2924/0002 , H05K2201/0215 , H05K2201/083 , H05K2201/09945 , H05K2201/10378 , H05K2201/10424 , H05K2203/0235 , H05K2203/0769 , H05K2203/104 , Y02P70/613
摘要： Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
摘要翻译：具有至少两个部件的电子设备配线接触焊盘在配合焊盘之间设置有高纵横比焊接点。这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与直径的长宽比的高纵横比。或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

4. 发明授权

US5461308A Magnetoresistive current sensor having high sensitivity 失效
标题翻译：具有高灵敏度的磁阻电流传感器
公开(公告)号：US5461308A
公开(公告)日：1995-10-24
申请号：US176366
申请日：1993-12-30
申请人： Sungho Jin , Mark T. McCormack , Apurba Roy , James C. Wadlington
发明人： Sungho Jin , Mark T. McCormack , Apurba Roy , James C. Wadlington
IPC分类号： G01R15/20 , H01L43/08 , G01R33/00
CPC分类号： G01R15/205
摘要： The present inventors have discovered that a compact, highly sensitive current sensor can be made for any inductive component having an air gap in its magnetic path by disposing a layer of magnetoresistive material in the path of the fringing magnetic field. In the preferred embodiment, a thin magnetoresistive film of La.sub.w Ca.sub.x Mn.sub.y O.sub.z on a LaAlO.sub.3 /Al.sub.2 O.sub.3 substrate provides a high sensitivity in the range of 1-100 mV/ampere of DC current in the inductive component. The current sensor consumes a very small amount of power and provides the desirable electrical isolation between the sensor and the active device circuit.
摘要翻译：本发明人已经发现，通过在边缘磁场的路径中设置一层磁阻材料，可以为任何在其磁路中具有气隙的电感元件制造紧凑，高灵敏度的电流传感器。在优选实施例中，LaAlO 3 / Al 2 O 3衬底上的LawCaxMnyOz的薄磁阻膜在电感元件中提供1-100mV /安培的DC电流的高灵敏度。电流传感器消耗非常少量的功率并且在传感器和有源器件电路之间提供期望的电隔离。

5. 发明授权

US5538800A Magnetoresistive oxide material and articles comprising the material 失效
标题翻译：磁阻氧化物材料和包含该材料的制品
公开(公告)号：US5538800A
公开(公告)日：1996-07-23
申请号：US315160
申请日：1994-09-29
申请人： Sungho Jin , Mark T. McCormack , Henry M. O'Bryan, Jr. , Warren W. Rhodes , Thomas H. Tiefel
发明人： Sungho Jin , Mark T. McCormack , Henry M. O'Bryan, Jr. , Warren W. Rhodes , Thomas H. Tiefel
IPC分类号： G01R33/09 , C01G45/00 , G11B5/39 , H01L43/08 , H01L43/10 , B32B9/00
CPC分类号： H01L43/10 , Y10S428/90 , Y10T428/1107
摘要： Materials of composition La.sub.v X.sub.w M.sub.y Mn.sub.z O.sub.x, with x selected from Mg, Sc, Al, Zn, Cd, In and the rare earths that have an ionic radius smaller than that of La, with M selected from Ca, Sr, Ba and Pb, and with v, w, y, z and x in the ranges 0.45-0.85, 0.01-0.20, 0.20-0.45, 0.7-1.3 and 2.5-3.5, respectively, can have substantially improved magnetoresistance (MR) ratios, as compared to the corresponding X-free comparison material. In particular, the novel materials in polycrystalline (or non-epitaxial thin film) form can have relatively large MR ratios. For instance, polycrystalline La.sub.0.60 Y.sub.0.07 Ca.sub.0.33 MnO.sub.x had a peak MR ratio in excess of 10,000% (in absolute value) in a field of 6 T.
摘要翻译：组成材料LavXwMyMnzOx，x选自Mg，Sc，Al，Zn，Cd，In以及离子半径小于La的稀土，M选自Ca，Sr，Ba和Pb，以及v 分别为0.45-0.85,0.01-0.20,0.20-0.45,0.7-1.3和2.5-3.5的范围内的w，y，z和x可以具有基本上改善的磁阻（MR）比，免费比较材料。特别地，多晶（或非外延薄膜）形式的新型材料可以具有相对大的MR比。例如，多晶La0.60Y0.07Ca0.33MnOx在6T的场中具有超过10,000％（绝对值）的峰值MR比。

6. 发明授权

US5450372A Magnetoresistive microphone and acoustic sensing devices 失效
标题翻译：磁阻麦克风和声学传感装置
公开(公告)号：US5450372A
公开(公告)日：1995-09-12
申请号：US220318
申请日：1994-03-30
申请人： Sungho Jin , Larry A. Marcus , Mark T. McCormack
发明人： Sungho Jin , Larry A. Marcus , Mark T. McCormack
IPC分类号： H04R19/04 , G01H11/02 , H04R21/02 , H04R23/00
CPC分类号： H04R21/02 , G01H11/02
摘要： In accordance with the invention, a new type of microphone utilizes a magnetoresistive sensing element. Specifically, acoustical energy causes vibrations between a magnetoresistive element and a magnet, producing a variation in the resistance which can be used to convert an acoustical signal into a corresponding electrical signal.
摘要翻译：根据本发明，新型麦克风采用磁阻感测元件。具体地说，声能引起磁阻元件和磁体之间的振动，产生电阻的变化，可用于将声信号转换成对应的电信号。

7. 发明授权

US06859587B2 Method and apparatus for wafer level testing of integrated optical waveguide circuits 失效
标题翻译：集成光波导电路的晶圆级测试方法和装置
公开(公告)号：US06859587B2
公开(公告)日：2005-02-22
申请号：US10041038
申请日：2001-12-28
申请人： Dmitri E. Nikonov , Mark T. McCormack
发明人： Dmitri E. Nikonov , Mark T. McCormack
IPC分类号： G01M11/00 , G02B6/30
CPC分类号： G01M11/37
摘要： A method of testing a planar lightwave circuit is achieved by coupling an optical probe to the planar lightwave circuit. In one embodiment, a second probe is used in combination with the first probe to test the planar lightwave circuit by sending and receiving a light beam through the planar lightwave circuit.
摘要翻译：通过将光学探针耦合到平面光波电路来实现测试平面光波电路的方法。在一个实施例中，第二探针与第一探头组合使用，以通过发射和接收通过平面光波电路的光束来测试平面光波电路。

8. 发明授权

US5618189A Solder medium for circuit interconnection 失效
标题翻译：焊接介质用于电路互连
公开(公告)号：US5618189A
公开(公告)日：1997-04-08
申请号：US588193
申请日：1996-01-18
申请人： Sungho Jin , Mark T. McCormack
发明人： Sungho Jin , Mark T. McCormack
IPC分类号： B23K35/02 , B23K35/14 , H05K3/34 , H05K3/36 , H01R9/09
CPC分类号： B23K35/0222 , H05K3/3436 , B23K35/0227 , B23K35/0244 , H01L2924/0002 , H05K2201/0215 , H05K2201/083 , H05K2201/09945 , H05K2201/10378 , H05K2201/10424 , H05K2203/0235 , H05K2203/0769 , H05K2203/104 , Y02P70/613
摘要： Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
摘要翻译：具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与其直径的长宽比的高纵横比。或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

9. 发明授权

US5591037A Method for interconnecting an electronic device using a removable solder carrying medium 失效
标题翻译：使用可移除的载体载体互连电子设备的方法
公开(公告)号：US5591037A
公开(公告)日：1997-01-07
申请号：US251547
申请日：1994-05-31
申请人： Sungho Jin , Mark T. McCormack
发明人： Sungho Jin , Mark T. McCormack
IPC分类号： B23K1/20 , B23K3/06 , H01L21/48 , H01L21/60 , H01L21/68 , H05K3/34
CPC分类号： H01L21/6835 , H01L21/4853 , H01L24/81 , H05K3/3484 , H01L2224/11003 , H01L2224/111 , H01L2224/11332 , H01L2224/11334 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15787 , H05K2201/0218 , H05K2201/083 , H05K2201/10424 , H05K2203/0425 , H05K2203/0528 , H05K2203/0769 , H05K2203/104
摘要： In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.
摘要翻译：根据本发明，具有一个或多个接触垫的电子器件被粘附到可移动的载体片上的可转移焊料颗粒的阵列上。通过溶解除去载体，留下焊料选择性地粘附到接触垫上。在优选的实施方案中，焊料载体介质是水溶性的，焊料颗粒包括焊料涂覆的磁性颗粒。在介质干燥或固化时应用磁性材料，产生规则的焊料涂覆颗粒阵列。使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。

10. 发明授权

US5538686A Article comprising a PB-free solder having improved mechanical properties 失效
标题翻译：包含具有改善的机械性能的无PB焊料的制品
公开(公告)号：US5538686A
公开(公告)日：1996-07-23
申请号：US278673
申请日：1994-06-27
申请人： Ho S. Chen , Sungho Jin , Mark T. McCormack
发明人： Ho S. Chen , Sungho Jin , Mark T. McCormack
IPC分类号： B23K35/26 , C22C13/00 , H01L21/60 , H05K3/34
CPC分类号： C22C13/00 , B23K35/262
摘要： Pb-free solder alloys based on the Sn-In-Zn system (exemplarily 86:5:9 weight %) are disclosed. Compositions can have a melting temperature in the range 183.degree. C..+-.10.degree. C. and thus can be readily substituted for conventional 40 Pb-60 Sn solder. The novel compositions also can possess superior mechanical properties, compared to the 40/60 Pb-Sn composition, and readily wets copper. Bi and/or Sb may be added to the Sn-In-Zn base to reduce the tendency for the formation of lower temperature phases.
摘要翻译：公开了基于Sn-In-Zn体系的无铅焊料合金（示例性为86:5:9重量％）。组合物可以具有在183℃±10℃的范围内的熔融温度，因此可以容易地代替传统的40Pb-60Sn焊料。与40/60 Pb-Sn组合物相比，新型组合物也具有优异的机械性能，并且易于润湿铜。可以向Sn-In-Zn基中添加Bi和/或Sb以降低形成低温相的倾向。

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