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    • 8. 发明授权
    • Power semiconductor device having high breakdown voltage and method for fabricating the same
    • 具有高击穿电压的功率半导体器件及其制造方法
    • US06486512B2
    • 2002-11-26
    • US09790815
    • 2001-02-23
    • Chang-ki JeonJong-jib KimYoung-suk ChoiChang-seong ChoiMin-whan Kim
    • Chang-ki JeonJong-jib KimYoung-suk ChoiChang-seong ChoiMin-whan Kim
    • H01L2976
    • H01L29/0692H01L29/0696H01L29/7835
    • A power semiconductor device and a method for fabricating the same are provided. The power semiconductor device includes a source structure having a projected portion with a tip-shaped end portion on its center and formed so as to surround a predetermined region of right and left and upper portions of the projected portion. Two drain structures are formed in a predetermined region surrounded by the source structure. Extended drain structures are formed around the drain structures and the extended drain structures function as a channel with a field effect channel between sides of the projected portion of the source structure. Accordingly, since there are no drain structures on the tip of the projected portion of the source structure, although a radius of curvature of the tip of the projected portion is small, a decrease in a breakdown voltage of a device due to the small radius of curvature of the tip of the projected portion can be suppressed. As a result, a power semiconductor device having a small radius of curvature of the source structure and a high breakdown voltage can be provided.
    • 提供了功率半导体器件及其制造方法。 功率半导体器件包括源结构,其具有在其中心具有尖端形状的端部的突出部分并且形成为围绕突出部分的左右上部的预定区域。 在由源结构包围的预定区域中形成两个漏极结构。 在漏极结构周围形成扩展的漏极结构,并且延伸的漏极结构用作具有源结构的突出部分的侧面之间的场效应沟道的沟道。 因此,由于在源极结构的突出部分的尖端上没有漏极结构,尽管突出部分的尖端的曲率半径小,但是由于半径小的部件,器件的击穿电压降低 可以抑制突出部分的尖端的弯曲。 结果,可以提供具有较小的源结构曲率半径和高击穿电压的功率半导体器件。