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1. 发明授权

US08368021B2 Method for an IR-radiation—based temperature measurement and IR-radiation—based temperature measuring device 有权
标题翻译：用于基于IR辐射的温度测量和基于IR辐射的温度测量装置的方法
公开(公告)号：US08368021B2
公开(公告)日：2013-02-05
申请号：US13073147
申请日：2011-03-28
申请人： Martin Stratmann , Sabine Hinkel , Daniel Auer , Patrick Zahn , Andreas Messerschmid
发明人： Martin Stratmann , Sabine Hinkel , Daniel Auer , Patrick Zahn , Andreas Messerschmid
IPC分类号： G02F1/01
CPC分类号： G01J5/522 , G01J5/02 , G01J5/025 , G01J5/0265 , G01J5/08 , G01J5/0859 , G01J5/089 , G01J2005/0074 , G01J2005/0077
摘要： In a temperature measuring device (1) an IR-radiation detector (2) and a reference element (3) are provided, connected to a surface (6) of an object (7) in a heat-conducting fashion, with a first area (4) with high emissivity and a second area (5) with high reflectivity formed at the reference element (3), and the IR-radiation detector (2) is equipped for a separate detection of IR-radiation (9, 10, 11) from the first and second areas (4, 5) and a surface area (12) of the object (7). A computer (13) in the IR-radiation detector (2) is equipped to deduct a temperature measurement for the object (7), corrected for emissions and reflections from the detected IR-radiations (9, 10, 11).
摘要翻译：在温度测量装置（1）中，设置有IR辐射检测器（2）和参考元件（3），其以导热方式连接到物体（7）的表面（6），第一区域（4）具有高发射率和在参考元件（3）处形成的具有高反射率的第二区域（5），并且IR辐射检测器（2）被配备用于单独检测IR辐射（9,10,11 ）从物体（7）的第一和第二区域（4,5）和表面区域（12）移动。 IR辐射检测器（2）中的计算机（13）被配备为从检测到的IR辐射（9,10,11）中校正发射和反射的物体（7）的温度测量值。

2. 发明申请

US20110235918A1 METHOD FOR AN IR-RADIATION -- BASED TEMPERATURE MEASUREMENT AND IR-RADIATION -- BASED TEMPERATURE MEASURING DEVICE 有权
标题翻译：基于红外辐射的温度测量和基于红外辐射的温度测量装置的方法
公开(公告)号：US20110235918A1
公开(公告)日：2011-09-29
申请号：US13073147
申请日：2011-03-28
申请人： Martin Stratmann , Sabine Hinkel , Daniel Auer , Patrick Zahn , Andreas Messerschmid
发明人： Martin Stratmann , Sabine Hinkel , Daniel Auer , Patrick Zahn , Andreas Messerschmid
IPC分类号： G06K9/46 , G01J5/00 , H01L31/00 , G01K7/00
CPC分类号： G01J5/522 , G01J5/02 , G01J5/025 , G01J5/0265 , G01J5/08 , G01J5/0859 , G01J5/089 , G01J2005/0074 , G01J2005/0077
摘要： In a temperature measuring device (1) an IR-radiation detector (2) and a reference element (3) are provided, connected to a surface (6) of an object (7) in a heat-conducting fashion, with a first area (4) with high emissivity and a second area (5) with high reflectivity formed at the reference element (3), and the IR-radiation detector (2) is equipped for a separate detection of IR-radiation (9, 10, 11) from the first and second areas (4, 5) and a surface area (12) of the object (7). A computer (13) in the IR-radiation detector (2) is equipped to deduct a temperature measurement for the object (7), corrected for emissions and reflections from the detected IR-radiations (9, 10, 11).
摘要翻译：在温度测量装置（1）中，设置有IR辐射检测器（2）和参考元件（3），其以导热方式连接到物体（7）的表面（6），第一区域（4）具有高发射率和在参考元件（3）处形成的具有高反射率的第二区域（5），并且IR辐射检测器（2）被配备用于单独检测IR辐射（9,10,11 ）从物体（7）的第一和第二区域（4,5）和表面区域（12）移动。 IR辐射检测器（2）中的计算机（13）被配备为从检测到的IR辐射（9,10,11）中校正发射和反射的物体（7）的温度测量值。

3. 发明授权

US09252140B2 Semiconductor chip and semiconductor arrangement 有权
标题翻译：半导体芯片和半导体布置
公开(公告)号：US09252140B2
公开(公告)日：2016-02-02
申请号：US13427344
申请日：2012-03-22
申请人： Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
发明人： Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
IPC分类号： H01L27/088 , H01L29/66 , H01L21/70 , H01L29/06 , H01L23/34 , H01L27/02 , H01L23/367 , B60R21/017 , H01L27/06
CPC分类号： H01L27/0296 , B60R21/017 , H01L23/367 , H01L27/0211 , H01L27/0629 , H01L27/088 , H01L2924/0002 , H01L2924/00
摘要： One aspect of the invention relates to a semiconductor chip with a semiconductor body. The semiconductor body has an inner region and a ring-shaped outer region. An electronic structure is monolithically integrated in the inner region and has a controllable first semiconductor component with a first load path and a first control input for controlling the first load path. Further, a ring-shaped second electronic component is monolithically integrated in the outer region and surrounds the inner region. Moreover, the second electronic component has a second load path that is electrically not connected in parallel to the first load path.
摘要翻译：本发明的一个方面涉及具有半导体本体的半导体芯片。半导体本体具有内部区域和环形外部区域。电子结构单片集成在内部区域中并且具有可控制的第一半导体部件，具有第一负载路径和用于控制第一负载路径的第一控制输入。此外，环状的第二电子部件被整体地集成在外部区域中并且围绕内部区域。此外，第二电子部件具有与第一负载路径并联电连接的第二负载路径。

4. 发明授权

US09127735B2 Friction brake 有权
标题翻译：摩擦刹车
公开(公告)号：US09127735B2
公开(公告)日：2015-09-08
申请号：US13321454
申请日：2010-05-10
申请人： Michael Putz , Daniel Auer
发明人： Michael Putz , Daniel Auer
IPC分类号： F16D55/22 , F16D65/66 , F16D65/18 , F16D125/26 , F16D125/32 , F16D127/10
CPC分类号： F16D65/66 , F16D65/18 , F16D2125/26 , F16D2125/32 , F16D2127/10
摘要： A friction brake including a brake part, a friction lining, a friction surface, and a pressing device, arranged on the brake part, that is structured and arranged to press the friction lining against the friction surface. A holding part is located on the pressing device so that the friction lining rests against the holding part. An actuating part is located on the pressing device and rotatably mounted on the brake part and an actuator is structured and arranged to pivot the actuating part. A pin is rotatably mounted in the holding part and being arranged on the actuating part, and a rotational axis of the pin is eccentrically arranged with respect to a rotational axis of the actuating part.
摘要翻译：一种摩擦制动器，包括布置在制动部分上的制动部分，摩擦衬片，摩擦表面和加压装置，其被构造和布置成将摩擦衬垫压靠在摩擦表面上。保持部位于按压装置上，使得摩擦衬垫抵靠保持部。致动部件位于加压装置上并可旋转地安装在制动部件上，致动器被构造和布置成枢转致动部件。销可旋转地安装在保持部分中并且布置在致动部件上，并且销的旋转轴线相对于致动部件的旋转轴线偏心地布置。

5. 发明申请

US20130249018A1 Semiconductor Chip and Semiconductor Arrangement 有权
标题翻译：半导体芯片和半导体布置
公开(公告)号：US20130249018A1
公开(公告)日：2013-09-26
申请号：US13427344
申请日：2012-03-22
申请人： Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
发明人： Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
IPC分类号： H01L27/088 , H01L27/06
CPC分类号： H01L27/0296 , B60R21/017 , H01L23/367 , H01L27/0211 , H01L27/0629 , H01L27/088 , H01L2924/0002 , H01L2924/00
摘要： One aspect of the invention relates to a semiconductor chip with a semiconductor body. The semiconductor body has an inner region and a ring-shaped outer region. An electronic structure is monolithically integrated in the inner region and has a controllable first semiconductor component with a first load path and a first control input for controlling the first load path. Further, a ring-shaped second electronic component is monolithically integrated in the outer region and surrounds the inner region. Moreover, the second electronic component has a second load path that is electrically not connected in parallel to the first load path.
摘要翻译：本发明的一个方面涉及具有半导体本体的半导体芯片。半导体本体具有内部区域和环形外部区域。电子结构单片集成在内部区域中并且具有可控制的第一半导体部件，具有第一负载路径和用于控制第一负载路径的第一控制输入。此外，环状的第二电子部件被整体地集成在外部区域中并且围绕内部区域。此外，第二电子部件具有与第一负载路径并联电连接的第二负载路径。

6. 发明申请

US20120168264A1 FRICTION BRAKE 有权
标题翻译：摩擦刹车
公开(公告)号：US20120168264A1
公开(公告)日：2012-07-05
申请号：US13321454
申请日：2010-05-10
申请人： Michael Putz , Daniel Auer
发明人： Michael Putz , Daniel Auer
IPC分类号： B60T1/06 , F16D55/22 , F16D65/38
CPC分类号： F16D65/66 , F16D65/18 , F16D2125/26 , F16D2125/32 , F16D2127/10
摘要： A friction brake including a brake part, a friction lining, a friction surface, and a pressing device, arranged on the brake part, that is structured and arranged to press the friction lining against the friction surface. A holding part is located on the pressing device so that the friction lining rests against the holding part. An actuating part is located on the pressing device and rotatably mounted on the brake part and an actuator is structured and arranged to pivot the actuating part. A pin is rotatably mounted in the holding part and being arranged on the actuating part, and a rotational axis of the pin is eccentrically arranged with respect to a rotational axis of the actuating part.
摘要翻译：一种摩擦制动器，包括布置在制动部分上的制动部分，摩擦衬片，摩擦表面和加压装置，其被构造和布置成将摩擦衬垫压靠在摩擦表面上。保持部位于按压装置上，使得摩擦衬垫抵靠保持部。致动部件位于加压装置上并可旋转地安装在制动部件上，致动器被构造和布置成枢转致动部件。销可旋转地安装在保持部分中并且布置在致动部件上，并且销的旋转轴线相对于致动部件的旋转轴线偏心地布置。

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