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1. 发明授权

US06713719B1 Method and device for laser drilling laminates 失效
标题翻译：激光钻孔层压板的方法和装置
公开(公告)号：US06713719B1
公开(公告)日：2004-03-30
申请号：US10089301
申请日：2002-03-29
申请人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
发明人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , B23K26/40 , B23K2103/16 , B23K2103/30 , B23K2103/50 , H05K3/0055 , H05K2201/0112 , H05K2203/0195
摘要： A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width
摘要翻译：用于层压板的激光钻孔的方法和装置包括使用倍频Nd钒酸盐激光器。激光器包括以下参数：金属层的脉冲宽度<40ns，脉冲频率> = 30kHz，介电层的脉冲宽度> 20kHz，波长= 532nmn。这种激光器用于具有至少一个金属层和至少一个包括有机材料的介电层的层压板的激光钻孔。

2. 发明授权

US06861008B1 Method and device for laser drilling organic materials 失效
标题翻译：激光钻孔有机材料的方法和装置
公开(公告)号：US06861008B1
公开(公告)日：2005-03-01
申请号：US10089308
申请日：2000-09-29
申请人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
发明人： Hubert De Steur , Marcel Heerman , Jozef Van Puymbroeck
IPC分类号： B23K26/18 , B23K26/402 , B23K101/42 , H01S3/00 , H05K3/00 , C03C15/00
CPC分类号： H05K3/0032 , B23K2103/30 , B23K2103/50 , H05K2201/0112
摘要： For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: pulse width
摘要翻译：对于有机材料的激光钻孔，特别是在电介质层中制造盲孔，使用具有以下参数的倍频Nd-钒酸盐激光器：

3. 发明授权

US06610960B2 Method for drilling micro-holes with a laser beam 失效
公开(公告)号：US06610960B2
公开(公告)日：2003-08-26
申请号：US10079895
申请日：2002-02-22
申请人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Sébastian Edmé , Marcel Heerman , Eddy Roelants
IPC分类号： B23K2600
CPC分类号： H05K3/0038 , H05K3/0035
摘要： To drill micro-holes in a multi-layer substrate having a first metal layer and at least one second metal layer, and having a dielectric layer arranged between two metal layers, use is made of a solid-state laser. The beam of the laser, in a first operation, ablates the first metal layer and, in a second operation, ablates the dielectric layer down to the second metal layer. In the first operation, the laser beam is set to a repetition frequency of at least 15 kHz, focused onto the first metal layer and moved in a circle corresponding to the diameter of the desired hole, in such a number of passes until this metal layer is cut through. Then, in the second operation, the laser beam is set to a preferably lower repetition frequency, directed out of focus onto the dielectric layer exposed in the hole and moved, with a circumferential velocity which is higher compared with the first operation, in one or more concentric circles, until the dielectric layer is ablated in the hole region. The effective energy density in the second operation is selected, by setting the defocusing and the circumferential velocity, in such a way that the effective energy density lies below the threshold for ablation of the second metal layer.

4. 发明授权

US06518088B1 Polymer stud grid array 失效
标题翻译：聚合物螺柱网格阵列
公开(公告)号：US06518088B1
公开(公告)日：2003-02-11
申请号：US09677354
申请日：2000-10-02
申请人： Marcel Heerman , Joost Wille , Jozef Puymbroeck Van , Jean Roggen , Eric Beyne , Rita Hoof Van
发明人： Marcel Heerman , Joost Wille , Jozef Puymbroeck Van , Jean Roggen , Eric Beyne , Rita Hoof Van
IPC分类号： H01L2144
CPC分类号： H01L24/81 , B29L2031/3493 , H01L23/13 , H01L23/49816 , H01L24/48 , H01L2224/05599 , H01L2224/13111 , H01L2224/1319 , H01L2224/16 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/81801 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01043 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3025 , H05K3/027 , H05K3/3431 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.
摘要翻译：结构形状具有由电绝缘聚合物构成的注射成型的三维基底，平面地布置在基底的下侧并在注射成型期间共同形成的聚合物柱，通过可焊接的端面形成在聚合物柱上的外部端子，至少在将外部端子连接到内部端子的基板的下侧形成有互连件，以及布置在基板上的至少一个芯片，并且其端子导电地连接到内部端子。结构形状适用于单芯片，多芯片组件和多芯片组件，并具有MID技术（模压互连器件）优点的球栅阵列的优点。聚合物螺柱的制造和金属化可以在MID技术中已经需要的方法步骤的框架中以最少的附加费用进行。

5. 发明授权

US5929516A Polymer stud grid array 失效
标题翻译：聚合物螺柱网格阵列
公开(公告)号：US5929516A
公开(公告)日：1999-07-27
申请号：US809030
申请日：1997-03-21
申请人： Marcel Heerman , Joost Wille , Jozef Van Puymbroeck , Jean Roggen , Eric Beyne , Rita Van Hoof
发明人： Marcel Heerman , Joost Wille , Jozef Van Puymbroeck , Jean Roggen , Eric Beyne , Rita Van Hoof
IPC分类号： H01L23/12 , H01L21/60 , H01L23/13 , H01L23/498 , H05K3/02 , H05K3/34 , H05K3/40 , H01L23/053
CPC分类号： H01L24/81 , H01L23/13 , H01L23/49816 , H05K3/4007 , B29L2031/3493 , H01L2224/1319 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/3025 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K3/027 , H05K3/3431
摘要： A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface, interconnections fashioned at least on the underside of the substrate that connect the outside terminals to inside terminals, and at least one chip arranged on the substrate and whose terminals are electrically conductively connected to the inside terminals. The structural shape is suitable for single, few or multi chip module and unites the advantages of a ball grid array with the advantages of MID technology (Molded Interconnection Devices). The manufacture and metallization of the polymer studs can take place with minimal additional outlay in the framework of the method steps already required in the MID technology.
摘要翻译： PCT No.PCT / EP95 / 03763 Sec。 371日期1997年3月21日 102（e）1997年3月21日PCT PCT 1995年9月22日PCT公布。出版物WO96 / 09646 日期1996年3月28日结构形状具有由电绝缘聚合物构成的注射成型的三维基材，平面地布置在基材的下侧上的聚合物柱，在注射成型期间共同形成，在聚合物螺柱上形成的外部端子由可焊接端面，至少在基板的下侧形成有将外部端子连接到内部端子的互连以及布置在基板上的至少一个芯片，并且其端子导电地连接到内部端子。结构形状适用于单芯片，多芯片组件和多芯片组件，并具有MID技术（模压互连器件）优点的球栅阵列的优点。聚合物螺柱的制造和金属化可以在MID技术中已经需要的方法步骤的框架中以最少的附加费用进行。

6. 发明授权

US06781215B2 Intermediate base for a semiconductor module and a semiconductor module using the intermediate base 失效
标题翻译：用于半导体模块的中间基底和使用该中间基底的半导体模块
公开(公告)号：US06781215B2
公开(公告)日：2004-08-24
申请号：US09997345
申请日：2001-11-29
申请人： Marcel Heerman
发明人： Marcel Heerman
IPC分类号： H01L2940
CPC分类号： H05K3/3436 , H01L23/13 , H01L23/49827 , H01L2224/92144 , H05K1/0271 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , Y02P70/613
摘要： An intermediate base supports a semiconductor module on a printed circuit board. The intermediate base has an upper face on which the semiconductor component is directly mounted with its component connecting elements facing the upper face. The base has through-holes which are incorporated from a lower face of the base body so that the component conducting elements of the semiconductor component are exposed. The through-holes are then at least partially coated with a metal layer, which also contacts the exposed portions of the component connecting elements. Each of the through-holes has at least a partially annular notch, so that each through-hole extends through a recessed stud, which is used to form an external connection for the module onto the printed circuit board.
摘要翻译：中间基座支撑印刷电路板上的半导体模块。中间基座具有上表面，半导体部件直接安装在其上，其部件连接元件面向上表面。底座具有从基体的下表面结合的通孔，使得半导体部件的部件导电元件露出。然后，通孔至少部分地涂覆有金属层，金属层也接触部件连接元件的暴露部分。每个通孔具有至少部分环形的凹口，使得每个通孔延伸穿过凹入的螺柱，其用于在模块上形成用于印刷电路板的外部连接。

7. 发明授权

US06639180B1 Method for describing a predetermined desired course with a beam consisting of particles or waves and use of this method 失效
标题翻译：用由粒子或波浪组成的光束描述预定的期望路线的方法和使用该方法
公开(公告)号：US06639180B1
公开(公告)日：2003-10-28
申请号：US10018381
申请日：2002-04-29
申请人： Hubert De Steur , Marcel Heerman
发明人： Hubert De Steur , Marcel Heerman
IPC分类号： B23K2600
CPC分类号： B23K26/08 , B23K26/082
摘要： The invention relates to a method for describing a predetermined desired course (1) with a beam of particles or waves, wherein a movable beam-directing device influences the direction of the beam, so that the latter describes an actual course (3, 4). The deviation of the actual course (3, 4) from the desired course due to inertia is minimized by specifying a corrected desired course (2), which describes diversions at the point of direction changes. The invention also relates to the use of this method for laser structuring or for writing guard plates or dial plates.
摘要翻译：本发明涉及一种用粒子或波束描述预定的期望路线（1）的方法，其中可移动的光束引导装置影响光束的方向，使得后者描述实际的光线（3,4）。通过指定校正的所需路线（2），实际路线（3,4）与惯性所期望的路线的偏差最小化，其中描述了方向改变点处的转向。本发明还涉及这种方法用于激光结构或书写防护板或表盘的用途。

8. 发明授权

US6130478A Polymer stud grid array for microwave circuit arrangements 失效
标题翻译：聚合物螺柱网格阵列用于微波电路布置
公开(公告)号：US6130478A
公开(公告)日：2000-10-10
申请号：US51777
申请日：1998-04-18
申请人： Ann Dumoulin , Marcel Heerman , Jean Roggen , Eric Beyne , Rita van Hoof
发明人： Ann Dumoulin , Marcel Heerman , Jean Roggen , Eric Beyne , Rita van Hoof
IPC分类号： H01L23/12 , H01L23/13 , H01L23/66 , H01L23/34
CPC分类号： H01L23/66 , H01L23/13 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , H01L2924/3025
摘要： A polymer stud grid array for microwave circuits is proposed which includes an injection-molded, three-dimensional substrate that is fabricated from an electrically insulating polymer. The substrate includes a plurality of polymer studs which are arranged over the underside of the substrate and which are integrally formed with the substrate during the injection-molding process. Signal connections are formed on the studs which include an end surface that is capable of being soldered. Potential connections are formed on at least one of the studs. The potential connection also includes an end surface that is capable of being soldered. Striplines are also constructed which connect the studs to the microwave circuit. Each stripline includes a first structured metal layer disposed on the underside of the substrate, a dielectric layer disposed on the first metal layer and a second structured metal layer disposed on top of the dielectric layer. The first metal layer is electrically connected to the potential connection. The second metal layer connects the signal connections to an associated internal connection which is connected to the microwave circuit.
摘要翻译： PCT No.PCT / EP96 / 04404 Sec。 371日期：1998年4月18日 102（e）1998年4月18日PCT PCT 1996年10月10日PCT公布。出版物WO97 / 15077 日期1997年4月24日提出了一种用于微波电路的聚合物螺柱网格阵列，其包括由电绝缘聚合物制成的注射成型的三维基底。衬底包括多个聚合物柱，其布置在衬底的下侧上，并且在注射成型过程中与衬底一体地形成。信号连接形成在螺柱上，其包括能够被焊接的端面。潜在的连接形成在至少一个螺柱上。电位连接还包括能够焊接的端面。还构造了将螺柱连接到微波电路的线。每个带状线包括设置在基板的下侧上的第一结构金属层，设置在第一金属层上的电介质层和设置在电介质层顶部上的第二结构化金属层。第一金属层电连接到电位连接。第二金属层将信号连接连接到与微波电路连接的相关内部连接。

9. 发明授权

US6122172A Polymer stud grid array 失效
标题翻译：聚合物螺柱网格阵列
公开(公告)号：US6122172A
公开(公告)日：2000-09-19
申请号：US051778
申请日：1998-04-16
申请人： Ann Dumoulin , Marcel Heerman , Jean Roggen , Eric Beyne , Rita van Hoof
发明人： Ann Dumoulin , Marcel Heerman , Jean Roggen , Eric Beyne , Rita van Hoof
IPC分类号： H01L23/12 , H01L23/13 , H01L23/433 , H05K7/20
CPC分类号： H01L23/13 , H01L23/4334 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15157 , H01L2924/15311 , H01L2924/1532 , H01L2924/16195 , H01L2924/19107 , H01L2924/3025
摘要： In order to achieve better dissipation of the heat losses, a polymer stud grid array in proposed havingan injection-molded, three-dimensional substrate (S) composed of an electrically insulating polymer,polymer studs (PS) which are arranged over the area on the underneath of the substrate (S) and are integrally formed during injection molding,external connections which are formed on the polymer studs (PS) by an end surface which can be soldered,conductor runs which are formed at least on the underneath of the substrate (S) and connect the external connections to internal connections,at least one heat sink (WL) which is partially coated during the injection molding of the substrate (S), and havingat least one chip or wiring element (VE) which is arranged on the heat sink (WL) and whose connections are electrically conductively connected to the internal connections.The new configuration is suitable in particular for power components or power modules in a polymer stud grid array package.
摘要翻译： PCT No.PCT / EP96 / 04407 Sec。 371日期：1998年4月16日 102（e）日期1998年4月16日PCT 1996年10月10日PCT公布。公开号WO97 / 15078 日期1997年04月24日为了实现更好的散热耗散，提出了一种聚合物螺柱网格阵列，其具有由电绝缘聚合物，聚合物螺柱（PS）组成的注射成型的三维基底（S）布置在基板（S）的下方的区域上并且在注射成型期间一体地形成，通过可焊接的端面形成在聚合物螺柱（PS）上的外部连接，至少形成在其上的导体在所述基板（S）的下方并且将所述外部连接件连接到内部连接件，至少一个散热器（WL），其在所述基板（S）的注射成型期间被部分地涂覆，并且具有至少一个芯片或布线元件 VE），其布置在散热器（WL）上，并且其连接导电地连接到内部连接。新配置特别适用于聚合物螺柱网格阵列封装中的功率部件或电源模块。

10. 发明授权

US06783688B2 Method and apparatus for structuring printed circuit boards 失效
标题翻译：用于构造印刷电路板的方法和装置
公开(公告)号：US06783688B2
公开(公告)日：2004-08-31
申请号：US10079896
申请日：2002-02-22
申请人： Hubert De Steur , Marcel Heerman , Eddy Roelants
发明人： Hubert De Steur , Marcel Heerman , Eddy Roelants
IPC分类号： H05K302
CPC分类号： H05K3/027 , H05K1/0263 , H05K1/0265 , H05K3/062 , H05K3/4644 , H05K2201/09727 , H05K2203/108
摘要： A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left. As a result of the removal of the rest of the etch resist, the surfaces of the conductor tracks which are produced are then exposed.
摘要翻译：可以使用方法和装置来对印刷电路板的为粗体导体结构提供的区域和为印刷电路板的相对精细的导体结构提供的区域进行图案化。在每种情况下，这可以通过激光加工完成。这两个区域首先涂覆有连续的金属化层并用蚀刻电阻器覆盖。通过暴露不需要的金属表面，通过具有较长波长的激光束预定义粗导体结构。此外，通过用相对较短的波长的激光束处理该抗蚀剂，该细导体结构也是预成形的。然后，在普通的蚀刻工艺中，金属层的所有暴露的表面区域被蚀刻掉，使得仅留下被剩余的抗蚀剂覆盖的粗略和细小的导体轨道结构。作为去除其余抗蚀剂的结果，然后暴露出所产生的导体迹线的表面。

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