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1. 发明授权

US09117631B2 Method of handling a substrate support structure in a lithography system 有权
标题翻译：在光刻系统中处理衬底支撑结构的方法
公开(公告)号：US09117631B2
公开(公告)日：2015-08-25
申请号：US13860620
申请日：2013-04-11
申请人： Mapper Lithography IP B.V.
发明人： Hendrik Jan De Jong
IPC分类号： H01J37/00 , H01J37/317 , B82Y10/00 , B82Y40/00 , H01L21/00
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , H01L21/00
摘要： Method of handling a substrate support structure for clamping a substrate on a surface thereof in a lithography system. First, a substrate support structure adapted to absorb energy from a substrate clamped thereon and a substrate are provided. The substrate is clamped on a surface of the substrate support structure. The substrate support structure with the substrate clamped thereon is transferred to a lithography apparatus, in which a lithographic process is performed on the substrate clamped onto the substrate support structure. The substrate support structure with the substrate clamped thereon is then removed from the lithography system. The substrate is removed from the substrate support structure, and the substrate support structure is conditioned by removing energy stored in the substrate support structure before providing a new substrate onto the substrate support structure.
摘要翻译：处理基板支撑结构以在基板的表面上夹持基板的方法。首先，提供适于从夹持在其上的基板和基板吸收能量的基板支撑结构。衬底被夹持在衬底支撑结构的表面上。将其上夹有衬底的衬底支撑结构转移到光刻设备，其中在夹持在衬底支撑结构上的衬底上进行光刻工艺。然后将其上夹有衬底的衬底支撑结构从光刻系统移除。从衬底支撑结构移除衬底，并且通过在将衬底提供到衬底支撑结构上之前去除存储在衬底支撑结构中的能量来调节衬底支撑结构。

2. 发明授权

US09575418B2 Apparatus for transferring a substrate in a lithography system 有权
标题翻译：用于在光刻系统中传送衬底的装置
公开(公告)号：US09575418B2
公开(公告)日：2017-02-21
申请号：US14850997
申请日：2015-09-11
申请人： Mapper Lithography IP B.V.
发明人： Vincent Sylvester Kuiper , Erwin Slot , Marcel Nicolaas Jacobus Van Kervinck , Guido De Boer , Hendrik Jan De Jong
IPC分类号： G03B27/60 , G03B27/58 , G03F7/20 , H01L21/67 , H01L21/677
CPC分类号： G03F7/70733 , G03F7/7075 , H01L21/67178 , H01L21/67225 , H01L21/67745
摘要： An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.
摘要翻译：一种用于将基板或基板支撑结构的目标（例如基板被夹紧到其上的基板）从基板传送系统传送到光刻系统的真空室的装置。该装置包括用于将目标物输入和离开真空室的装载锁定室。所述装载锁定室包括具有第一通道的第一壁，所述第一通道提供机器人空间与所述装载锁定室的内部之间的通路;第二壁，其具有提供在所述负载锁定室的内部与所述真空室之间的通路的第二通道，以及用于传送所述目标的多个处理机器人包括：可在所述机器人空间内移动的第一处理机器人，以接近所述基板传送系统和所述第一通道; 以及第二处理机器人，其能够在所述加载锁定室内移动以接近所述第一通道和所述第二通道。

3. 发明授权

US10078274B2 Method and arrangement for handling and processing substrates 有权
公开(公告)号：US10078274B2
公开(公告)日：2018-09-18
申请号：US15250977
申请日：2016-08-30
申请人： Mapper Lithography IP B.V.
发明人： Hendrik Jan De Jong , Marco Jan-Jaco Wieland
IPC分类号： G03F7/20 , H01L21/683 , H01L21/687
摘要： The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.

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