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1. 发明授权

US5491603A Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer 失效
标题翻译：确定脱扣电压的方法，其消除静电卡盘和晶片之间的剩余静电力
公开(公告)号：US5491603A
公开(公告)日：1996-02-13
申请号：US235012
申请日：1994-04-28
申请人： Manoocher Birang , Jian Ding , Hyman J. Levinstein
发明人： Manoocher Birang , Jian Ding , Hyman J. Levinstein
IPC分类号： B23Q3/15 , H01L21/205 , H01L21/302 , H01L21/3065 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6833
摘要： The invention is embodied in a method of determining an optimum de-chucking voltage for nullifying residual electrostatic forces on a wafer in an electrostatic chuck for removal of the wafer from the chuck, including holding the wafer on the electrostatic chuck by applying an electrostatic potential to the chuck, introducing a gas between the wafer and the chuck, reducing the electrostatic potential of the chuck while observing a rate of leakage of the gas from between the wafer and the chuck, and recording as the optimum dechucking voltage the value of the electrostatic potential obtaining when the rate of leakage exceeds a predetermined threshold.
摘要翻译：本发明体现于一种确定最佳去夹紧电压的方法，用于使静电卡盘中的晶片上的残留静电力无效，从卡盘移除晶片，包括通过施加静电电位将晶片保持在静电卡盘上卡盘，在晶片和卡盘之间引入气体，同时观察卡盘的气体泄漏速率，同时减小卡盘的静电电位，并记录最佳的脱扣电压为静电电位值当泄漏速率超过预定阈值时获得。

2. 发明授权

US5745331A Electrostatic chuck with conformal insulator film 失效
标题翻译：带保形绝缘膜的静电吸盘
公开(公告)号：US5745331A
公开(公告)日：1998-04-28
申请号：US381786
申请日：1995-01-31
申请人： Shamouil Shamouilian , Sasson Somekh , Hyman J. Levinstein , Manoocher Birang , Semyon Sherstinsky , John F. Cameron
发明人： Shamouil Shamouilian , Sasson Somekh , Hyman J. Levinstein , Manoocher Birang , Semyon Sherstinsky , John F. Cameron
IPC分类号： B23Q3/15 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00
摘要： An electrostatic chuck (20) for holding a substrate (75) comprises (i) a base (80) having an upper surface (95) with grooves (85) therein, the grooves (85) sized and distributed for holding coolant for cooling a substrate (75), and (ii) a substantially continuous insulator film (45) conformal to the grooves (85) on upper surface (95) of the base (80). The base (80) can be electrically conductive and capable of serving as the electrode (50) of the chuck (20), or the electrode (50) can be embedded in the insulator film (45). The insulator film (45) has a dielectric breakdown strength sufficiently high that when a substrate (75) placed on the chuck (20) and electrically biased with respect to the electrode (50), electrostatic charge accumulates in the substrate (75) and in the electrode (50) forming an electrostatic force that attracts and holds the substrate (75) to the chuck (20). Preferably the chuck (20) is fabricated using a pressure forming process, and more preferably using a pressure differential process.
摘要翻译：用于保持基板（75）的静电卡盘（20）包括（i）具有在其中具有凹槽（85）的上表面（95）的基部（80），所述凹槽（85）的尺寸和分布以保持用于冷却的冷却剂衬底（75），和（ii）与基座（80）的上表面（95）上的凹槽（85）共形的基本上连续的绝缘膜（45）。基座（80）可以是导电的并且能够用作卡盘（20）的电极（50），或者电极（50）可以嵌入绝缘膜（45）中。绝缘体膜（45）具有足够高的绝缘击穿强度，当放置在卡盘（20）上并相对于电极（50）电偏置的基板（75）时，静电电荷积聚在基板（75）中所述电极（50）形成吸引并保持所述基板（75）到所述卡盘（20）的静电力。优选地，使用压力成形方法制造卡盘（20），更优选使用压差法。

3. 发明授权

US5753132A Method of making electrostatic chuck with conformal insulator film 失效
标题翻译：用保形绝缘膜制作静电卡盘的方法
公开(公告)号：US5753132A
公开(公告)日：1998-05-19
申请号：US725482
申请日：1996-10-04
申请人： Shamouil Shamouilian , Sasson Somekh , Hyman J. Levinstein , Manoocher Birang , Semyon Sherstinsky , John F. Cameron
发明人： Shamouil Shamouilian , Sasson Somekh , Hyman J. Levinstein , Manoocher Birang , Semyon Sherstinsky , John F. Cameron
IPC分类号： B23Q3/15 , H01L21/683 , H02N13/00 , B44C1/22
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00
摘要： A process for fabricating an electrostatic chuck (20) comprising the steps of (c) forming a base (80) having an upper surface with cooling grooves (85) therein, the grooves sized and distributed for holding a coolant therein for cooling the base; and (d) pressure conforming an electrical insulator layer (45) to the grooves on the base by the steps of (i) placing the base into a pressure forming apparatus (25) and applying an electrical insulator layer over the grooves in the base; and (ii) applying a sufficiently high pressure onto the insulator layer to pressure conform the insulator layer to the grooves to form a substantially continuous layer of electrical insulator conformal to the grooves on the base.
摘要翻译：一种用于制造静电卡盘（20）的方法，包括以下步骤：（c）形成具有上表面的基部（80），其中具有冷却槽（85），所述凹槽的尺寸和分布用于将冷却剂保持在其中用于冷却基座; 和（d）通过以下步骤将电绝缘体层（45）施加到基底上的凹槽上：（i）将基底放置在压力成形设备（25）中并将电绝缘体层施加在基底中的凹槽上; 和（ii）将足够高的压力施加到绝缘体层上以使绝缘体层压到沟槽上，以形成与基底上的凹槽保形的基本上连续的电绝缘层。

4. 发明授权

US07775852B2 Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations 有权
标题翻译：用于化学机械抛光操作的原位终点检测的装置和方法
公开(公告)号：US07775852B2
公开(公告)日：2010-08-17
申请号：US11099789
申请日：2005-04-05
申请人： Manoocher Birang , Nils Johansson , Allan Gleason
发明人： Manoocher Birang , Nils Johansson , Allan Gleason
IPC分类号： B24B49/12
CPC分类号： H01L22/12 , B24B37/013 , B24B37/205 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/0683
摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
摘要翻译：使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

5. 发明授权

US07731566B2 Substrate polishing metrology using interference signals 失效
标题翻译：使用干涉信号的基板抛光计量
公开(公告)号：US07731566B2
公开(公告)日：2010-06-08
申请号：US11838808
申请日：2007-08-14
申请人： Manoocher Birang , Grigory Pyatigorsky
发明人： Manoocher Birang , Grigory Pyatigorsky
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , G01B11/06 , G01B11/0683
摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.
摘要翻译：抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光光束并将光束引向基板，以使光束撞击正在抛光的基板的侧面。从基板反射的光在检测器处产生干涉信号。从干扰信号计算均匀度的度量。

6. 发明授权

US07727364B2 Auxiliary electrode encased in cation exchange membrane tube for electroplating cell 有权
标题翻译：辅助电极封装在电镀槽的阳离子交换膜管中
公开(公告)号：US07727364B2
公开(公告)日：2010-06-01
申请号：US11362432
申请日：2006-02-24
申请人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
发明人： Saravjeet Singh , Hooman Hafezi , Manoocher Birang , Aron Rosenfeld , Joseph Behnke
IPC分类号： C25D17/12 , C25D7/12
CPC分类号： C25D17/10 , C25D5/04 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , C25D17/02 , H01L21/2885
摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.
摘要翻译：一种用于将金属电镀到基底上的方法和装置。本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。包封的辅助电极组件通常包括设置在保护管中的辅助电极。

7. 发明申请

US20100050779A1 CARBON NANOTUBE-BASED LOAD CELLS 有权
标题翻译：基于碳纳米管的负载细胞
公开(公告)号：US20100050779A1
公开(公告)日：2010-03-04
申请号：US12201242
申请日：2008-08-29
申请人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
发明人： Victor L. Pushparaj , Omkaram Nalamasu , Manoocher Birang
IPC分类号： G01B7/16 , H01L49/00 , H01L21/66
CPC分类号： G01L1/20 , G01L1/18 , G01L5/0076 , Y10S977/953 , Y10S977/956
摘要： A robust, stand-alone load cell comprises a block of aligned carbon nanotubes with parallel electrodes on opposing sides of the block and an electrical circuit connected between the electrodes for measuring the electrical resistance of the block. The nanotubes are preferably aligned perpendicular to the electrodes. Carbon nanotube-based load cells may be incorporated into a wafer asssembly for characterizing semiconductor processing equipment. Such a wafer assembly includes two parallel wafers with a plurality of carbon nanotube load cells positioned between and attached to both wafers. The load cells are independently electrically connected to a device which monitors and records the resistivity of the load cell. According to further aspects of the invention, each of the load cell's parallel electrodes may be comprised of many small electrodes, where each small electrode on one side of the block has a corresponding small electrode on the opposing side of the block; corresponding pairs of small electrodes are connected in series to form a chain; an electrical circuit, connected to both ends of the chain of opposing pairs of electrodes, is used to measure the electrical resistance of the chain.
摘要翻译：坚固的独立测力传感器包括在块的相对侧上具有平行电极的对准碳纳米管块和连接在电极之间的用于测量块的电阻的电路。纳米管优选垂直于电极取向。可以将碳纳米管基称重传感器结合到用于表征半导体处理设备的晶片组件中。这种晶片组件包括两个平行的晶片，其中多个碳纳米管负载单元位于两个晶片之间并附着在两个晶片上。称重传感器独立地电连接到监测和记录称重传感器的电阻率的装置。根据本发明的另外的方面，每个负载传感器的平行电极可以由许多小电极组成，其中块的一侧上的每个小电极在块的相对侧具有相应的小电极; 相应的一对小电极串联连接形成链条; 连接到相对电极对的链的两端的电路用于测量链的电阻。

8. 发明授权

US07500901B2 Data processing for monitoring chemical mechanical polishing 有权
标题翻译：数据处理用于监测化学机械抛光
公开(公告)号：US07500901B2
公开(公告)日：2009-03-10
申请号：US11222561
申请日：2005-09-08
申请人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
发明人： Boguslaw A. Swedek , Nils Johansson , Manoocher Birang
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
摘要翻译：实施用于监测抛光衬底的技术的方法和装置。获取两个或多个数据点，其中每个数据点具有受传感器感测区域内的特征影响的值，并且对应于感测区域穿过衬底的衬底和传感器的相对位置。一组参考点用于修改采集的数据点。该修改补偿由穿过衬底的感测区域引起的所获取的数据点中的失真。基于修改的数据点，评估基板的局部特性以监测抛光。

9. 发明申请

US20070135958A1 INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING 有权
标题翻译：具有光和电流监测的集成端点检测系统
公开(公告)号：US20070135958A1
公开(公告)日：2007-06-14
申请号：US11677450
申请日：2007-02-21
申请人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
发明人： Boguslaw Swedek , Manoocher Birang , Nils Johansson
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫的厚度。涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

10. 发明授权

US07195536B2 Integrated endpoint detection system with optical and eddy current monitoring 有权
标题翻译：具有光学和涡流监测的集成端点检测系统
公开(公告)号：US07195536B2
公开(公告)日：2007-03-27
申请号：US11217598
申请日：2005-08-31
申请人： Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
发明人： Boguslaw A. Swedek , Manoocher Birang , Nils Johansson
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00 , B24B19/00 , G01H3/12 , G01N9/24
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译：化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。来自监控系统的信号可以组合在输出线上并由计算机提取。可以计算抛光垫的厚度。涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

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