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    • 2. 发明授权
    • Three axes accelerometer
    • 三轴加速度计
    • US5487305A
    • 1996-01-30
    • US274128
    • 1994-07-12
    • Ljubisa RisticRonald J. GutteridgeWu KouchengMichael F. CalawayWilliam C. Dunn
    • Ljubisa RisticRonald J. GutteridgeWu KouchengMichael F. CalawayWilliam C. Dunn
    • B81B3/00G01P15/125G01P15/18
    • G01P15/18G01P15/125G01P2015/082
    • A three axis accelerometer includes a semiconductor substrate with a plurality of layers of conductive material formed thereon by semiconductor manufacturing techniques, with each layer defining a plane and mounted in parallel spaced relation to each other. A first of the layers is fixedly mounted and a second layer is mounted for limited movement relative to the first layer with the first and second layers forming a first capacitance varying in accordance with acceleration of the accelerometer along a first axis defined by the first and second layers. A plurality of first surfaces and a plurality of electrically isolated plates are formed as a portion of the first and the second layers, respectively, and positioned in parallel juxtaposition, with the plates being moveable relative to the first layer. The first surfaces and the plates defining mutually orthogonal second and third axes with each other and the first axis and forming capacitances which vary in accordance with acceleration in the second and third axes.
    • 三轴加速度计包括具有通过半导体制造技术在其上形成的多层导电材料的半导体衬底,其中每个层限定一个平面并以彼此平行间隔的关系安装。 第一层被固定地安装,并且第二层被安装成相对于第一层有限的移动,其中第一层和第二层形成第一电容,其根据加速度计沿着由第一和第二层限定的第一轴的加速度而变化 层。 多个第一表面和多个电隔离板分别形成为第一和第二层的一部分,并且平行并置地定位,其中板可相对于第一层移动。 所述第一表面和所述板彼此限定相互正交的第二和第三轴线,并且所述第一轴线和形成电容根据第二和第三轴线的加速度而变化。
    • 7. 发明授权
    • Pressure sensor method of fabrication
    • 压力传感器制造方法
    • US5632854A
    • 1997-05-27
    • US517047
    • 1995-08-21
    • Andy MirzaLjubisa Ristic
    • Andy MirzaLjubisa Ristic
    • G01L9/00H01L21/00
    • G01L9/0042Y10S438/978
    • A pressure sensor (11) and its method of fabrication include etching a V-groove (19) in a first surface (16) of a first substrate (12), bonding a second substrate (24) to the first substrate (12), thinning the second substrate (24) to form a diaphragm (32) overlying the V-groove (19), and etching a port (38) from the second surface (18) of the first substrate (12) to the V-groove (19). Tetra-methyl-ammonium-hydroxide is preferably used to anisotropically etch the V-groove (19), and an anisotropic plasma reactive ion etch is preferably used to etch the port (38).
    • 压力传感器(11)及其制造方法包括蚀刻第一基板(12)的第一表面(16)中的V形槽(19),将第二基板(24)接合到第一基板(12), 使所述第二基板(24)变薄以形成覆盖所述V形槽(19)的隔膜(32),并且从所述第一基板(12)的所述第二表面(18)蚀刻到所述V形槽( 19)。 四甲基氢氧化铵优选用于各向异性蚀刻V形槽(19),优选使用各向异性等离子体反应离子蚀刻来蚀刻端口(38)。