专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5418469A Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components 失效
标题翻译：用于将测试设备连接到电路板的互连设备，用于精细节距焊丝集成电路组件
公开(公告)号：US5418469A
公开(公告)日：1995-05-23
申请号：US343842
申请日：1994-11-23
申请人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
发明人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
IPC分类号： G01R1/073 , G01R31/00
CPC分类号： G01R1/07328 , Y10S439/912
摘要： An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention includes a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit features a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
摘要翻译：描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。本发明的测试设备接口系统包括板互连单元，插入器和测试设备电缆。测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。这些信号对应于由本发明仿真的部件提供的信号。正在仿真的部件由电路板互连单元在电路板上替换。电路板互连单元具有对应于正在仿真的部件的数量，尺寸和配置的引线或引脚，并且通常被焊接到被测电路板，以分析和调试电路板上的电路。电路板互连单元具有连接到金属体的引线框架。引线框架用于将引脚路由或转换为接触焊盘阵列。接触垫相对较宽地间隔开，以便更好地接触和连接插入件的导电弹簧销或接触针阵列。因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列，因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。

2. 发明授权

US5594356A Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components 失效
标题翻译：用于将测试设备连接到电路板的互连设备，用于精细节距焊丝集成电路组件
公开(公告)号：US5594356A
公开(公告)日：1997-01-14
申请号：US382295
申请日：1995-02-01
申请人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
发明人： Leonard Turner , Mark Trobough , Ashok Kabadi , Ron Flamm
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R1/07328 , Y10S439/912
摘要： An apparatus and method for reliably interconnecting a test device with a circuit board designed for fine pitch solder lead surface mounted components is described. The test equipment interface system of the present invention comprises a board interconnect unit, an interposer, and a test device cable. The test device cable is coupled to a test device, which can receive and manipulate signals via the cable. These signals correspond to signals provided by a component being emulated by the present invention. A component being emulated is replaced on the circuit board by the board interconnect unit. The board interconnect unit has leads or pins in a quantity, size, and configuration corresponding to a component being emulated and is typically soldered to a circuit board under test for the purpose of analyzing and debugging the circuitry on the circuit board. The board interconnect unit comprises a lead frame which is attached to a metal body. The lead frame is used to route or convert the pins into an array of contact pads. The contact pads are relatively widely spaced for better access to and connection with an array of electrically conductive spring pins or contact pins of the interposer. Because the lead frame converts the fine dimension pins to a more widely spaced array of contact pads, the corresponding spring pins of the interposer do not have to be manufactured with the precise dimensional tolerances required for the manufacture of the pins.
摘要翻译：描述了一种用于将测试装置与设计用于细间距焊料引线表面安装部件的电路板可靠地互连的装置和方法。本发明的测试设备接口系统包括板互连单元，插入器和测试设备电缆。测试设备电缆耦合到可以经由电缆接收和操纵信号的测试设备。这些信号对应于由本发明仿真的部件提供的信号。正在仿真的部件由电路板互连单元在电路板上替换。电路板互连单元具有对应于正在仿真的部件的数量，尺寸和配置的引线或引脚，并且通常被焊接到被测电路板，以分析和调试电路板上的电路。板互连单元包括附接到金属体的引线框架。引线框架用于将引脚路由或转换为接触焊盘阵列。接触垫相对较宽地间隔开，以便更好地接触和连接插入件的导电弹簧销或接触针阵列。因为引线框架将精细尺寸的引脚转换成更广泛间隔的接触焊盘阵列，因此插入器的相应弹簧销不必以制造引脚所需的精确尺寸公差制造。

3. 发明申请

US20060091538A1 Low profile and tight pad-pitch land-grid-array (LGA) socket 审中-公开
标题翻译：低轮廓和紧凑的垫间距地格阵列（LGA）插座
公开(公告)号：US20060091538A1
公开(公告)日：2006-05-04
申请号：US10982103
申请日：2004-11-04
申请人： Ashok Kabadi
发明人： Ashok Kabadi
IPC分类号： H01L21/48 , H01L29/40
CPC分类号： H05K7/1061
摘要： The apparatus and method described herein are for coupling an integrated circuit to a circuit board through a low profile compression socket. A plurality of compressible columns disposed in a substrate, when compressed, make electrical connection to a first set of pads on an integrated circuit and to a plurality of conductive paths disposed in an interposer, wherein the conductive paths make electrical contact with a second set of connection pads coupled to a circuit board.
摘要翻译：本文所述的装置和方法用于通过低剖面压缩插座将集成电路耦合到电路板。设置在基板中的多个可压缩的列压缩时，与集成电路上的第一组焊盘和布置在插入件中的多个导电路径电连接，其中导电路径与第二组耦合到电路板的连接焊盘。

4. 发明申请

US20060067041A1 Hybrid compression socket connector for integrated circuits 有权
标题翻译：用于集成电路的混合压缩插座连接器
公开(公告)号：US20060067041A1
公开(公告)日：2006-03-30
申请号：US10955676
申请日：2004-09-29
申请人： Ashok Kabadi , Frank DeWeese
发明人： Ashok Kabadi , Frank DeWeese
IPC分类号： G06F1/16
CPC分类号： H05K7/1007 , H01R12/585 , H01R12/7052 , H01R12/7064 , H01R12/7076 , H05K3/301 , H05K3/308 , H05K3/325 , H05K2201/10325 , H05K2201/10704 , H05K2201/10719
摘要： The apparatus and method described herein are for coupling an integrated circuit to a circuit board, while eliminating the need for a backing plate, when a compression socket is utilized. A plurality of tension pins are coupled to an integrated circuit for engaging a plurality of corresponding barrels in a circuit board to compress a compression socket to make an electrical connection between the integrated circuit and the circuit board.
摘要翻译：当使用压缩插座时，本文描述的装置和方法用于将集成电路耦合到电路板，同时消除对背板的需要。多个张紧销耦合到集成电路，用于接合电路板中的多个对应的筒以压缩压缩插座以在集成电路和电路板之间形成电连接。

5. 发明申请

US20050088823A1 VARIABLE DENSITY GRAPHITE FOAM HEAT SINK 审中-公开
标题翻译：可变密度石墨泡沫散热
公开(公告)号：US20050088823A1
公开(公告)日：2005-04-28
申请号：US10692443
申请日：2003-10-22
申请人： Ashok Kabadi , Gary Brady , Frank Deweese , Harry Hampton
发明人： Ashok Kabadi , Gary Brady , Frank Deweese , Harry Hampton
IPC分类号： C04B38/00 , H01L23/367 , H01L23/373 , H01L23/427 , H05K7/20
CPC分类号： H01L23/373 , C04B38/0067 , C04B2111/00844 , H01L23/367 , H01L23/3733 , H01L2924/0002 , C04B35/522 , H01L2924/00
摘要： A heat sink is disclosed for directing heat away from an electronic component dissipating heat. The heat sink includes a thermally conductive base formed of a variable density graphite foam article. This graphite foam heat sink having variable foam densities provides for higher cooling capacity than existing heat sinks.
摘要翻译：公开了一种用于将热量从散热的电子部件引导的散热器。散热器包括由可变密度的石墨泡沫制品形成的导热底座。这种具有可变泡沫密度的石墨泡沫散热器提供比现有散热器更高的冷却能力。

6. 发明授权

US07729121B1 Removable package underside device attach 有权
标题翻译：可拆卸包装下装置附件
公开(公告)号：US07729121B1
公开(公告)日：2010-06-01
申请号：US12317855
申请日：2008-12-30
申请人： Anand Deshpande , Venkat Natarajan , Ashok Kabadi , Vittal Kini
发明人： Anand Deshpande , Venkat Natarajan , Ashok Kabadi , Vittal Kini
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L23/40 , H01L23/427 , H01L2224/73253 , H05K1/0203 , H05K1/141 , H05K3/325 , H05K2201/10159 , H05K2201/10325 , H05K2201/10477 , H05K2201/10719
摘要： In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.
摘要翻译：在一些实施例中，堆叠的包装组件可以包括限定内部空腔的第一插座，耦合到第一插座的第一半导体器件，位于第一插座的内部空腔内的第二插座，以及可移除地耦合到在第一插座的腔内的第二插座。第二插座可以位于第一半导体器件和第二半导体器件之间，并且在第一半导体器件和第二半导体器件之间提供电连接。公开和要求保护其他实施例。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式