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    • 5. 发明授权
    • Locos nitride capping of deep trench polysilicon fill
    • 深沟槽多晶硅填料的氮化物覆盖
    • US08461661B2
    • 2013-06-11
    • US12418819
    • 2009-04-06
    • Noel Hoilien
    • Noel Hoilien
    • H01L21/70
    • H01L21/763H01L21/76235
    • A polysilicon-filled isolation trench in a substrate is effective to isolate adjacent semiconductor devices from one another. A silicon nitride cap is provided to protect the polysilicon in the isolation trench from subsequent field oxidation. The cap has lateral boundaries that extend between the side boundaries of the polysilicon and the sidewalls of the trench. Subsequent field oxide regions formed adjacent to the trench establish a gap dimension from the substrate to a top surface of the field oxide regions adjacent to the polysilicon side boundaries that is no less than half of the field oxide thickness.
    • 衬底中的多晶硅填充隔离沟槽有效地隔离相邻的半导体器件。 提供氮化硅盖以保护隔离沟槽中的多晶硅免于随后的场氧化。 盖具有在多晶硅的侧边界和沟槽的侧壁之间延伸的横向边界。 随后形成的与沟槽相邻形成的场氧化物区域形成从衬底到与多晶硅边界相邻的场氧化物区域的顶表面的间隙尺寸,其不小于场氧化物厚度的一半。
    • 6. 发明申请
    • LOCOS NITRIDE CAPPING OF DEEP TRENCH POLYSILICON FILL
    • 深层渗透聚硅氧烷膜的LOCOS氮化物填充
    • US20100252905A1
    • 2010-10-07
    • US12418819
    • 2009-04-06
    • Noel Hoilien
    • Noel Hoilien
    • H01L29/06H01L21/762
    • H01L21/763H01L21/76235
    • A polysilicon-filled isolation trench in a substrate is effective to isolate adjacent semiconductor devices from one another. A silicon nitride cap is provided to protect the polysilicon in the isolation trench from subsequent field oxidation. The cap has lateral boundaries that extend between the side boundaries of the polysilicon and the sidewalls of the trench. Subsequent field oxide regions formed adjacent to the trench establish a gap dimension from the substrate to a top surface of the field oxide regions adjacent to the polysilicon side boundaries that is no less than half of the field oxide thickness.
    • 衬底中的多晶硅填充隔离沟槽有效地隔离相邻的半导体器件。 提供氮化硅盖以保护隔离沟槽中的多晶硅免于随后的场氧化。 盖具有在多晶硅的侧边界和沟槽的侧壁之间延伸的横向边界。 随后形成的与沟槽相邻形成的场氧化物区域形成从衬底到与多晶硅边界相邻的场氧化物区域的顶表面的间隙尺寸,其不小于场氧化物厚度的一半。