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1. 发明授权

US08413324B2 Method of manufacturing double-sided circuit board 有权
标题翻译：制造双面电路板的方法
公开(公告)号：US08413324B2
公开(公告)日：2013-04-09
申请号：US12757157
申请日：2010-04-09
申请人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H01K3/10
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.
摘要翻译：一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔，在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将形成第一导电电路和第二导电电路。

2. 发明授权

US08766106B2 Double-sided circuit board and manufacturing method thereof 有权
标题翻译：双面电路板及其制造方法
公开(公告)号：US08766106B2
公开(公告)日：2014-07-01
申请号：US13434162
申请日：2012-03-29
申请人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota Noda , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K1/00
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
摘要翻译：一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔和第二孔，其直径小于R1和R2中的至少一个。

3. 发明申请

US20120181076A1 DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：双面电路板及其制造方法
公开(公告)号：US20120181076A1
公开(公告)日：2012-07-19
申请号：US13434162
申请日：2012-03-29
申请人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A double-sided circuit board including a substrate having a first surface and a second surface on an opposite side of the first surface and having a penetrating hole extending between the first surface and the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, and a through-hole conductor formed in the penetrating hole of the substrate and electrically connecting the first conductive circuit and the second conductive circuit. The penetrating hole comprises a first hole having a first opening with a diameter R1 on the first surface of the substrate, a second hole having a second opening with a diameter R2 on the second surface of the substrate, and a third hole connecting the first hole and the second hole and having a diameter smaller than at least one of R1 and R2.
摘要翻译：一种双面电路板，包括具有在所述第一表面的相对侧上的第一表面和第二表面的基底，并且具有在所述第一表面和所述第二表面之间延伸的穿透孔，形成在所述第一表面的第一表面上的第一导电电路所述基板，形成在所述基板的第二表面上的第二导电电路和形成在所述基板的所述贯通孔中的通孔导体，并且电连接所述第一导电电路和所述第二导电电路。所述贯通孔包括第一孔，所述第一孔具有在所述基底的第一表面上具有直径R1的第一开口，在所述基底的第二表面上具有直径为R2的第二开口的第二孔，以及连接所述第一孔和第二孔，其直径小于R1和R2中的至少一个。

4. 发明申请

US20100307807A1 DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：双面电路板及其制造方法
公开(公告)号：US20100307807A1
公开(公告)日：2010-12-09
申请号：US12757157
申请日：2010-04-09
申请人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
发明人： Kota NODA , Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K1/02 , H01R43/16
CPC分类号： H05K1/115 , H05K1/0269 , H05K3/0032 , H05K3/0038 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K2201/09254 , H05K2201/09563 , H05K2201/09827 , H05K2201/09845 , H05K2201/09918 , H05K2203/0554 , H05K2203/1572 , H05K2203/166
摘要： A method for manufacturing a double-sided circuit board includes preparing a substrate having the first and second surfaces, forming a first hole having a first opening with a diameter R1 on the first surface of the substrate, forming a second hole having a second opening with a diameter R2 on the second surface of the substrate, forming a third hole having a diameter smaller than R1 and/or R2 and connecting the first and second holes such that a penetrating hole formed of the first hole, the second hole and the third hole is formed in the substrate, forming a first conductive circuit on the first surface of the substrate, forming a second conductive circuit on the second surface of the substrate, and filling the penetrating hole with conductive material such that a through-hole conductor electrically connecting the first conductive circuit and the second conductive circuit is formed.
摘要翻译：一种制造双面电路板的方法包括制备具有第一和第二表面的基板，在基板的第一表面上形成具有直径为R1的第一开口的第一孔，形成具有第二开口的第二孔，在所述基板的第二表面上的直径R2，形成直径小于R1和/或R2的第三孔，并且连接所述第一孔和所述第二孔，使得由所述第一孔，所述第二孔和所述第三孔形成的穿透孔形成在基板上，在基板的第一表面上形成第一导电电路，在基板的第二表面上形成第二导电电路，并用导电材料填充该贯穿孔，使得通孔导体将形成第一导电电路和第二导电电路。

5. 发明授权

US08595927B2 Method for manufacturing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08595927B2
公开(公告)日：2013-12-03
申请号：US13408597
申请日：2012-02-29
申请人： Tsutomu Yamauchi , Satoru Kawai
发明人： Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K3/10
CPC分类号： H05K3/0038 , H05K3/427 , H05K3/4661 , H05K2201/09563 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2
摘要翻译：一种制造印刷电路板的方法，包括制备具有第一和第二表面的芯基板，从基板的第一表面朝向第二表面形成贯穿孔，在基板的第一表面上形成第一导体，在基板的第一表面上形成第二导体衬底的第二表面，并且将导电材料填充到孔中，使得形成连接第一和第二导体的通孔导体。孔的形成包括在基板的第一表面侧形成第一开口部分，从第一部分的底部朝向第二表面的第二开口部分，以及从第二部分的底部到第二开口部分的第三开口部分第二表面和孔的形成满足X2

6. 发明申请

US20120304458A1 METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：制造多层印刷线路板的方法
公开(公告)号：US20120304458A1
公开(公告)日：2012-12-06
申请号：US13408597
申请日：2012-02-29
申请人： Tsutomu Yamauchi , Satoru Kawai
发明人： Tsutomu Yamauchi , Satoru Kawai
IPC分类号： H05K3/00
CPC分类号： H05K3/0038 , H05K3/427 , H05K3/4661 , H05K2201/09563 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165
摘要： A method for manufacturing a printed wiring board includes preparing a core substrate having first and second surfaces, forming a penetrating hole from the first surface toward the second surface of the substrate, forming first conductor on the first surface of the substrate, forming second conductor on the second surface of the substrate, and filling conductive material in the hole such that through-hole conductor connecting the first and second conductors is formed. The forming of the hole includes forming a first opening portion on the first-surface side of the substrate, a second opening portion from the bottom of the first portion toward the second surface, and a third opening portion from the bottom of the second portion toward the second surface, and the forming of the hole satisfies X2
摘要翻译：一种制造印刷电路板的方法，包括制备具有第一和第二表面的芯基板，从基板的第一表面朝向第二表面形成贯穿孔，在基板的第一表面上形成第一导体，在基板的第一表面上形成第二导体衬底的第二表面，并且将导电材料填充到孔中，使得形成连接第一和第二导体的通孔导体。孔的形成包括在基板的第一表面侧形成第一开口部分，从第一部分的底部朝向第二表面的第二开口部分，以及从第二部分的底部到第二开口部分的第三开口部分第二表面和孔的形成满足X2

7. 发明申请

US20120213944A1 METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US20120213944A1
公开(公告)日：2012-08-23
申请号：US13325105
申请日：2011-12-14
申请人： Tsutomu YAMAUCHI , Satoru Kawai
发明人： Tsutomu YAMAUCHI , Satoru Kawai
IPC分类号： H05K3/00 , B05D3/06
CPC分类号： H05K3/0032 , H05K3/4602 , H05K2201/09827 , H05K2201/09854 , H05K2203/1476 , H05K2203/1572
摘要： A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.
摘要翻译：一种制造印刷线路板的方法，包括在芯基板中形成贯通孔，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在该孔中填充导电材料使得在孔中形成通孔导体，并且第一和第二导体经由通孔导体连接。孔的形成包括在第一表面中形成第一开口，从第一开口的底部朝向第二表面形成第二开口，使得第二开口具有比第一开口更小的直径，在第二开口中形成第三开口并且从第三开口的底部朝向第一表面形成第四开口，使得第四开口具有比第三开口小的直径。

8. 发明授权

US09078343B2 Method for manufacturing printed wiring board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US09078343B2
公开(公告)日：2015-07-07
申请号：US13325105
申请日：2011-12-14
申请人： Tsutomo Yamauchi , Satoru Kawai
发明人： Tsutomo Yamauchi , Satoru Kawai
IPC分类号： H05K3/00 , H05K3/46
CPC分类号： H05K3/0032 , H05K3/4602 , H05K2201/09827 , H05K2201/09854 , H05K2203/1476 , H05K2203/1572
摘要： A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.
摘要翻译：一种制造印刷线路板的方法，包括在芯基板中形成贯通孔，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在该孔中填充导电材料使得在孔中形成通孔导体，并且第一和第二导体经由通孔导体连接。孔的形成包括在第一表面中形成第一开口，从第一开口的底部朝向第二表面形成第二开口，使得第二开口具有比第一开口更小的直径，在第二开口中形成第三开口并且从第三开口的底部朝向第一表面形成第四开口，使得第四开口具有比第三开口小的直径。

9. 发明申请

US20120005888A1 PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译：电镀设备，镀层方法和多层印刷电路板
公开(公告)号：US20120005888A1
公开(公告)日：2012-01-12
申请号：US13240626
申请日：2011-09-22
申请人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
发明人： Toru Nakai , Satoru Kawai , Hiroshi Niwa , Yoshiyuki Iwata
IPC分类号： H05K3/00
CPC分类号： C25D5/02 , H05K3/108 , H05K3/421 , H05K3/423 , H05K3/429 , H05K3/4661 , H05K2201/0116 , H05K2201/09563 , H05K2203/025 , H05K2203/0257 , Y10T29/49124 , Y10T428/24917 , Y10T428/24926 , Y10T428/249955 , Y10T428/249958
摘要： A method for manufacturing a multilayer printed circuit board including providing a core substrate having a penetrating-hole, forming an electroless plated film on a surface of the substrate and an inner wall surface of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of the substrate an insulating member in contact with the surface of the substrate such that an electrolytic plated film is formed on the electroless plated film, an opening space inside the penetrating-hole is filled with an electrolytic material, and a through-hole conductor structure is formed in the penetrating-hole, forming an etching resist having an opening pattern on the electrolytic plated film, and removing an exposed pattern of the electrolytic plated film exposed by the opening pattern and a pattern of the electroless plated film under the exposed pattern such that a conductor circuit is formed on the surface of the substrate.
摘要翻译：一种多层印刷电路板的制造方法，其特征在于，具有提供具有贯通孔的芯基板，在所述基板的表面上形成无电镀膜和所述贯通孔的内壁面，对所述基板进行电解电镀，同时相对于在所述基板的表面上与所述基板的表面接触的绝缘构件，使得在所述无电镀膜上形成电解电镀膜，所述贯通孔内的开口空间填充有电解材料，在导电孔中形成空穴导体结构，在电解镀膜上形成具有开口图案的抗蚀剂，并且除去由开口图案露出的电解电镀膜的露出图案，以及将化学镀膜的图案使得在基板的表面上形成导体电路。

10. 发明授权

US5824623A Thermal transfer image-receiving sheet 失效
标题翻译：热转印图像接收片
公开(公告)号：US5824623A
公开(公告)日：1998-10-20
申请号：US672593
申请日：1996-06-28
申请人： Satoru Kawai , Masayasu Yamazaki , Kenichiro Sudo , Hitoshi Saito
发明人： Satoru Kawai , Masayasu Yamazaki , Kenichiro Sudo , Hitoshi Saito
IPC分类号： B41M5/382 , B32B27/00 , B32B27/10 , B32B27/18 , B32B27/30 , B41M5/50 , B41M5/52 , B41M5/035 , B41M5/38
CPC分类号： B41M5/5254 , Y10S428/913 , Y10S428/914 , Y10T428/273 , Y10T428/31935
摘要： There is provided a thermal transfer image-receiving sheet comprising: a substrate sheet; and an image-receiving layer provided on one side of the substrate sheet, the image-receiving layer comprising a copolymer, having an average degree of polymerization of 800 to 2000, of at least vinyl chloride and vinyl acetate as main comonomers.
摘要翻译：提供一种热转印图像接收片，其包括：基片; 以及设置在基片的一侧的图像接收层，所述图像接收层包含平均聚合度为800至2000的至少氯乙烯和乙酸乙烯酯作为主要共聚单体的共聚物。

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