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1. 发明授权

US09056990B2 Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board 有权
标题翻译：含磷原子的低聚物组合物，可固化树脂组合物，其固化产物和印刷电路板
公开(公告)号：US09056990B2
公开(公告)日：2015-06-16
申请号：US13821449
申请日：2012-03-13
申请人： Koji Hayashi , Yutaka Satou , Takamitsu Nakamura
发明人： Koji Hayashi , Yutaka Satou , Takamitsu Nakamura
IPC分类号： C09D5/18 , H05K1/02 , C08G59/00 , C08G59/40 , C08G59/62 , C08G63/02 , C08L63/00 , C07F9/6571 , H05K1/03 , H05K3/46 , C08G59/32 , C08L63/04
CPC分类号： C09D5/18 , C07F9/657172 , C08G59/3272 , C08L63/04 , H05K1/02 , H05K1/0326 , H05K3/4676 , H05K2201/012
摘要： A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area bases in GPC measurement.
摘要翻译：使用含磷原子的低聚物作为环氧树脂的固化剂，含磷原子的低聚物是由下述结构式（1）表示的含磷原子的化合物与n表示0的混合物和磷由下述结构式（1）表示的含原子的低聚物，n表示1或更多：（其中R 1至R 5各自独立地表示氢原子，具有1至4个碳原子的烷基等; X表示氢原子或由结构式（x1）表示的结构单元：其中，在结构式（x1）中，R 2至R 5各自独立地表示氢原子，具有1至4个碳原子的烷基等），其中a 由n表示1以上的通式（1）表示的含磷原子的低聚物的含量在GPC测定的基础上的峰面积的范围为5〜90％。

2. 发明申请

US20140008108A1 PHOSPHORUS-ATOM-CONTAINING OLIGOMER COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD 有权
标题翻译：含磷原子的低聚物组合物，可固化树脂组合物，固化产品和印刷电路板
公开(公告)号：US20140008108A1
公开(公告)日：2014-01-09
申请号：US13821449
申请日：2012-03-13
申请人： Koji Hayashi , Yutaka Satou , Takamitsu Nakamura
发明人： Koji Hayashi , Yutaka Satou , Takamitsu Nakamura
IPC分类号： C09D5/18 , H05K1/02
CPC分类号： C09D5/18 , C07F9/657172 , C08G59/3272 , C08L63/04 , H05K1/02 , H05K1/0326 , H05K3/4676 , H05K2201/012
摘要： A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area basis in GPC measurement.
摘要翻译：使用含磷原子的低聚物作为环氧树脂的固化剂，含磷原子的低聚物是由下述结构式（1）表示的含磷原子的化合物与n表示0的混合物和磷由下述结构式（1）表示的含原子的低聚物，n表示1或更多：（其中R 1至R 5各自独立地表示氢原子，具有1至4个碳原子的烷基等; X表示氢原子或由结构式（x1）表示的结构单元：其中，在结构式（x1）中，R 2至R 5各自独立地表示氢原子，具有1至4个碳原子的烷基等），其中a 由n表示1以上的通式（1）表示的含磷原子的低聚物的含量在GPC测定的峰面积的基础上为5〜90％。

3. 发明授权

US08512466B2 Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board 有权
标题翻译：含磷低聚物及其制造方法，固化性树脂组合物及其固化物及印刷电路板
公开(公告)号：US08512466B2
公开(公告)日：2013-08-20
申请号：US13579913
申请日：2011-02-01
申请人： Koji Hayashi , Yutaka Satou
发明人： Koji Hayashi , Yutaka Satou
IPC分类号： C07F9/6571 , C08G59/40 , C08G59/62 , H01B3/40 , C08L63/00 , C08L63/10 , C08K5/5313
CPC分类号： C07F9/65746 , C07F9/306 , C07F9/657172 , C08G79/04 , Y10T428/31522 , Y10T428/31529
摘要： Phosphorus-containing oligomer is represented by formula (1): (R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the formula (x1) or (x2); and, in the formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the formula (1) is in the range of 5% to 90% in peak area in GPC measurement.
摘要翻译：含磷低聚物由式（1）表示：（R 1表示氢原子，具有1至4个碳原子的烷基，具有1至4个碳原子的烷氧基或苯基; n是重复的单位为1以上的整数，X为下述结构式（x1）或（x2）表示的结构单元，Y为氢原子，羟基或式（x1）所示的结构单元或（ x2）;在式（x1）或（x2）中，R2，R3，R4和R5各自独立地表示氢原子，碳原子数1〜4的烷基，苯基或芳烷基）其中，式（1）中n为2以上的成分的含量在GPC测定中的峰面积为5〜90％。

4. 发明申请

US20130040147A1 PHOSPHORUS-CONTAINING OLIGOMER AND METHOD FOR PRODUCING THE SAME, CURABLE RESIN COMPOSITION AND CURED PRODUCT OF THE SAME, AND PRINTED WIRING BOARD 有权
标题翻译：含磷的低聚物及其生产方法，可固化树脂组合物及其固化产物和印刷线路板
公开(公告)号：US20130040147A1
公开(公告)日：2013-02-14
申请号：US13579913
申请日：2011-02-01
申请人： Koji Hayashi , Yutaka Satou
发明人： Koji Hayashi , Yutaka Satou
IPC分类号： C09K3/00 , B32B15/092 , C08G65/02
CPC分类号： C07F9/65746 , C07F9/306 , C07F9/657172 , C08G79/04 , Y10T428/31522 , Y10T428/31529
摘要： [Object] A phosphorus-containing oligomer that has high solubility in an organic solvent and exhibits high flame retardancy and heat resistance in the form of a cured product thereof is provided. The phosphorus-containing oligomer is represented by structural formula (1) below (in the formula, R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, or a phenyl group; n is the number of repeating units and an integer of 1 or more; X is a structural unit represented by structural formula (x1) or (x2) below; Y is a hydrogen atom, a hydroxyl group, or a structural unit represented by the structural formula (x1) or (x2); and, in the structural formula (x1) or (x2), R2, R3, R4, and R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, or an aralkyl group), wherein the content of components whose n is 2 or more in the structural formula (1) is in the range of 5% to 90% in terms of peak area in GPC measurement.
摘要翻译：本发明提供了一种在有机溶剂中具有高溶解度且呈现出其固化产物形式的高阻燃性和耐热性的含磷低聚物。含磷低聚物由下述结构式（1）表示（式中，R1表示氢原子，碳原子数1〜4的烷基，碳原子数1〜4的烷氧基或苯基） n为重复单元数，1以上的整数，X为下述结构式（x1）或（x2）表示的结构单元，Y表示氢原子，羟基或由结构式（x1）或（x2）;在结构式（x1）或（x2）中，R2，R3，R4和R5各自独立地表示氢原子，碳原子数1〜4的烷基，苯基或芳烷基），其中结构式（1）中n为2以上的成分的含量以GPC测定的峰面积计算为5％〜90％的范围。

5. 发明申请

US20130144030A1 EPOXY COMPOUND, CURABLE COMPOSITION, AND CURED PRODUCT THEREOF 有权
标题翻译：环氧化合物，可固化组合物及其固化产品
公开(公告)号：US20130144030A1
公开(公告)日：2013-06-06
申请号：US13816084
申请日：2011-08-03
申请人： Yutaka Satou
发明人： Yutaka Satou
IPC分类号： C07D303/30
CPC分类号： C07D303/30 , C08G59/245 , C08G59/3218 , C08G59/621 , C08L63/00
摘要： A problem to be solved by the invention is to provide a novel epoxy resin exhibiting excellent performance with respect to heat resistance and low thermal expansibility of a cured product, a curable composition using the same, and a cured product having excellent heat resistance and low thermal expansibility. The curable composition contains an epoxy compound and a curing agent as essential components, a calixarene-type novel epoxy compound being used as the epoxy compound. The novel epoxy compound has a resin structure represented by structural formula 1 below (in the formula, R1s each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeat unit and an integer of 2 to 10).
摘要翻译：本发明要解决的问题是提供一种新型环氧树脂，其在耐热性和固化产物的热膨胀性低的情况下表现出优异的性能，使用其的可固化组合物和具有优异耐热性和低热性的固化产物可扩展性。固化性组合物含有作为必要成分的环氧化合物和固化剂，作为环氧化合物使用的杯芳烃型新型环氧化合物。新型环氧化合物具有下述结构式1所示的树脂结构（式中，R 1各自独立地表示氢原子，烷基或烷氧基，n为重复单元，2〜10的整数）。

6. 发明申请

US20110259628A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED WIRING BOARD, EPOXY RESIN, AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：可固化树脂组合物，其固化产品，印刷线路板，环氧树脂及其生产方法
公开(公告)号：US20110259628A1
公开(公告)日：2011-10-27
申请号：US13124694
申请日：2009-08-07
申请人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
发明人： Yutaka Satou , Kazuo Arita , Ichirou Ogura
IPC分类号： H05K1/09 , C08G59/02 , B32B37/00 , C08G59/14
CPC分类号： C08G59/08 , C08G59/3218 , H05K1/03 , H05K1/0326 , Y10T156/10 , Y10T428/249951
摘要： Provided is a curable resin composition that exhibits good heat resistance and low thermal expansion, and that realizes good solubility in solvents, a cured product thereof, a printed wiring board including the composition, a novel epoxy resin that imparts these properties, and a process for producing the same. A curable resin composition contains, as essential components, an epoxy resin (A) having, in its molecular structure, a glycidyloxy group and a skeleton in which a naphthalene structure and a cyclohexadienone structure are bonded to each other via methylene group(s); and a curing agent (B).
摘要翻译：本发明提供一种固化性树脂组合物，它具有良好的耐热性和低热膨胀性，并且在溶剂中具有良好的溶解性，其固化产物，包含该组合物的印刷线路板，赋予这些性能的新型环氧树脂，和生产相同。固化性树脂组合物含有作为必要成分的环氧树脂（A），其分子结构中含有萘结构和环己二烯酮结构通过亚甲基彼此键合的缩水甘油氧基和骨架; 和固化剂（B）。

7. 发明授权

US07835188B2 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US07835188B2
公开(公告)日：2010-11-16
申请号：US12361620
申请日：2009-01-29
申请人： Yutaka Satou , Fumiyasu Utsunomiya , Tomohiro Oka
发明人： Yutaka Satou , Fumiyasu Utsunomiya , Tomohiro Oka
IPC分类号： G11C16/00
CPC分类号： G11C29/50 , G11C16/04 , G11C29/50004
摘要： Provided is a semiconductor memory device, which realizes characteristic evaluation even in a case where a threshold voltage is a negative potential by a test method which is similar to a case of a positive potential. The semiconductor memory device includes a plurality of memory cells for storing data. When a test signal is input, the semiconductor memory device changes from a normal mode to a test mode for evaluating characteristics of the plurality of memory cells. The semiconductor memory device also includes: a memory cell selecting portion for selecting a memory cell; a constant voltage portion for generating a reference voltage; a constant current portion for generating a reference current; an X switch voltage switching control circuit for supplying one of an X selection signal and a voltage signal input from an external terminal to a gate of the memory cell; a Y switch portion for supplying the reference current to a drain of the memory cell selected by a Y selection signal; a comparator for detecting whether or not a drain voltage that is a voltage of the drain has exceeded the reference voltage; and a decision level changing portion for adjusting a current value of the reference current and a voltage value of the reference voltage so as to change a decision level of the comparator based on a control signal in the test mode.
摘要翻译：提供一种半导体存储器件，即使在通过与正电位的情况相似的测试方法的阈值电压为负电位的情况下也实现特性评估。半导体存储器件包括用于存储数据的多个存储单元。当输入测试信号时，半导体存储器件从正常模式改变为用于评估多个存储器单元的特性的测试模式。半导体存储装置还包括：存储单元选择部，用于选择存储单元; 用于产生参考电压的恒定电压部分; 用于产生参考电流的恒定电流部分; X开关电压切换控制电路，用于将X选择信号和从外部端子输入的电压信号中的一个提供给存储器单元的栅极; Y开关部分，用于将参考电流提供给由Y选择信号选择的存储器单元的漏极; 用于检测作为所述漏极的电压的漏极电压是否超过所述参考电压的比较器; 以及判定电平改变部分，用于调整参考电流的当前值和参考电压的电压值，以便基于测试模式中的控制信号来改变比较器的判定电平。

8. 发明申请

US20130131215A1 NOVEL PHENOL RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE THEREOF, AND PRINTED WIRING BOARD 审中-公开
标题翻译：新型酚醛树脂，可固化树脂组合物，固化物及其印刷线
公开(公告)号：US20130131215A1
公开(公告)日：2013-05-23
申请号：US13811749
申请日：2011-07-19
申请人： Yutaka Satou
发明人： Yutaka Satou
IPC分类号： C08G8/10 , C08G8/02
CPC分类号： C08G8/10 , C08G8/28 , C08G59/621 , C08L61/14 , H05K1/0326 , H05K1/0366 , H05K3/4676 , C08L63/00
摘要： There are provided a phenol resin which produces a cured product having excellent heat resistance and a low coefficient of thermal expansion, a curable resin composition containing the phenol resin as a curing agent for an epoxy resin, a cured product of the curable resin composition, and a printed circuit board having excellent heat resistance and low thermal expansibility.A novel phenol resin having a resin structure which is formed by oxidizing a polycondensate (a) of a naphthol compound and formaldehyde and in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded through a methylene bond is used as a curing agent for an epoxy resin.
摘要翻译：提供一种生产具有优异的耐热性和低热膨胀系数的固化产物的酚醛树脂，含有作为环氧树脂固化剂的酚醛树脂的固化性树脂组合物，可固化树脂组合物的固化产物和具有优异的耐热性和低热膨胀性的印刷电路板。使用通过氧化萘酚化合物和甲醛的缩聚物（a）和其中萘酚骨架（n）和萘醌骨架（q）通过亚甲基键键合而形成的树脂结构的新型酚醛树脂被用作环氧树脂固化剂。

9. 发明申请

US20110275739A1 EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，生产新型酚醛树脂的方法和生产新型环氧树脂的方法
公开(公告)号：US20110275739A1
公开(公告)日：2011-11-10
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08G65/40 , C08G59/04 , C08G59/62
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

10. 发明授权

US08263714B2 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin 有权
标题翻译：环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，新型酚醛树脂的制造方法以及新型环氧树脂的制造方法
公开(公告)号：US08263714B2
公开(公告)日：2012-09-11
申请号：US13157926
申请日：2011-06-10
申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
发明人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
IPC分类号： C08L63/00 , C08L61/06 , C08G59/00 , C08G8/04 , C08G14/02 , C08G65/38
CPC分类号： C08G8/10 , C08G59/621 , C08L61/06
摘要： An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
摘要翻译：包含环氧树脂和固化剂作为必要成分的环氧树脂组合物，其中固化剂包含具有含酚羟基的芳族烃基（P）的各结构部分的酚醛树脂，含烷氧基的芳族烃基（B）和二价芳烷基（X），并且在分子结构中还具有含酚性羟基的芳香族烃基（P）和含有烷氧基的芳香族烃基（B ）通过二价芳烷基（X）与其它含酚羟基的芳香族烃基（P）或含烷氧基的芳香族烃基（B）键合。

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