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1. 发明授权

US07628903B1 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07628903B1
公开(公告)日：2009-12-08
申请号：US09563479
申请日：2000-05-02
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobis(triglycerol), 3,3′-thiodipropanol, thiodiglycerin, 3,6-dithiooctane-1,8-diol, and the like, which contain at least one or more of an ether oxygen atom, a 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, and not containing a basic nitrogen atom. Compared to baths containing aliphatic monosulfide compounds, such as thiodiglycol or beta-thiodiglycol, which do not contain an ether oxygen atom, 1-hydroxypropyl group, a hydroxypropylene group, or two or more of a sulfide bond in the molecule, by having these particular compounds, the plating bath of the present invention has excellent stability over extended time, excellent co-deposition of silver and various metals, and excellent appearance of the electrodeposition coating.
摘要翻译：银和银合金电镀浴包括（A）可溶性盐，其具有银盐或银盐和金属如锡，铋，铟，铅等的盐的混合物; 和（B）特定的脂族硫醚化合物，例如硫代双（二甘醇），二硫代双（三甘油），3,3'-硫代二丙醇，硫二甘油，3,6-二硫辛烷-1,8-二醇等，至少一个或多个醚氧原子，1-羟丙基，羟基亚丙基，或分子中的硫原子键中的两个或多个，并且不含碱性氮原子。与分子中含有不含醚氧原子，1-羟丙基，羟基亚丙基或两个或多个硫键的脂族单硫醚化合物如硫二甘醇或β-硫二甘醇相比，具有这些特定化合物，本发明的电镀浴在延长的时间内具有优异的稳定性，优异的银和各种金属的共沉积，以及优异的电沉积外观。

2. 发明授权

US06607653B1 Plating bath and process for depositing alloy containing tin and copper 有权
标题翻译：电镀浴和沉积含锡和铜合金的工艺
公开(公告)号：US06607653B1
公开(公告)日：2003-08-19
申请号：US09667715
申请日：2000-09-22
申请人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
发明人： Kiyotaka Tsuji , Keigo Obata , Takao Takeuchi , Hidemi Nawafune , Tetsuji Nishikawa
IPC分类号： C25D358
CPC分类号： C25D3/60
摘要： The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
摘要翻译：本发明提供了含有可溶性金属化合物和特定含硫化合物的锡 - 铜合金电镀浴，锡 - 铜 - 铋合金电镀浴或锡 - 铜 - 银合金电镀浴。本发明的电镀液是含有锡和铜的合金电镀液，该浴能够防止铜在锡阳极上的沉积而被置换，镀层组合物对电流密度的依赖性低，浴的稳定性和耐浑浊

3. 发明授权

US07938948B2 Silver and silver alloy plating bath 有权
标题翻译：银和银合金电镀浴
公开(公告)号：US07938948B2
公开(公告)日：2011-05-10
申请号：US12553731
申请日：2009-09-03
申请人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
发明人： Kiyotaka Tsuji , Tetsuji Nishikawa , Takao Takeuchi , Keigo Obata , Hidemi Nawafune
IPC分类号： C25D3/46 , C25D3/64 , C23C18/31
CPC分类号： C25D3/46 , C25D3/64
摘要： To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom.
摘要翻译：开发稳定的非氰化银和银合金电镀浴。本发明是一种银和银合金电镀液，包括：（A）可溶性盐，其包含银盐或银盐和选自锡，铋，钴等的金属盐的混合物，锑，铱，铟，铅，铜，铁，锌，镍，钯，铂和金; 和（B）至少一种包含选自醚氧原子，3-羟基丙基和羟基亚丙基的官能团的脂族硫化物，条件是脂族硫化物不包含碱性氮原子。

4. 发明授权

US06235093B1 Aqueous solutions for obtaining noble metals by chemical reductive deposition 有权
标题翻译：通过化学还原沉积获得贵金属的水溶液
公开(公告)号：US06235093B1
公开(公告)日：2001-05-22
申请号：US09340892
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Keigo Obata , Yasuhito Kohashi , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C23C18/44
摘要： An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto compound or sulfide compound or a salt thereof as a reducing agent. The reducing agent is typically mercaptoacetic acid, 2-mercaptopropionic acid, 2-aminoethanethiol, 2-mercaptoethanol, glucose cysteine, 1-thioglycerol, sodium mercaptopropanesulfonate, N-acetylmethionine, thiosalicylic acid, 2-thiazoline-2-thiol, 2,5-dimercapto-1,3,4-thiadiazole, 2-benzothiazolethiol, or 2-benzimidazolethiol. They may be used singly or in combination.
摘要翻译：一种用于通过化学还原获得贵金属的水溶液，其含有至少一种选自金，铂，银和钯的金属的水溶性化合物或络合物作为待沉积金属的来源，以及在至少一种巯基化合物或硫化物化合物或其盐作为还原剂。还原剂通常为巯基乙酸，2-巯基丙酸，2-氨基乙硫醇，2-巯基乙醇，葡萄糖半胱氨酸，1-硫代甘油，巯基丙磺酸钠，N-乙酰基甲硫氨酸，硫代水杨酸，2-噻唑啉-2-硫醇，二巯基-1,3,4-噻二唑，2-苯并噻唑硫醇或2-苯并咪唑硫醇。它们可以单独使用或组合使用。

5. 发明授权

US06183545B2 Aqueous solutions for obtaining metals by reductive deposition 有权
标题翻译：用于通过还原沉积获得金属的水溶液
公开(公告)号：US06183545B2
公开(公告)日：2001-02-06
申请号：US09340894
申请日：1999-06-28
申请人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Takao Takeuchi , Masakazu Yoshimoto , Shigeru Takatani , Emiko Tanaka , Masayuki Nishino , Yuji Kato , Yasuhito Kohashi , Kyoko Kuba , Tetsuya Kondo , Keiji Shiomi , Keigo Obata , Mitsuo Komatsu , Hidemi Nawafune
IPC分类号： C23C1831
CPC分类号： C25D3/02 , C22B3/0051 , C22B11/046 , C23C18/42 , Y02P10/214 , Y02P10/234
摘要： An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1) in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.
摘要翻译：一种用于金属还原沉积的水溶液，除了水以外还包含（A）通式（1）的膦，其中R 1，R 2和R 3表示低级烷基，其中至少一个是羟基或氨基 - 取代的低级烷基，和（B）通过所述膦形成可溶性络合物而溶解的金属或金属化合物的可溶性化合物。

6. 发明授权

US07166152B2 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method 有权
标题翻译：用于提供化学镀的催化剂的预处理溶液，使用该溶液的预处理方法以及使用该方法生产的无电镀膜和/或电镀对象
公开(公告)号：US07166152B2
公开(公告)日：2007-01-23
申请号：US10636447
申请日：2003-08-07
申请人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
发明人： Yoshiaki Okuhama , Keigo Obata , Masakazu Yoshimoto , Kim Dong Hyun , Shingo Kitamura , Seiichiro Nakao , Hidenori Tsuji , Hidemi Nawafune
IPC分类号： C23C18/28
CPC分类号： C23C18/28
摘要： A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.
摘要翻译：提供了一种用于提供无电镀的催化剂的预处理溶液和使用该溶液的预处理方法。所述预处理溶液包含至少含有以下成分（I），（II）和（III）作为必要成分的银胶体溶液：（I）银胶体粒子，（II）一种或多种离子，选自具有可以将银离子还原成溶液中的金属银的金属和在银离子还原时被氧化的离子的金属，和（III）一种或多种选自羟基羧酸根离子，缩合磷酸根离子和胺羧酸根离子，银胶体粒子（I）由金属（II）的离子产生，具有可以将银离子还原成金属银的电位。当通过使用预处理溶液预处理要镀覆的物体时，实现无电镀的有效催化剂。

7. 发明授权

US4804410A Palladium-base electroless plating solution 失效
标题翻译：钯基化学镀溶液
公开(公告)号：US4804410A
公开(公告)日：1989-02-14
申请号：US128111
申请日：1987-10-21
申请人： Masaki Haga , Kiyotaka Tsuji , Hidemi Nawafune , Shozo Mizumoto , Ei Uchida
发明人： Masaki Haga , Kiyotaka Tsuji , Hidemi Nawafune , Shozo Mizumoto , Ei Uchida
IPC分类号： C23C18/44 , H05K3/24 , C09D5/38 , B22F7/00 , C09D5/00
CPC分类号： C23C18/44 , H05K3/244
摘要： The present invention provides a palladium-base electroless plating solution which is excellent in stability and which is capable of forming a satisfactory palladium-base deposit, the solution being an aqueous solution containing (a) a palladium compound, (b) at least one compound of ammonia and amine compounds, (c) an organic compound containing bivalent sulfur, and (d) at least one compound of hypophosphorous acid compounds and boron hydride compounds, and a palladium-base electroless plating solution containing a nickel compound in addition to said electroless plating solution.
摘要翻译： PCT No.PCT / JP87 / 00113 Sec。 371日期：1987年10月21日 102（e）1987年10月21日日期PCT提交1987年2月21日PCT公布。公开号WO87 / 05338 日本公报1987年9月11日。本发明提供一种钯 - 基化学镀溶液，其稳定性优异，能够形成令人满意的钯 - 基沉积物，该溶液为含有（a）钯化合物的水溶液，（b）至少一种氨和胺化合物的化合物，（c）含有二价硫的有机化合物，和（d）至少一种次磷酸化合物和硼氢化合物的化合物，以及钯基化学镀溶液，镍化合物除了所述化学镀溶液之外。

8. 发明授权

US08261437B2 Method for manufacturing a circuit board 失效
标题翻译：电路板制造方法
公开(公告)号：US08261437B2
公开(公告)日：2012-09-11
申请号：US12525967
申请日：2008-02-27
申请人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
发明人： Hiroshi Yanagimoto , Takeshi Bessho , Hidemi Nawafune , Kensuke Akamatsu
IPC分类号： H05K3/02
CPC分类号： H05K3/107 , H05K3/20 , H05K3/207 , H05K3/246 , H05K2201/0347 , H05K2201/09736 , H05K2203/0108 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158
摘要： According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold 10, which has protrusions 11 formed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste) 13 to head portions of the protrusions 11 of the mold 10. The mold is heat- and pressure-welded to the surface of a substrate 20 that is made of a resin film or the like. Accordingly, a pattern comprising the protrusions 11 and the conductive material layer (metal paste) 13 are transferred to the substrate 20. After transfer, the resin substrate (resin molding 30) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recess 31 while the conductive material layer 13 is used as a base material for the formation of a metal wiring 32. A pattern of the recesses 31 transferred to the substrate-20 side is determined depending on a pattern comprising the protrusions 11 on the mold 10. Thus, a microfabricated high-density circuit pattern formed with metal wirings 32 having arbitrary aspect ratios can be obtained.
摘要翻译：根据本发明，可以获得可以进一步简化的步骤制造的具有更微细加工电路图案的电路板。为此目的，使用具有与电路图案相对应的图案形成的突起11的模具10，将导电材料层（金属糊）13施加到模具10的突起11的头部。模具为热压并且被压焊到由树脂膜等制成的基板20的表面上。因此，将包括突起11和导电材料层（金属膏）13的图案转印到基板20上。转印后，将树脂基板（树脂成型体30）浸渍在用于电解电镀处理的硫酸铜电镀浴中。将电镀液中的铜离子沉积在每个凹部31内，同时使用导电材料层13作为形成金属布线32的基材。转移到基板20侧的凹部31的图案根据在模具10上包括突起11的图案。因此，可以获得由具有任意长宽比的金属布线32形成的微细加工的高密度电路图案。

9. 发明申请

US20050164020A1 Composite material with improved binding strength and method for forming the same 审中-公开
标题翻译：具有改善结合强度的复合材料及其形成方法
公开(公告)号：US20050164020A1
公开(公告)日：2005-07-28
申请号：US11041682
申请日：2005-01-24
申请人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Masaru Kusaka , Koichi Yomogida , Hidemi Nawafune , Syozo Mizumoto , Shingo Ikeda
发明人： Masaru Seita , Hideki Tsuchida , Masaaki Imanari , Masaru Kusaka , Koichi Yomogida , Hidemi Nawafune , Syozo Mizumoto , Shingo Ikeda
IPC分类号： B32B15/08 , C23C18/16 , C23C18/31 , C23C18/40 , C23C18/50 , C23C30/00 , H05K3/18 , H05K3/22
CPC分类号： H05K3/181 , C23C30/00 , H05K3/22 , H05K2203/0278 , H05K2203/121 , Y10T428/12014 , Y10T428/31692
摘要： This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
摘要翻译：本发明提供了具有改进的结合强度的复合材料及其制造方法。特别地，本发明提供一种在树脂基材的表面具有金属的复合材料，其通过使树脂基材的表面进行离子交换基团导入处理，用含有金属离子的液体处理所述树脂基材的表面，以及然后还原所述金属离子，其中上述复合材料树脂的特征在于所述复合材料的树脂基材和金属被热压。所述复合材料相对于通过化学镀获得的复合材料，树脂基材和金属之间的粘合强度差，具有优异的粘结强度。此外，所述复合材料容易制造，因为可以使用热压法来形成所述复合材料。

10. 发明申请

US20060165877A1 Method for forming inorganic thin film pattern on polyimide resin 审中-公开
标题翻译：在聚酰亚胺树脂上形成无机薄膜图案的方法
公开(公告)号：US20060165877A1
公开(公告)日：2006-07-27
申请号：US11315200
申请日：2005-12-23
申请人： Hiroshi Yanagimoto , Hidemi Nawafune , Kensuke Akamatsu
发明人： Hiroshi Yanagimoto , Hidemi Nawafune , Kensuke Akamatsu
IPC分类号： B05D3/00 , B05D5/12
CPC分类号： C23C18/06 , C23C18/04 , C23C18/08 , C23C18/1216 , C23C18/1245 , C23C18/1275 , C23C18/1295 , H05K1/0346 , H05K3/0032 , H05K3/107 , H05K3/184 , H05K3/381 , H05K2201/0154 , H05K2201/0326 , H05K2203/0793 , H05K2203/1157 , H05K2203/1163
摘要： The present invention provides 1. A method for forming an inorganic thin film pattern on a polyimide resin, which has: (1) a step of forming an alkali-resistant protective film having a thickness of 0.01 to 10 μm on a surface of a polyimide resin; (2) a step of removing the alkali-resistant protective film and a superficial portion of the polyimide resin at the site where an inorganic thin film pattern is formed to form a concave part; (3) a step of contacting an alkaline aqueous solution to the polyimide resin in the concave part to cleave an imide ring of the polyimide resin so as to produce a carboxyl group whereby a polyimide resin having the carboxyl group is formed; (4) a step of contacting a solution containing a metal ion to the polyimide resin having the carboxyl group so as to produce a metal salt of the carboxyl group; and (5) a step of separating the metal salt as a metal, a metal oxide or a semiconductor on the surface of the polyimide resin so as to form the inorganic thin film pattern.
摘要翻译：本发明提供一种在聚酰亚胺树脂上形成无机薄膜图案的方法，其特征在于：（1）在聚酰亚胺的表面上形成厚度为0.01〜10μm的耐碱性保护膜的工序树脂; （2）在形成无机薄膜图案的部位除去耐碱性保护膜和聚酰亚胺树脂的表面部分以形成凹部的步骤; （3）将碱性水溶液与凹部中的聚酰亚胺树脂接触以将聚酰亚胺树脂的酰亚胺环切断以产生羧基，从而形成具有羧基的聚酰亚胺树脂的工序; （4）使含有金属离子的溶液与具有羧基的聚酰亚胺树脂接触以产生羧基金属盐的步骤; 和（5）在聚酰亚胺树脂的表面上分离作为金属的金属盐，金属氧化物或半导体以形成无机薄膜图案的步骤。

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