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    • 2. 发明授权
    • Method for charging substrate to a potential
    • 将基板充电到电位的方法
    • US07507959B2
    • 2009-03-24
    • US11644591
    • 2006-12-21
    • Kirk J. BertscheMark A. McCord
    • Kirk J. BertscheMark A. McCord
    • H01J37/14H01J37/28
    • G21K7/00H01J37/026H01J2237/0045H01J2237/0048
    • A surface of an insulating substrate is charged to a target potential. In one embodiment, the surface is flooded with a higher-energy electron beam such that the electron yield is greater than one. Subsequently, the surface is flooded with a lower-energy electron beam such that the electron yield is less than one. In another embodiment, the substrate is provided with the surface in a state at an approximate initial potential above the target potential. The surface is then flooded with charged particle such that the charge yield of scattered particles is less than one, such that a steady state is reached at which the target potential is achieved. Another embodiment pertains to an apparatus for charging a surface of an insulating substrate to a target potential.
    • 将绝缘基板的表面充电至目标电位。 在一个实施方案中,表面充满了较高能量的电子束,使得电子产率大于1。 随后,表面被低能电子束淹没,使得电子产率小于1。 在另一个实施例中,衬底被提供有处于大于目标电位的初始电位的状态的表面。 然后用带电粒子充满表面,使得散射颗粒的电荷产率小于1,使得达到达到目标电势的稳定状态。 另一个实施例涉及一种用于将绝缘衬底的表面充电到目标电位的装置。
    • 4. 发明授权
    • Method for charging substrate to a potential
    • 将基板充电到电位的方法
    • US07176468B2
    • 2007-02-13
    • US10942184
    • 2004-09-16
    • Kirk J. BertscheMark A. McCord
    • Kirk J. BertscheMark A. McCord
    • H01J37/244
    • G21K7/00H01J37/026H01J2237/0045H01J2237/0048
    • A surface of an insulating substrate is charged to a target potential. In one embodiment, the surface is flooded with a higher-energy electron beam such that the electron yield is greater than one. Subsequently, the surface is flooded with a lower-energy electron beam such that the electron yield is less than one. In another embodiment, the substrate is provided with the surface in a state at an approximate initial potential above the target potential. The surface is then flooded with charged particle such that the charge yield of scattered particles is less than one, such that a steady state is reached at which the target potential is achieved. Another embodiment pertains to an apparatus for charging a surface of an insulating is substrate to a target potential.
    • 将绝缘基板的表面充电至目标电位。 在一个实施方案中,表面充满了较高能量的电子束,使得电子产率大于1。 随后,表面被低能电子束淹没,使得电子产率小于1。 在另一个实施例中,衬底被提供有处于大于目标电位的初始电位的状态的表面。 然后用带电粒子充满表面,使得散射颗粒的电荷产率小于1,使得达到达到目标电势的稳定状态。 另一个实施例涉及一种用于将绝缘体的表面充电至靶电位的装置。
    • 10. 发明授权
    • Ribbon electron beam for inspection system
    • 带状电子束检查系统
    • US06822246B2
    • 2004-11-23
    • US10109168
    • 2002-03-27
    • Kirk J. Bertsche
    • Kirk J. Bertsche
    • H01J3708
    • H01J37/28H01J2237/0492H01J2237/083H01J2237/2817
    • Apparatus configurations are disclosed for generating a ribbon-like beam that impinges onto a target specimen as an elongated spot. The elongated spot has a first dimension that is substantially elongated in comparison to a second dimension. The configuration may be non-axisymmetric and include means for point-to-parallel focusing in the first dimension and point-to-point focusing in the second dimension. In accordance with one embodiment, the apparatus may include a first lens subsystem for transforming the electron beam into an intermediate-stage beam, and a second lens subsystem for focusing the intermediate-stage beam into the elongated spot. Methods are disclosed for focusing the electron beam into the elongated spot. In accordance with one embodiment, a method may include transforming the electron beam into an intermediate-stage beam, and focusing the intermediate-stage beam into a ribbon-like beam that impinges onto a target specimen as an elongated spot.
    • 公开了用于产生作为细长斑点撞击到靶标本上的带状束的装置结构。 细长点具有与第二尺寸相比基本上细长的第一尺寸。 该配置可以是非轴对称的,并且包括在第一维度中的点对平行聚焦和在第二维度中的点对点聚焦的装置。 根据一个实施例,该装置可以包括用于将电子束转换成中间级光束的第一透镜子系统和用于将中间级光束聚焦到细长光斑中的第二透镜子系统。 公开了用于将电子束聚焦到细长点中的方法。 根据一个实施例,一种方法可以包括将电子束转换成中间级光束,并将中间级光束聚焦成作为细长光斑撞击到目标样本上的带状光束。