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    • 6. 发明申请
    • SPUTTER TOOL
    • 飞溅工具
    • US20160177439A1
    • 2016-06-23
    • US14578332
    • 2014-12-19
    • Yu-Chen ShenTaiqing QiuRobe WoehlKieran Mark TracyMukul Agrawal
    • Yu-Chen ShenTaiqing QiuRobe WoehlKieran Mark TracyMukul Agrawal
    • C23C14/50C23C14/34
    • C23C14/50C23C14/165C23C14/34C23C14/3464H01J37/32715
    • Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.
    • 描述了溅射工具。 在一个实施例中,用于支撑晶片的装置包括具有用于接收晶片的凹陷的托盘。 托盘包括在凹陷下方的开口,并且凹陷中的边缘将晶片支撑在开口上。 盖子至少部分地覆盖开口。 在一个示例中,盖可以是具有一个或多个孔的板,并且管可以位于盖中的每个孔下方。 在一个实施例中,晶片处理系统包括处理室和具有凹陷的托盘以接收晶片。 托盘在凹陷下方具有开口,并且凹陷中的边缘将晶片支撑在开口上方。 在一个这样的实施例中,盖至少部分地覆盖开口。 根据一个实施例,能量吸收材料设置在托盘中的开口下方。