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1. 发明授权

US07094822B2 Thermally conductive elastomeric pad 有权
标题翻译：导热弹性垫
公开(公告)号：US07094822B2
公开(公告)日：2006-08-22
申请号：US10870629
申请日：2004-06-17
申请人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
发明人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
IPC分类号： C08K3/00
CPC分类号： H05K1/0209 , B29C45/0013 , B29C70/58 , B29K2021/00 , B29K2995/0013 , H05K3/284 , H05K3/285 , H05K2201/0133 , H05K2201/0209 , H05K2201/0215 , Y10T428/12028 , Y10T428/12111 , Y10T428/12153 , Y10T428/2958
摘要： The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
摘要翻译：本发明涉及导热弹性垫。垫可以通过注塑成型包含约30至60体积％的弹性体聚合物基质和约25至60体积％的导热填料的导热组合物来制备。所得到的垫片具有传热性能，并且可以用作热界面以保护发热电子器件。

2. 发明授权

US06585039B2 Composite overmolded heat pipe construction 有权
标题翻译：复合包覆成型热管施工
公开(公告)号：US06585039B2
公开(公告)日：2003-07-01
申请号：US09774519
申请日：2001-01-31
申请人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
发明人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
IPC分类号： F28F700
CPC分类号： F28D15/02 , B29C45/14622 , B29C45/14819 , B29K2105/16 , B29K2995/0013 , F28F2255/146 , H01L23/427 , H01L23/552 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/4998 , H01L2924/00
摘要： The present invention discloses a heat pipe construction that includes a heat pipe with phase change media therein with a conductive composition molded about the heat pipe. The thermally conductive composition absorbs or reflects electro magnetic interference waves and prevents their transmission into and through the heat pipe to the electronic components being cooled by the heat pipe.
摘要翻译：本发明公开了一种热管结构，其包括其中具有相变介质的热管，导热组合物围绕热管模制。导热组合物吸收或反射电磁干扰波，并防止它们传输进入并通过热管到由热管冷却的电子部件。

3. 发明授权

US06547001B2 Flexible glove-like heat sink 有权
公开(公告)号：US06547001B2
公开(公告)日：2003-04-15
申请号：US10064069
申请日：2002-06-06
申请人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
发明人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
IPC分类号： F28F700
CPC分类号： H01L23/3675 , B21D53/02 , H01L23/4093 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly for removing heat from an object having an outer surface includes a main body with an object receiving seat. A pair of flexible securing tabs are connected to the free edge of the open end of the main body which emanate into the open end of the main body. A heat dissipation members emanate from the outer surface of the main body to assist in dissipating the heat received by the main body from the heat generating object. The main body, the pair of flexible securing tabs and heat dissipating members are integrally formed with one another of a thermally conductive elastic or elastomeric material. An object to be cooled is inserted into the object receiving seat of the main body and retained in the seat and in communication with the inner surfaces of the main body by the pair of flexible securing tabs.

4. 发明授权

US06543524B2 Overplated thermally conductive part with EMI shielding 有权
公开(公告)号：US06543524B2
公开(公告)日：2003-04-08
申请号：US09886629
申请日：2001-06-21
申请人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
发明人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
IPC分类号： F28F1318
CPC分类号： F28F21/06 , F28F13/18 , H01L23/36 , H01L23/552 , H01L2924/0002 , Y10S165/905 , H01L2924/00
摘要： A net-shape molded heat transfer component is provided which includes a thermally conductive core and a metallic coating for reflection of electromagnetic interference and radio frequency waves. The heat transfer component is formed by net-shape molding a core body from a thermally conductive composition, such as a polymer composition, and applying a metallic coating. The molded heat transfer part is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. Additionally, the part is shielded from electromagnetic interference and radio frequency waves, thus preventing the transfer of same into the circuitry housed by the part. In addition, the coating also seals the conductive polymer core against moisture infiltration, making the part well suited for telecommunications applications in potentially harsh environments.

5. 发明授权

US07476702B2 Polymer electronic device package having high thermal conductivity and dielectric strength 失效
标题翻译：具有高导热性和介电强度的聚合物电子器件封装
公开(公告)号：US07476702B2
公开(公告)日：2009-01-13
申请号：US11118057
申请日：2005-04-29
申请人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
发明人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
IPC分类号： C08K3/10 , C08K3/40 , H01L23/29
CPC分类号： C08K3/22 , C08K3/28 , H01B3/30 , H01B3/301
摘要： A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
摘要翻译：提供了具有高导热性和介电强度的聚合物组合物。聚合物组合物包含基础聚合物基质和导热的电绝缘材料。可以在组合物中添加玻璃等增强材料。聚合物组合物可以模制成用于诸如电容器，晶体管和电阻器的电子器件的包装组件。

6. 发明授权

US06851869B2 Highly thermally conductive electronic connector 失效
标题翻译：高导热电子连接器
公开(公告)号：US06851869B2
公开(公告)日：2005-02-08
申请号：US09916056
申请日：2001-07-26
申请人： James D. Miller , E. Mikhail Sagal , Kevin A. McCullough
发明人： James D. Miller , E. Mikhail Sagal , Kevin A. McCullough
IPC分类号： G02B6/38 , G02B6/42 , H05K7/20 , H05K9/00 , G02B6/36
CPC分类号： H05K9/0083 , G02B6/3814 , G02B6/4201 , G02B6/4246 , G02B6/4272 , G02B6/4277 , G02B6/4284 , H05K7/20
摘要： The electronic connector (10) includes an improved heat dissipating housing for cooling heat generating devices located within the connector (10). The electronic connector (10) of the present invention enables the cost-effective cooling of electronic devices (22, 24) within the connector (10) while realizing superior thermal conductivity and improved electromagnetic shielding. A method of forming an electronic connector (10) that includes the steps of first providing a heat generating electronic component (22, 24) capable of electronically coupling two data devices together having a first port (16a) and a second port (16b). This component (22, 24) is typically mounted or installed into a circuit board (20). An outer housing (12) of moldable thermally conductive polymer material (102, 202, 302, 402) is overmolded around the heat generating electronic component (22, 24) leaving the first port (16a) and the second port (16b) of connector (10) exposed.
摘要翻译：电子连接器（10）包括改进的散热壳体，用于冷却位于连接器（10）内的发热装置。本发明的电子连接器（10）能够在实现优良的导热性和改善的电磁屏蔽的同时，在连接器（10）内对电子设备（22,24）进行成本有效的冷却。一种形成电子连接器（10）的方法，包括以下步骤：首先提供能够将具有第一端口（16a）和第二端口（16b）的两个数据装置电连接的发热电子部件（22,24）。该组件（22,24）通常安装或安装到电路板（20）中。可模制导热聚合物材料（102,202,302,402）的外壳（12）围绕发热电子部件（22,24）包覆模制，离开第一端口（16a）和连接器的第二端口（16b）（10）暴露。

7. 发明授权

US06827470B2 Thermally conductive lamp reflector 有权
标题翻译：导热灯反光板
公开(公告)号：US06827470B2
公开(公告)日：2004-12-07
申请号：US10229557
申请日：2002-08-28
申请人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
发明人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
IPC分类号： F21V700
CPC分类号： F21V29/505 , F21S41/321 , F21S41/37 , F21S45/47 , F21S45/48 , F21V7/22 , H01J5/16
摘要： A thermally conductive lamp reflector is provided that dissipates heat from a light source within the reflector. The reflector assembly includes a shell having a metallized layer on its surface. The shell is made from a composition including about 30% to about 80% by volume of a base polymer matrix and about 20% to about 70% by volume of a thermally conductive filler material. The reflector has a thermal conductivity of greater than 3 W/m° K and preferably greater than 22 W/m° K. The reflectors can be used in automotive headlamps, flashlights, and other lighting fixtures. A method of forming the lamp reflector is also provided.
摘要翻译：提供一种散热来自反射器内的光源的导热灯反射器。反射器组件包括在其表面上具有金属化层的壳体。外壳由包含约30％至约80％体积的基础聚合物基质和约20％至约70％体积的导热填料的组合物制成。反射器的热导率大于3W / m°K，优选大于22W / m°K.反射器可用于汽车前照灯，手电筒和其他照明灯具。还提供了一种形成灯反射器的方法。

8. 发明授权

US06487073B2 Thermally conductive electronic device case 有权
标题翻译：导热电子器件外壳
公开(公告)号：US06487073B2
公开(公告)日：2002-11-26
申请号：US09726141
申请日：2000-11-29
申请人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
发明人： Kevin A. McCullough , E. Mikhail Sagal , James D. Miller
IPC分类号： G06F120
CPC分类号： H05K9/0022 , G06F1/203 , H01L23/3675 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H05K7/20409 , H01L2924/00
摘要： A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.
摘要翻译：提供了用于从电子设备散热的情况。该情况包括其上安装有发热电子部件的电子电路板。屏蔽层位于电子元件上方，以防止电磁干扰。屏蔽包括通过其顶表面的孔。传热导管被模制到孔中并通过孔与接触发热电子部件的顶表面接触。由导热材料制成的外壳与传导导管的顶部表面接触，延伸到屏蔽外部。结果，通过传热导管从电子元件和电子设备的壳体散发热量，同时屏蔽电子部件免受电磁干扰。

9. 发明授权

US07038009B2 Thermally conductive elastomeric pad and method of manufacturing same 失效
公开(公告)号：US07038009B2
公开(公告)日：2006-05-02
申请号：US10225924
申请日：2002-08-22
申请人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
发明人： E. Mikhail Sagal , Kevin A. McCullough , James D. Miller
IPC分类号： C08F6/00
CPC分类号： H05K1/0209 , B29C45/0013 , B29C70/58 , B29K2021/00 , B29K2995/0013 , H05K3/284 , H05K3/285 , H05K2201/0133 , H05K2201/0209 , H05K2201/0215 , Y10T428/12028 , Y10T428/12111 , Y10T428/12153 , Y10T428/2958
摘要： The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

10. 发明授权

US06981805B2 Molded electronic connector formed from a thermally conductive polymer composition and method of making the same 有权
标题翻译：由导热聚合物组合物形成的模制电子连接器及其制造方法
公开(公告)号：US06981805B2
公开(公告)日：2006-01-03
申请号：US11011996
申请日：2004-12-14
申请人： James D. Miller , E. Mikhail Sagal , Kevin A. McCullough
发明人： James D. Miller , E. Mikhail Sagal , Kevin A. McCullough
IPC分类号： G02B6/36 , H01R13/00
CPC分类号： H05K9/0083 , G02B6/3814 , G02B6/4201 , G02B6/4246 , G02B6/4272 , G02B6/4277 , G02B6/4284 , H05K7/20
摘要： An electronic connector having a housing containing a circuit board with a heat-generating component, such as a photodiode or laser, is provided. The housing is molded over the circuit board and heat-generating component. The housing is made from a moldable, thermally conductive polymer composition containing a base polymer and thermally conductive filler material. Liquid crystal polymers can be used as the base polymer, and boron nitride particles and carbon fibers can be used as the thermally conductive filler materials. In one embodiment, the thermally conductive polymer composition includes 30 to 60% of a base polymer, 25% to 50% of a first thermally conductive filler material, and 10 to 25% of a second thermally conductive filler material. The molded housing is capable of dissipating heat from the heat-generating component. A method for making the electronic connector is also provided.
摘要翻译：提供一种电子连接器，其具有包含具有诸如光电二极管或激光器之类的发热部件的电路板的壳体。外壳在电路板和发热部件上模制。壳体由含有基础聚合物和导热填料的可模制的导热聚合物组合物制成。可以使用液晶聚合物作为基础聚合物，可以使用氮化硼颗粒和碳纤维作为导热填料。在一个实施方案中，导热聚合物组合物包含30至60％的基础聚合物，25％至50％的第一导热填料材料和10至25％的第二导热填料材料。模制外壳能够散发来自发热部件的热量。还提供了制造电子连接器的方法。

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