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1. 发明授权

US06905912B2 Semiconductor device and method for fabricating the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06905912B2
公开(公告)日：2005-06-14
申请号：US10407185
申请日：2003-04-07
申请人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
发明人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
IPC分类号： H01L23/12 , H01L21/56 , H01L21/98 , H01L23/29 , H01L23/31 , H01L25/065 , H01L25/07 , H01L25/18 , H05K1/18 , H01L21/44 , H01L21/50
CPC分类号： H05K1/186 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/15787 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.
摘要翻译：半导体芯片安装在基板的第一表面上，该基板具有形成在第一表面上的布线，使得半导体芯片的电路形成表面面向基板的第一表面，并且设置在电路形成表面上的电极是与接线连接。然后在基板的第一表面上形成密封树脂层以覆盖半导体芯片。密封树脂层和半导体芯片从与电路形成表面相对的表面开始研磨以使半导体芯片变薄。

2. 发明授权

US07154189B2 Semiconductor device and method for fabricating the same 有权
公开(公告)号：US07154189B2
公开(公告)日：2006-12-26
申请号：US11035986
申请日：2005-01-18
申请人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
发明人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H05K1/186 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/15787 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

3. 发明申请

US20050121761A1 Semiconductor device and method for fabricating the same 有权
公开(公告)号：US20050121761A1
公开(公告)日：2005-06-09
申请号：US11035986
申请日：2005-01-18
申请人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
发明人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
IPC分类号： H01L23/12 , H01L21/56 , H01L21/98 , H01L23/29 , H01L23/31 , H01L25/065 , H01L25/07 , H01L25/18 , H05K1/18 , H01L23/02
CPC分类号： H05K1/186 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/15787 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

4. 发明授权

US06582991B1 Semiconductor device and method for fabricating the same 失效
公开(公告)号：US06582991B1
公开(公告)日：2003-06-24
申请号：US09886997
申请日：2001-06-25
申请人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
发明人： Kenji Maeda , Takashi Takata , Takao Ochi , Hiroki Naraoka , Takeshi Kawabata , Yoshiyuki Arai , Shigeru Nonoyama , Hajime Homma
IPC分类号： H01L2144
CPC分类号： H05K1/186 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/83101 , H01L2224/83102 , H01L2224/83192 , H01L2224/92125 , H01L2224/97 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/15787 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

5. 发明授权

US06433285B1 Printed wiring board, IC card module using the same, and method for producing IC card module 有权
公开(公告)号：US06433285B1
公开(公告)日：2002-08-13
申请号：US09735792
申请日：2000-12-14
申请人： Kenji Maeda , Takashi Takata , Hiroki Naraoka , Hajime Homma , Shigeru Nonoyama , Yoshiyuki Arai , Yuichiro Yamada , Fumito Ito
发明人： Kenji Maeda , Takashi Takata , Hiroki Naraoka , Hajime Homma , Shigeru Nonoyama , Yoshiyuki Arai , Yuichiro Yamada , Fumito Ito
IPC分类号： H05K116
摘要： The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.

6. 发明授权

US11138957B2 Endpin main body fixing member and fixing tool, and musical instrument equipped with fixing tool 有权
公开(公告)号：US11138957B2
公开(公告)日：2021-10-05
申请号：US17256538
申请日：2019-10-21
申请人： Yoshitomo Arai , Yoshiyuki Arai
发明人： Yoshitomo Arai , Yoshiyuki Arai
IPC分类号： G10D3/01 , G10D1/02
摘要： A main body fixing member is disclosed. The main body fixing member fixes an endpin including a shaft portion having a first end housed in a musical instrument main body and a second end stood on a floor. The shaft portion is provided with a recess. The main body fixing member includes a fitting portion, a through hole through which the shaft portion of the endpin extends, an opening disposed orthogonal to the through hole and having a bottom surface, a columnar member, a biasing portion, and a pressing portion. The columnar member is provided with a hole through which the shaft portion extends, and an engagement protrusion engaged with the recess of the shaft portion. The engagement protrusion is formed on an inner surface of the hole. The pressing portion presses the shaft portion inserted into the through hole and the hole via the columnar member.

7. 发明授权

US07138706B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07138706B2
公开(公告)日：2006-11-21
申请号：US10608295
申请日：2003-06-24
申请人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Kouichi Yamauchi , Yasutake Yaguchi
发明人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Kouichi Yamauchi , Yasutake Yaguchi
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , H01L25/0652 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/731 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/92125 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/06568 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/1815 , H01L2924/18161 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.
摘要翻译：提供具有优异的散热特性的半导体器件，其在安装在诸如蜂窝电话等的电子设备中时可以实现高可靠性及其制造方法。半导体器件包括基板，通过在其上顶层叠一个而安装在基板上的多个半导体芯片以及由密封树脂制成的封装树脂层。在多个半导体芯片中，作为最上半导体芯片的第一半导体芯片的表面安装有面向基板的电路，并且形成密封树脂层，使得至少第一半导体芯片与形成电路的表面相对，并且第一半导体芯片的一部分侧表面暴露于封装树脂层的外部。

8. 发明申请

US20060091563A1 Semiconductor device and method for fabricating the same 审中-公开
公开(公告)号：US20060091563A1
公开(公告)日：2006-05-04
申请号：US11282726
申请日：2005-11-21
申请人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Yasutake Yaguchi
发明人： Yoshiyuki Arai , Takashi Yui , Yoshiaki Takeoka , Fumito Itou , Yasutake Yaguchi
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/563 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0657 , H01L2224/05554 , H01L2224/05599 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/83102 , H01L2224/85399 , H01L2224/92125 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

9. 发明授权

US06825915B2 Alignment device 失效
标题翻译：对准装置
公开(公告)号：US06825915B2
公开(公告)日：2004-11-30
申请号：US10362461
申请日：2003-02-25
申请人： Akira Yamauchi , Yoshiyuki Arai , Chisa Inaka , Eiji Shamoto , Toshimichi Moriwaki
发明人： Akira Yamauchi , Yoshiyuki Arai , Chisa Inaka , Eiji Shamoto , Toshimichi Moriwaki
IPC分类号： G03B2742
CPC分类号： H01L21/67294 , B23Q1/34 , G03F7/707 , G03F7/70708 , H01L21/67259 , H01L21/68
摘要： An alignment device comprising a movable table, a plurality of movable support means for movably supporting the movable table, means for reading a recognition mark, and a control means for controlling the drive of the movable support means based on information from the recognition means, wherein each movable support means comprises means having a pair of support blocks each provided to be able to contact/separate with/from the movable table and a pair of piezoelectric actuators each provided with expansible first, second and third piezoelectric elements connected to a support block and extending in each direction, and being capable of walking operation relative to the movable table by the operations of the respective piezoelectric actuators. An alignment accuracy up to a nanometer level can be attained, and the alignment device itself and therefore the entire apparatus incorporating the alignment device can be significantly reduced in thickness and size.
摘要翻译：一种对准装置，包括可移动台，用于可移动地支撑可移动台的多个可移动支撑装置，用于读取识别标记的装置，以及用于基于来自识别装置的信息来控制可移动支撑装置的驱动的控制装置，其中每个可移动支撑装置包括具有一对支撑块的装置，每个支撑块设置成能够与可移动工作台接触/分离;以及一对压电致动器，每个压电致动器设置有连接到支撑块的可膨胀的第一，第二和第三压电元件，在每个方向上延伸，并且能够通过各个压电致动器的操作相对于可移动工作台行走操作。可以达到高达纳米级的对准精度，并且对准装置本身以及因此整合对准装置的整个装置的厚度和尺寸可以显着减小。

10. 发明申请

US20140035322A1 IMPACT ABSORBING BODY FOR A VEHICLE DOOR TRIM 有权
标题翻译：用于车辆门的冲击吸收体
公开(公告)号：US20140035322A1
公开(公告)日：2014-02-06
申请号：US13955695
申请日：2013-07-31
申请人： Nilesh Ishwardas Sakhara , Toru Ishizaki , Yoshiyuki Arai
发明人： Nilesh Ishwardas Sakhara , Toru Ishizaki , Yoshiyuki Arai
IPC分类号： B62D25/02
CPC分类号： B62D25/02 , B60J5/0451 , B60R21/0428
摘要： An impact absorbing body for attachment to a door trim is capable of bearing a collision load from an exterior panel at the time of a side collision. The impact absorbing body has a top face portion with linear edge portions and sidewall portions extending from the linear edge portions toward the door trim to provide a hollow box. The impact absorbing body also includes base portions connected to edge portions of the sidewall portions. The base portions are open toward the door trim and are attached to the door trim. The impact absorbing body also includes slits between adjacent sidewall portions, and the sidewall portions have outwardly slanted portions. In addition, rib members extend from the top face portion toward the base portion, toward the inside of the hollow box, and connect the adjacent sidewall portions.
摘要翻译：用于附接到门饰件的冲击吸收体能够在侧面碰撞时承受来自外部面板的碰撞负载。冲击吸收体具有顶线部分，其具有线性边缘部分和从线性边缘部分朝向门饰件延伸的侧壁部分，以提供中空盒。冲击吸收体还包括连接到侧壁部分的边缘部分的基部。底座部分朝向门饰件敞开，并连接到门饰板上。冲击吸收体还包括相邻侧壁部分之间的狭缝，并且侧壁部分具有向外倾斜的部分。此外，肋构件从顶面部朝向基部朝向中空箱的内部延伸，并且连接相邻的侧壁部。

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