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1. 发明授权

US07905149B2 Physical sensor and method of process 有权
标题翻译：物理传感器和过程方法
公开(公告)号：US07905149B2
公开(公告)日：2011-03-15
申请号：US12175347
申请日：2008-07-17
申请人： Kengo Suzuki , Takeshi Harada , Yasuo Osone , Masahide Hayashi , Teruhisa Akashi
发明人： Kengo Suzuki , Takeshi Harada , Yasuo Osone , Masahide Hayashi , Teruhisa Akashi
IPC分类号： G01B7/16
CPC分类号： G01P15/0802 , B81B2207/096 , B81C1/00301 , G01C19/5719
摘要： There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.
摘要翻译：提供了一种物理传感器，其确保了长期可靠性并且可以小型化和增加密度，以及其制造方法。物理传感器包括支撑基板，包括传感器元件并通过绝缘层与支撑基板接合的元件基板，覆盖传感器元件的区域并与元件基板接合的玻璃盖，以及内置电连接到传感器元件。内置电极形成在穿过元件基板，绝缘层和支撑基板的通孔中。覆盖内置电极的区域的玻璃帽的一部分阳极接合到元件基板。

2. 发明申请

US20090020419A1 Physical Sensor And Method Of Process 有权
标题翻译：物理传感器和过程方法
公开(公告)号：US20090020419A1
公开(公告)日：2009-01-22
申请号：US12175347
申请日：2008-07-17
申请人： Kengo SUZUKI , Takeshi Harada , Yasuo Osone , Masahide Hayashi , Teruhisa Akashi
发明人： Kengo SUZUKI , Takeshi Harada , Yasuo Osone , Masahide Hayashi , Teruhisa Akashi
IPC分类号： G01N27/30
CPC分类号： G01P15/0802 , B81B2207/096 , B81C1/00301 , G01C19/5719
摘要： There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate.
摘要翻译：提供了一种物理传感器，其确保了长期可靠性并且可以小型化和增加密度，以及其制造方法。物理传感器包括支撑基板，包括传感器元件并通过绝缘层与支撑基板接合的元件基板，覆盖传感器元件的区域并与元件基板接合的玻璃盖，以及内置电连接到传感器元件。内置电极形成在穿过元件基板，绝缘层和支撑基板的通孔中。覆盖内置电极的区域的玻璃帽的一部分阳极接合到元件基板。

3. 发明申请

US20070062282A1 Combined sensor and its fabrication method 审中-公开
标题翻译：组合传感器及其制造方法
公开(公告)号：US20070062282A1
公开(公告)日：2007-03-22
申请号：US11516927
申请日：2006-09-06
申请人： Teruhisa Akashi , Ryoji Okada , Masahide Hayashi , Kengo Suzuki
发明人： Teruhisa Akashi , Ryoji Okada , Masahide Hayashi , Kengo Suzuki
IPC分类号： G01P15/08
CPC分类号： G01P15/0802 , G01C19/5719 , G01P15/097 , G01P15/14 , G01P15/18 , G01P2015/082
摘要： A sensor structure using vibrating sensor elements which can detect an angular rate and accelerations in two axes at the same time is provided. 2 sets of vibration units which vibrate in out-of-phase mode (tunning-fork vibration) and include four vibrating sensor elements of the approximately same shape supported on a substrate in a vibratile state are provided and the vibrating sensor elements are disposed so that vibration axes of the vibration units cross each other at right angles. Each of the vibrating sensor elements includes a pair of detection units and adjustment units for adjusting a vibration frequency. The vibrating sensor elements constitute a combined sensor having supporting structure for supporting the vibrating sensor elements independently so that the vibrating sensor elements do not interfere with each other.
摘要翻译：提供了使用能够同时检测两个轴的角速度和加速度的振动传感器元件的传感器结构。提供了2组以异相模式（调音叉振动）振动的振动单元，并且包括以振动状态支撑在基板上的大致相同形状的四个振动传感器元件，并且将振动传感器元件设置成振动单元的振动轴线成直角交叉。每个振动传感器元件包括一对检测单元和用于调节振动频率的调节单元。振动传感器元件构成具有用于独立地支撑振动传感器元件的支撑结构的组合传感器，使得振动传感器元件彼此不干涉。

4. 发明授权

US08438718B2 Manufacturing method of combined sensor 有权
标题翻译：组合传感器的制造方法
公开(公告)号：US08438718B2
公开(公告)日：2013-05-14
申请号：US13028592
申请日：2011-02-16
申请人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： G01R3/00
CPC分类号： G01C19/56 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00285 , B81C2203/0118 , B81C2203/035 , G01C19/5769 , G01C19/5783 , G01P15/0802 , G01P2015/0882 , H01L2224/48145 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49171 , Y10T29/49176 , Y10T29/49826 , H01L2924/00012
摘要： A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
摘要翻译：加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片，并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起，吸附剂分段依次被激活以吸附活性气体，以便调节陀螺仪内部的压力，从而制造组合的传感器晶片。

5. 发明申请

US20140260612A1 Composite Sensor and Method for Manufacturing The Same 审中-公开
标题翻译：复合传感器及其制造方法
公开(公告)号：US20140260612A1
公开(公告)日：2014-09-18
申请号：US14353635
申请日：2011-11-28
申请人： Takanori Aono , Kengo Suzuki , Masahide Hayashi , Heewon Jeong
发明人： Takanori Aono , Kengo Suzuki , Masahide Hayashi , Heewon Jeong
IPC分类号： G01C19/5705
CPC分类号： G01C19/5705 , B81B2201/0235 , B81B2201/0242 , B81C1/00285 , G01C19/5783 , G01P15/0802 , G01P2015/088
摘要： The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.
摘要翻译：本公开提供了具有高可靠性的复合传感器及其制造方法。加速度传感器的移动体和角速度传感器的振荡器设置在相同的传感器晶片上，同时由壁分隔，并且盖晶片形成为具有与每个传感器对应的间隙。在传感器密封部中形成有贯通孔和凸块，在第一密封工序中将加速度传感器密封在空气气氛中，在第二密封工序中，通过将传感器和盖体彼此接触并在真空环境中连接传感器和盖子。此后，将复合传感器晶片切割，电路板和布线板安装在其上，并且形成复合传感器。

6. 发明授权

US09146253B2 Combined sensor and method for manufacturing the same 有权
标题翻译：组合传感器及其制造方法
公开(公告)号：US09146253B2
公开(公告)日：2015-09-29
申请号：US13699235
申请日：2011-05-20
申请人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： G01P1/02 , G01P15/08 , B81C1/00 , G01C19/56 , G01P15/125 , G01C19/5783 , H01L23/00 , H01L23/31 , H01L21/56
CPC分类号： G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
摘要翻译：加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。然后，对角速度传感器12进行高温高负荷的真空密封。此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

7. 发明申请

US20130241013A1 Physical Quantity Detector 有权
标题翻译：物理量检测器
公开(公告)号：US20130241013A1
公开(公告)日：2013-09-19
申请号：US13878776
申请日：2011-10-07
申请人： Kiyoko Yamanaka , Kengo Suzuki , Kazunori Ohta , Heewon Jeong , Masahide Hayashi
发明人： Kiyoko Yamanaka , Kengo Suzuki , Kazunori Ohta , Heewon Jeong , Masahide Hayashi
IPC分类号： B81B7/00
CPC分类号： B81B7/0058 , G01C19/5783 , G01P15/125 , G01P2015/0814 , G01P2015/0845 , H01L24/32 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure (103) is provided in the inertial sensor device, between a semiconductor chip (102) mounted on a package substrate and a semiconductor chip (104) comprising a sensor detection part. The anti-vibration structure (103) has a structure in which the periphery of an anti-vibration part (103a) is surrounded by an anti-vibration part (103b) comprising a material having a larger Young's modulus.
摘要翻译：提供了一种惯性传感器装置，其包括具有MEMS结构的检测部件，其中，在控制由施加外部振动引起的错误操作的同时确保传感器安装期间的便利性。为了实现该目的，在惯性传感器装置中，在安装在封装基板上的半导体芯片（102）和包括传感器检测部件的半导体芯片（104）之间设置防振结构（103）。防振结构（103）具有防振部（103a）的周围由包含杨氏模量较大的材料的防振部（103b）包围的结构。

8. 发明申请

US20110209815A1 Manufacturing Method of Combined Sensor 有权
标题翻译：组合传感器的制造方法
公开(公告)号：US20110209815A1
公开(公告)日：2011-09-01
申请号：US13028592
申请日：2011-02-16
申请人： Takanori AONO , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori AONO , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： A63B39/00 , B23P17/04
CPC分类号： G01C19/56 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00285 , B81C2203/0118 , B81C2203/035 , G01C19/5769 , G01C19/5783 , G01P15/0802 , G01P2015/0882 , H01L2224/48145 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49171 , Y10T29/49176 , Y10T29/49826 , H01L2924/00012
摘要： A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
摘要翻译：加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片，并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起，吸附剂分段依次被激活以吸附活性气体，以便调节陀螺仪内部的压力，从而制造组合的传感器晶片。

9. 发明授权

US08659101B2 Physical quantity detector 有权
标题翻译：物理量检测器
公开(公告)号：US08659101B2
公开(公告)日：2014-02-25
申请号：US13878776
申请日：2011-10-07
申请人： Kiyoko Yamanaka , Kengo Suzuki , Kazunori Ohta , Heewon Jeong , Masahide Hayashi
发明人： Kiyoko Yamanaka , Kengo Suzuki , Kazunori Ohta , Heewon Jeong , Masahide Hayashi
IPC分类号： B81B3/00 , G01L9/00 , H01L29/84
CPC分类号： B81B7/0058 , G01C19/5783 , G01P15/125 , G01P2015/0814 , G01P2015/0845 , H01L24/32 , H01L2224/05554 , H01L2224/48091 , H01L2224/49171 , H01L2224/73265 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure (103) is provided in the inertial sensor device, between a semiconductor chip (102) mounted on a package substrate and a semiconductor chip (104) comprising a sensor detection part. The anti-vibration structure (103) has a structure in which the periphery of an anti-vibration part (103a) is surrounded by an anti-vibration part (103b) comprising a material having a larger Young's modulus.
摘要翻译：提供了一种惯性传感器装置，其包括具有MEMS结构的检测部件，其中，在控制由施加外部振动引起的错误操作的同时确保传感器安装期间的便利性。为了实现该目的，在惯性传感器装置中，在安装在封装基板上的半导体芯片（102）和包括传感器检测部件的半导体芯片（104）之间设置防振结构（103）。防振结构（103）具有防振部（103a）的周围由包含杨氏模量较大的材料的防振部（103b）包围的结构。

10. 发明申请

US20130068020A1 Combined Sensor and Method for Manufacturing the Same 有权
标题翻译：组合传感器及其制造方法
公开(公告)号：US20130068020A1
公开(公告)日：2013-03-21
申请号：US13699235
申请日：2011-05-20
申请人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： G01P3/44 , H05K3/30 , H05K3/28 , B23P11/00
CPC分类号： G01P15/0802 , B81B2201/0235 , B81B2201/0242 , B81B2203/0315 , B81B2207/095 , B81C1/00293 , B81C2203/031 , G01C19/56 , G01C19/5783 , G01P15/125 , H01L21/561 , H01L23/315 , H01L24/94 , H01L2924/12042 , H01L2924/15788 , H01L2924/16235 , Y10T29/49146 , Y10T29/49826 , H01L2924/00
摘要： An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors.A movable member 111 of an acceleration sensor 11 and a vibrator 121 of an angular velocity sensor 12 are fabricated on the same sensor wafer 10 with a wall 16 interposed therebetween. A cap wafer 20 is formed in which gaps 21, 22 corresponding to the movable member 111 of the acceleration sensor 11 and the vibrator 121 of the angular velocity sensor 12 are provided. Bumps 23 are disposed near the gap 22 of the angular velocity sensor 12. The acceleration sensor 11 is sealed at atmospheric pressure. Then, the angular velocity sensor 12 is subjected to high temperature and a high-load and is vacuum-sealed. Thereafter, cutting with a diamond grindstone and mounting of circuit substrates and a wiring substrate are performed to form a combined sensor.
摘要翻译：加速度传感器和角速度传感器在一系列接合步骤的过程中被密封在适合于其的相应的压力环境中，从而提高传感器的检测灵敏度。加速度传感器11的可动部件111和角速度传感器12的振动器121被制造在相同的传感器晶片10上，壁16插入其中。形成盖片20，其中设置有与加速度传感器11的可动构件111对应的间隙21,22和角速度传感器12的振子121。凸起23设置在角速度传感器12的间隙22附近。加速度传感器11在大气压下被密封。然后，对角速度传感器12进行高温高负荷的真空密封。此后，进行用金刚石磨石切割并安装电路基板和布线基板以形成组合的传感器。

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