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    • 2. 发明授权
    • Molded electric parts and method of manufacturing the same
    • 成型电气部件及其制造方法
    • US5679976A
    • 1997-10-21
    • US367191
    • 1995-01-13
    • Yoshiaki NishikawaYasuyuki TakedaMasanaga Kikuzawa
    • Yoshiaki NishikawaYasuyuki TakedaMasanaga Kikuzawa
    • B29C45/26B29C45/14B29K105/20B29L31/34H01G2/06H01G4/224H01G13/00H01L23/28H05K1/00H05K1/14H05K1/18H05K3/30H05K3/34H05K3/36H01L23/48H01L23/34
    • H01G4/224H01G2/065H05K1/141H05K3/301H01L2224/48091H01L2224/48247H01L2224/4918H01L2924/13033H01L2924/30107H05K1/0284H05K1/182H05K1/183H05K2201/049H05K2201/10022H05K2201/10166H05K2201/10583H05K2201/10636H05K3/3442H05K3/368Y02P70/611
    • The present invention provides a molded electric part which does not include any lead wires and is preferably compact in size and light in weight. The molded electric part of the invention can effectively prevent deterioration of an electric element by molding the element with a resin. The invention is also directed to a method of simultaneously manufacturing a number of products having fixed dimensions and excellent electrical properties through injection molding with a multi-forming mold complex. A molded film capacitor (1) of the invention includes a film capacitor element (2) and an element-receiving body (3) mainly composed of a synthetic resin with high dielectric ability. The film capacitor element (2) is accommodated in an element-receiving recess (7) formed in a substantial center of the element-receiving body (3). A couple of electrodes (2a,2a) formed on both side faces of the film capacitor element (2) are electrically connected with solder (5,5) to a film conductive pattern (4) formed by metal-plating a surface of the element-receiving body (3). Part of the conductive pattern (4) arranged on a bottom face of the element-receiving body (3) forms an outside connection terminal film (8). The film capacitor element (2) is further molded with a sealing resin (6) in an airtight manner for protecting the element-receiving recess (7) from outside humidity.
    • PCT No.PCT / JP94 / 00960 Sec。 371日期1995年1月13日 102(e)日期1995年1月13日PCT提交1994年6月14日PCT公布。 第WO94 / 29887号公报 日期1994年12月22日本发明提供一种不包含任何引线的成型电气部件,其重量轻,重量轻。 本发明的模制电气部件可以通过用树脂模制元件来有效地防止电气元件的劣化。 本发明还涉及通过具有多成形模具复合体的注射成型同时制造具有固定尺寸和优异电性能的多种产品的方法。 本发明的成型薄膜电容器(1)包括膜电容器元件(2)和主要由具有高介电能力的合成树脂构成的元件容纳体(3)。 薄膜电容器元件(2)容纳在形成在元件容纳体(3)的大致中心的元件容纳凹部(7)中。 形成在薄膜电容器元件(2)的两个侧面上的几个电极(2a,2a)与焊料(5,5)电连接到薄膜导电图案(4),该导电图案通过金属镀覆元件的表面而形成 接收体(3)。 布置在元件接收体(3)的底面上的导电图案(4)的一部分形成外部连接端子膜(8)。 薄膜电容器元件(2)进一步用密封树脂(6)以气密的方式模制,以保护元件容纳凹部(7)不受外部湿度的影响。