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1. 发明授权

US5378012A Lid structure of air bag system 失效
标题翻译：气囊系统的盖结构
公开(公告)号：US5378012A
公开(公告)日：1995-01-03
申请号：US912132
申请日：1992-07-09
申请人： Kazuhiro Seiki , Yukihiro Yamaguchi , Minoru Kanda
发明人： Kazuhiro Seiki , Yukihiro Yamaguchi , Minoru Kanda
IPC分类号： B60R21/20 , B60K37/00 , B60R21/205 , B60R21/215 , B60R21/22
CPC分类号： B60R21/205 , B60R21/215
摘要： A turning center line is provided at a front edge side of a lid mounted on an upper surface of an instrument panel for permitting spreading of an air bag, and the lid is provided at a rear edge side thereof with a free end which is adapted to abut against a front windshield when the lid is opened. By contructing the lid-turning center line to be substantially parallel to the widthwise line of the front windshield, and the free end of the lid to be, in its closed position, substantially parallel to a line extending in a widthwise direction of the vehicle, or by constructing the lid-turning center line to be substantially parallel to the line extending in the widthwise direction of the vehicle, and the free end of the lid to be, in its closed position, substantially symmetrical to the widthwise line of the front windshield with respect to the lid-turning central line, it is ensured that the free end of the lid is permitted to abut against the front windshield substantially concurrently over the widthwise entire length. This avoids application of a localized load to the lid, thereby preventing any deformation or breaking of the lid.
摘要翻译：转动中心线设置在安装在仪表板上表面的盖的前边缘侧，用于允许气囊的扩展，并且盖在其后边缘侧设置有自由端，该自由端适于当盖打开时，抵靠前挡风玻璃。通过将盖转动中心线构造为基本上平行于前挡风玻璃的宽度方向线，并且盖的自由端处于其关闭位置，基本上平行于沿车辆的宽度方向延伸的线，或者通过将盖转动中心线构造成基本上平行于在车辆的宽度方向上延伸的线，并且盖的自由端处于其关闭位置，与前挡风玻璃的宽度方向线基本上对称相对于盖转弯中心线，确保盖的自由端被允许在宽度方向的整个长度上基本上同时地抵靠前挡风玻璃。这避免了对盖的局部负载的施加，从而防止盖的任何变形或断裂。

2. 发明授权

US08211261B2 Semiconductor manufacturing method of die pick-up from wafer 失效
标题翻译：半导体晶片制取方法
公开(公告)号：US08211261B2
公开(公告)日：2012-07-03
申请号：US12836445
申请日：2010-07-14
申请人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
IPC分类号： B29C65/00 , B32B37/00 , B32B38/04
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

3. 发明申请

US20090170290A1 SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER 失效
标题翻译：半导体制造方法从晶片取样
公开(公告)号：US20090170290A1
公开(公告)日：2009-07-02
申请号：US12392171
申请日：2009-02-25
申请人： Hiroshi MAKI , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi MAKI , Kazuhiro Seiki , Eiji Wada
IPC分类号： H01L21/784
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

4. 发明授权

US07498241B2 Semiconductor manufacturing method of die pick-up from wafer 失效
标题翻译：半导体晶片制取方法
公开(公告)号：US07498241B2
公开(公告)日：2009-03-03
申请号：US11335459
申请日：2006-01-20
申请人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

5. 发明申请

US20100279465A1 SEMICONDUCTOR MANUFACTURING METHOD OF DIE PICK-UP FROM WAFER 失效
标题翻译：半导体制造方法从晶片取样
公开(公告)号：US20100279465A1
公开(公告)日：2010-11-04
申请号：US12836445
申请日：2010-07-14
申请人： Hiroshi MAKI , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi MAKI , Kazuhiro Seiki , Eiji Wada
IPC分类号： H01L21/98 , B32B37/00 , H01L21/78
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

6. 发明授权

US07759164B2 Semiconductor manufacturing method of die pick-up from wafer 失效
标题翻译：半导体晶片制取方法
公开(公告)号：US07759164B2
公开(公告)日：2010-07-20
申请号：US12392171
申请日：2009-02-25
申请人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
IPC分类号： H01L21/00
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

7. 发明申请

US20060166466A1 Semiconductor manufacturing method of die-pick-up from wafer 失效
标题翻译：半导体制造方法从芯片上取芯
公开(公告)号：US20060166466A1
公开(公告)日：2006-07-27
申请号：US11335459
申请日：2006-01-20
申请人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
发明人： Hiroshi Maki , Kazuhiro Seiki , Eiji Wada
IPC分类号： H01L21/78 , H01L21/301 , H01L21/46
CPC分类号： H01L21/67132 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1132 , Y10T156/1179 , Y10T156/1983
摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.
摘要翻译：一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：此后切割半导体晶片和芯片附着膜，以将半导体晶片分成多个半导体芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

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