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    • 2. 发明授权
    • Flow sensor element and its self-cleaning
    • 流量传感器元件及其自洁性
    • US07739908B2
    • 2010-06-22
    • US12108878
    • 2008-04-24
    • Karlheinz WienandKarlheinz UllrichMatthias Muziol
    • Karlheinz WienandKarlheinz UllrichMatthias Muziol
    • G01F1/68
    • G01F1/6983G01F1/6845G01F1/692
    • A flow sensor element and a method for self-cleaning of the flow sensor element are provided, in which a temperature-measuring element and a heating element are arranged on a carrier element, and these elements can form a multiple-part ceramic component. The temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for the temperature measurement and is heated with an additional platinum thin-film resistor. A measurement device, in particular an anemometric measurement device of a flow sensor, contains film resistors mounted in at least one opening of a cover or a hollow body. Two of the film resistors have resistance values differing by one to three orders of magnitude. The anemometric measurement device has a temperature sensor and a heat output sensor set in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor, as platinum thin-film or thick-film resistors, on a ceramic substrate.
    • 提供了流量传感器元件和流量传感器元件的自清洁方法,其中温度测量元件和加热元件布置在载体元件上,并且这些元件可以形成多部件陶瓷部件。 温度测量元件在陶瓷基板上具有用于温度测量的铂薄膜电阻器,并用附加的铂薄膜电阻器加热。 测量装置,特别是流量传感器的气流测量装置包含安装在盖子或中空体的至少一个开口中的薄膜电阻器。 两个薄膜电阻器的电阻值相差一到三个数量级。 风速测量装置具有设置在载体元件中的温度传感器和热输出传感器。 温度传感器在陶瓷基板上具有温度测量电阻和作为铂薄膜或厚膜电阻的导热体。
    • 5. 发明申请
    • Film Resistor in Exhaust-gas Pipe
    • 排气管中的膜电阻
    • US20090282909A1
    • 2009-11-19
    • US12307024
    • 2007-06-29
    • Karlheinz WienandKarlheinz UllrichMatthias Muziol
    • Karlheinz WienandKarlheinz UllrichMatthias Muziol
    • G01F1/692H01C17/00
    • G01F1/684G01F1/6845G01F1/692G01F1/6983G01P5/12Y10T29/49082
    • A measurement device, in particular anemometric measurement device of a flow sensor, contains film resistors in one or more opening(s) of a cover or a hollow body. The film resistors are fastened according to the invention in the opening(s). Two film resistors differ with respect to their resistance by one to three orders of magnitude.In an anemometric measurement device of a flow sensor according to the invention, a temperature sensor and a heating capacity sensor are placed in a carrier element. The temperature sensor has a temperature-measuring resistor and a heat conductor as platinum thin-film or thick-film resistors on a ceramic substrate.For self-cleaning of an anemometric measurement device of a flow sensor, in which a temperature-measuring element and a heating element are placed in a carrier element, the temperature-measuring element has a platinum thin-film resistor on a ceramic substrate for temperature measurement and is heated with an additional platinum thin-film resistor.For production of an anemometric measurement device of a flow sensor made of film resistors and a cover or a hollow body, two film resistors differing by one to two orders of magnitude are placed in openings of the cover or hollow body and are fastened in the openings.
    • 测量装置,特别是流量传感器的气流测量装置,在盖或中空体的一个或多个开口中包含薄膜电阻。 薄膜电阻器根据本发明被固定在开口中。 两个薄膜电阻器的电阻相差一到三个数量级。 在根据本发明的流量传感器的风速测量装置中,将温度传感器和加热能力传感器放置在载体元件中。 温度传感器在陶瓷基板上具有温度测量电阻器和作为铂薄膜或厚膜电阻器的导热体。 为了自动清洁温度测量元件和加热元件放置在载体元件中的流量传感器的电流测量装置,该温度测量元件在陶瓷基板上具有用于温度的铂薄膜电阻器 并用附加的铂薄膜电阻加热。 为了制造由薄膜电阻器和盖子或中空体制成的流量传感器的电流测量装置,将两个不同于一个数量级的薄膜电阻器放置在盖子或中空体的开口中并且紧固在开口 。
    • 8. 发明授权
    • Process for producing printed circuit boards with at least one metal layer, printed circuit board and use thereof
    • 用于制造具有至少一个金属层的印刷电路板的方法,印刷电路板及其用途
    • US06226864B1
    • 2001-05-08
    • US08908608
    • 1997-08-08
    • Matthias MuziolKarlheinz Wienand
    • Matthias MuziolKarlheinz Wienand
    • H01R900
    • H05K3/4015H05K1/092H05K3/0097Y10T29/49149Y10T29/49789Y10T29/49794Y10T29/53852
    • A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and containing connection areas with holes to which small contact plates are applied for the purpose of later bonding with connection leads. The small contact plates are applied in a hard soldering process with the aid of solder paste to the connection areas of the conductor paths and to the surface area of the substrate surface which is made of ceramic and exposed by the holes. It is consequently possible, dispensing with so-called bonding wires, to directly connect connection leads or bonding lugs electrically with the conductor path and mechanically with the printed circuit board. The printed circuit board is preferably designed as a measuring resistor, wherein the conductor path is applied as a resistance layer of platinum or platinum group metal in a thin film process to a small ceramic plate of aluminum oxide. The small contact plates are preferably made of nickel or a nickel-iron alloy, whereby a good stability results at high temperatures.
    • 印刷电路板具有施加到具有电绝缘表面的基板的导体路径,导体路径优选地构造成曲折形状,并且包含具有孔的连接区域,为了稍后的粘合而将小接触板施加到孔 连接线。 小焊接接触板借助于焊锡膏在硬焊接工艺中施加到导体路径的连接区域和由陶瓷制成并暴露于孔的衬底表面的表面区域。 因此,分配所谓的接合线可以将连接引线或接合凸耳与导体路径直接连接并机械地与印刷电路板连接。 印刷电路板优选地被设计为测量电阻器,其中导体路径作为铂或铂族金属的电阻层在薄膜工艺中施加到小的氧化铝陶瓷板上。 小接触板优选由镍或镍 - 铁合金制成,从而在高温下产生良好的稳定性。
    • 10. 发明授权
    • Printed circuit boards having at least one metal layer
    • 具有至少一个金属层的印刷电路板
    • US06469614B2
    • 2002-10-22
    • US09850509
    • 2001-05-07
    • Matthias MuziolKarlheinz Wienand
    • Matthias MuziolKarlheinz Wienand
    • H01C1012
    • H05K3/4015H05K1/092H05K3/0097Y10T29/49149Y10T29/49789Y10T29/49794Y10T29/53852
    • A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and containing connection areas with holes to which small contact plates are applied for the purpose of later bonding with connection leads. The small contact plates are applied in a hard soldering process with the aid of solder paste to the connection areas of the conductor paths and to the surface area of the substrate surface which is made of ceramic and exposed by the holes. It is consequently possible, dispensing with so-called bonding wires, to directly connect connection leads or bonding lugs electrically with the conductor path and mechanically with the printed circuit board. The printed circuit board is preferably designed as a measuring resistor, wherein the conductor path is applied as a resistance layer of platinum or platinum group metal in a thin film process to a small ceramic plate of aluminum oxide. The small contact plates are preferably made of nickel or a nickel-iron alloy, whereby a good stability results at high temperatures.
    • 印刷电路板具有施加到具有电绝缘表面的基板的导体路径,导体路径优选地构造成曲折形状,并且包含具有孔的连接区域,为了稍后的粘合而将小接触板施加到孔 连接线。 小焊接接触板借助于焊锡膏在硬焊接工艺中施加到导体路径的连接区域和由陶瓷制成并暴露于孔的衬底表面的表面区域。 因此,分配所谓的接合线可以将连接引线或接合凸耳与导体路径直接连接并机械地与印刷电路板连接。 印刷电路板优选地被设计为测量电阻器,其中导体路径作为铂或铂族金属的电阻层在薄膜工艺中施加到小的氧化铝陶瓷板上。 小接触板优选由镍或镍 - 铁合金制成,从而在高温下产生良好的稳定性。