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    • 4. 发明授权
    • Silicon deposition process
    • 硅沉积工艺
    • US4590024A
    • 1986-05-20
    • US594456
    • 1984-03-29
    • Israel A. LeskM. John Rice, Jr.Kalluri R. Sarma
    • Israel A. LeskM. John Rice, Jr.Kalluri R. Sarma
    • C30B13/00
    • C30B29/06C30B13/00
    • An improved process is disclosed for the deposition in a reactor vessel of silicon on the interior walls of the reactor vessel and for the subsequent separation of the silicon from those walls. The reactor vessel has a generally rectangular cross section and is formed of a refractory material from which the deposited silicon separates by thermal expansion shear separation during cool down of the vessel and the deposited silicon. To improve the output of the deposition system, a plurality of partitions are provided in the reactor vessel and integral with the reactor walls. These partitions act as additional deposition surfaces, increasing the number of silicon sheets deposited as well as increasing the efficiency of the chemical reaction.
    • 公开了一种改进的方法,用于沉积在反应器容器的内壁上的硅的反应器容器中,并且随后将硅与这些壁分离。 反应器容器具有大致矩形的横截面,并且由耐热材料形成,沉积的硅通过在容器和沉积的硅冷却期间的热膨胀剪切分离而分离。 为了提高沉积系统的输出,在反应器容器中提供多个隔板并与反应器壁成一体。 这些隔板作为附加的沉积表面,增加沉积的硅片的数量以及提高化学反应的效率。
    • 9. 发明授权
    • Single crystal silicon on quartz
    • 石英单晶硅
    • US5258323A
    • 1993-11-02
    • US998968
    • 1992-12-29
    • Kalluri R. SarmaCharles S. Chanley
    • Kalluri R. SarmaCharles S. Chanley
    • G02F1/1345G02F1/136G02F1/1368H01L21/02H01L21/20H01L21/306H01L21/336H01L21/76H01L21/762H01L21/764H01L27/12H01L29/786
    • H01L21/76264H01L21/2007H01L21/764H01L21/76275H01L21/76289Y10S148/012Y10S148/135Y10S148/15Y10S438/977
    • A method for fabricating single crystal islands on a high temperature substrate, thereby allowing for the use of high temperature processes to further make devices incorporating the islands such as, for example, high mobility thin film transistor integrated drivers for active matrix displays. The method essentially includes depositing an etch stop layer on a single crystal silicon substrate, depositing a single crystal silicon device layer on the etch stop layer, bonding a quartz substrate to the single crystal silicon device layer at room temperature, sealing and securing with an adhesive the edges of the single crystal silicon substrate, the etch stop layer, the single crystal silicon device layer and the quartz substrate, grinding away a portion of the silicon substrate and a portion of the adhesive, etching away the remaining portion of the silicon substrate, removing the remaining portion of the adhesive, etching away the etch stop layer, applying a photoresist mask on the single crystal silicon device layer for defining the islands on the single crystal silicon device layer, etching single crystal silicon islands, and then the first non-room-temperature process of diffusion bonding the single crystal silicon islands to the quartz substrate.
    • 一种用于在高温衬底上制造单晶岛的方法,从而允许使用高温工艺来进一步制造并入岛的器件,例如用于有源矩阵显示器的高迁移率薄膜晶体管集成驱动器。 该方法基本上包括在单晶硅衬底上沉积蚀刻停止层,在蚀刻停止层上沉积单晶硅器件层,在室温下将石英衬底结合到单晶硅器件层,用粘合剂密封和固定 单晶硅衬底,蚀刻停止层,单晶硅器件层和石英衬底的边缘,研磨硅衬底的一部分和粘合剂的一部分,蚀刻掉硅衬底的剩余部分, 去除粘合剂的剩余部分,蚀刻掉蚀刻停止层,在单晶硅器件层上施加光致抗蚀剂掩模以限定单晶硅器件层上的岛,蚀刻单晶硅岛, 将单晶硅岛扩散接合到石英衬底的室温过程。