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    • 2. 发明授权
    • Alkaline nickel plating solutions
    • 碱性镍镀层解决方案
    • US3718549A
    • 1973-02-27
    • US3718549D
    • 1971-06-14
    • KEWANEE OIL CO
    • DU ROSE ASTERN R
    • C25D3/12C23B5/08C23B5/46
    • C25D3/12
    • An alkaline nickel electroplating bath and process wherein brighter and more ductile nickel electroplate is formed due to the inclusion of addition agents which include certain organic amines, nitriles, unsaturated organic acids and heterocyclic compounds. Such plating processes are operable from room temperature to about 180*F over a current density range of 5 to 100 amps per sq. ft. Typical addition agents include 1,6Morpholino-2-hexyne; N-Allyl benzene sulfonamide; Sodium phosphite; Carboxymethylpyridinium iodide and 2-Phenyl-2Cyanoethoxybutyne.
    • 碱性镍电镀浴和其中由于包含某些有机胺,腈,不饱和有机酸和杂环化合物的添加剂而形成更亮和更延展的镍电镀的方法。 这种电镀方法可在5至100安培/平方英尺的电流密度范围内从室温至约180°F操作。典型的添加剂包括1,6-吗啉代-2-己炔; N-烯丙基苯磺酰胺; 亚磷酸钠 羧甲基吡啶鎓碘化物和2-苯基-2-氰基乙氧基丁炔。