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    • 1. 发明申请
    • Spatial Light Modulators and Fabrication Techniques
    • 空间光调制器和制作技术
    • US20120170102A1
    • 2012-07-05
    • US12983195
    • 2010-12-31
    • Justin PayneHoward WooVlad NovotnyAdrian James Cable
    • Justin PayneHoward WooVlad NovotnyAdrian James Cable
    • G02B26/06H01L31/18
    • H01L27/14603G02B26/06H01L27/14625
    • We describe a phase modulating spatial light modulator (SLM). The SLM comprises a substrate bearing multiple SLM pixels, each of the SLM pixels comprising a MEMS (micro electromechanical system) optical phase modulating structure. The MEMS optical phase modulating structure comprises: a pixel electrode; a spring support structure around a perimeter of the pixel electrode; and a mirror spring supported by the spring support structure. The mirror spring comprises a mirror support and a plurality of mirror spring arms each extending between the mirror support and the spring support structure, and a mirror mounted on the mirror support. Each mirror spring arm has a spiral or serpentine shape. A voltage applied to the pixel electrode flexes the mirror spring and causes the mirror to translate perpendicularly to the substrate substantially without tilting.
    • 我们描述一个相位调制空间光调制器(SLM)。 SLM包括具有多个SLM像素的基板,每个SLM像素包括MEMS(微机电系统)光相位调制结构。 MEMS光相位调制结构包括:像素电极; 围绕像素电极的周边的弹簧支撑结构; 以及由弹簧支撑结构支撑的镜子弹簧。 镜子弹簧包括反射镜支撑件和多个镜子弹簧臂,每个镜子弹簧臂在反射镜支撑件和弹簧支撑结构之间延伸,以及安装在镜子支撑件上的镜子。 每个镜子弹簧臂都具有螺旋或蛇形形状。 施加到像素电极的电压使反射镜弹性弯曲,并且使得反射镜基本上不倾斜地垂直于基板平移。
    • 5. 发明申请
    • Fabrication of a high fill ratio silicon spatial light modulator
    • 高填充率硅空间光调制器的制造
    • US20070097485A1
    • 2007-05-03
    • US11448148
    • 2006-06-05
    • Xiao YangYuxiang WangWook JiJustin PayneYe WangHoward Woo
    • Xiao YangYuxiang WangWook JiJustin PayneYe WangHoward Woo
    • G02B26/00
    • G02B26/0841
    • A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300 ° C. to maintain a state of the planarizing material.
    • 一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。 上表面区域包括一个或多个图案化结构区域和至少一个开放区域,以暴露上表面区域的一部分以形成所得表面区域。 该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域,并且使用填充材料形成上部平坦化层。 该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。
    • 7. 发明申请
    • Method and structure for manufacturing bonded substrates using multiple photolithography tools
    • 使用多个光刻工具制造粘结衬底的方法和结构
    • US20060121373A1
    • 2006-06-08
    • US11004588
    • 2004-12-03
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • Xiao YangKegang HuangYuxiang WangHoward Woo
    • G03F9/00G03B27/00G03C5/00G03B27/42
    • G03F7/70525G03F9/7046H01L21/2007
    • A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment. Further, the method includes determining a masking process having a third tolerance criteria for alignment, the third tolerance criteria allowing for a change from the second to the first photographic stepper, processing the second substrate for at least the determined masking process using the first photolithographic stepper, and joining the first substrate to the second substrate to form a composite substrate structure.
    • 制造键合衬底结构的方法。 该方法包括提供包括第一表面区域的第一基底和使用第一光刻步进器处理第一表面区域以形成第一图案区域,其特征在于用于对准的第一公差标准。 该方法还包括提供包括第二表面区域的第二基底并通过至少一个掩模过程处理第二表面区域,以使用第二光刻步进器形成第二图案区域,其特征在于用于对准的第二容限标准。 此外,该方法包括确定具有用于对准的第三公差准则的掩蔽处理,第三公差准则允许从第二照相步骤器改变到第一照相步进器,使用第一光刻步进器处理至少所确定的掩蔽处理的第二衬底 并且将第一基板接合到第二基板以形成复合基板结构。