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    • 5. 发明授权
    • Circuit board cabinet
    • 电路板柜
    • US06283850B1
    • 2001-09-04
    • US09333404
    • 1999-06-15
    • Kenji ToshimitsuTetsuya MurayamaHiroshi KadoyaYasuko NozuMitsuo Kaetsu
    • Kenji ToshimitsuTetsuya MurayamaHiroshi KadoyaYasuko NozuMitsuo Kaetsu
    • H05K500
    • H05K7/20009
    • There is provided a circuit board cabinet which is capable of more reliably preventing flames of a fire in a shelf from spreading to external devices, without degrading cooling capability thereof. Flames of the fire occurring in the shelf rise within a slot, pass through a shield plate, and then enter a heat shield unit. In the heat shield unit, the flames are first blocked by a heat shield plate and substantially reduced in force while passing through holes formed through the heat shield plate. Portions of the flames which were not blocked by the heat shield plate reach a top board of the unit after passing through the holes, where they are reduced. Since there is a predetermined distance between the heat shield plate and the top board, the flames having passed through the heat shield plate spread horizontally to some extent and then reach the top board. Therefore, it is possible to reduce the force of the flames sufficiently by the top board. The flow of cooling air in normal use is sufficiently slower than that of flames, so that there is no fear of the existence of the heat shield unit causing a degraded heat dissipation.
    • 提供一种电路板机柜,其能够更可靠地防止搁板中的火焰蔓延到外部装置,而不降低其冷却能力。 在货架内发生火灾的火焰在槽内升起,穿过屏蔽板,然后进入隔热罩。 在隔热罩单元中,火焰首先被隔热板遮挡,并且通过穿过隔热板形成的孔时实质上减小。 没有被隔热板遮挡的部分火焰穿过孔后到达设备的顶板,在那里它们被还原。 由于在隔热板和顶板之间存在预定的距离,所以通过隔热板的火焰在一定程度上水平扩展,然后到达顶板。 因此,可以通过顶板充分地减少火焰的力。 正常使用中的冷却空气的流动比火焰的流动充分慢,所以不用担心热屏蔽单元的存在导致散热劣化。
    • 6. 发明授权
    • Cooling structure and cooling method for electronic equipment
    • 电子设备冷却结构及冷却方式
    • US07134607B2
    • 2006-11-14
    • US11034138
    • 2005-01-12
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • F24F7/00F25D23/12H05K7/20
    • H05K7/20581H05K7/207
    • A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the second electronic device or air inside of the first electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electronic device is controlled.
    • 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第二电子设备的内部,或者第一电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 对第一电子装置内的通风进行控制。
    • 8. 发明授权
    • Communication apparatus, information processing device, and external cable connection method
    • 通信装置,信息处理装置和外部电缆连接方法
    • US07724543B2
    • 2010-05-25
    • US11984630
    • 2007-11-20
    • Fujio OzawaTetsuya MurayamaJunichi HayamaHiroyuki AbeHisato Sato
    • Fujio OzawaTetsuya MurayamaJunichi HayamaHiroyuki AbeHisato Sato
    • H05K5/00
    • H05K7/1489H04Q1/02H04Q1/023H04Q1/035H04Q2201/12
    • A communication apparatus which occupies small space and yet can be connected with numerous external cables and which permits a cooling arrangement to be constructed at low cost. An information processing device constituting the communication apparatus has external cable connection ports provided on both top and bottom surfaces thereof, and thus, more external cables can be connected than in the case of connecting the cables to the side surfaces. Also, the external cables connected to the ports are guided along the top and bottom surfaces toward the front of the communication apparatus with their heights restricted by external cable covers and, therefore, do not occupy substantial space above and below the device. Further, since the external cables are connected to the top and bottom surfaces, the front and rear surfaces of the device have spare space, making it possible to construct a ventilation arrangement such as vent holes and fans.
    • 一种通信设备,其占用较小的空间,并且可以与许多外部电缆连接,并且允许以低成本构造冷却装置。 构成通信装置的信息处理装置具有设置在其上表面和底表面上的外部电缆连接端口,因此可以连接更多的外部电缆,而不是将电缆连接到侧面。 此外,连接到端口的外部电缆沿着顶部和底部表面朝向通信设备的前部被引导,其高度由外部电缆盖限制,因此在设备上方和下方不占据实质空间。 此外,由于外部电缆连接到顶表面和底表面,所以装置的前表面和后表面具有备用空间,使得可以构造诸如通气孔和风扇的通风装置。
    • 10. 发明申请
    • Cooling structure and cooling method for electronic equipment
    • 电子设备冷却结构及冷却方式
    • US20050122680A1
    • 2005-06-09
    • US11034138
    • 2005-01-12
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • Fujio OzawaJunichi HayamaTetsuya MurayamaHiroyuki AbeNaoya Yamazaki
    • H05K5/00H05K7/20
    • H05K7/20581H05K7/207
    • A cooling structure for electronic equipment including a plurality of electronic devices superposed on each other, each of the electronic devices having a lower part where an air ventilation part configured to ventilate air so as to cool the electronic device is provided, the cooling structure includes an air intake and exhaust hole forming part which is formed at an upper part of a first one of the electronic devices and below the air ventilation part of a second one of the electronic devices provided on the first electronic device. Air outside of the electronic equipment is taken into an inside of the first electronic device or air inside of the second electronic device is exhausted to the outside of the electronic equipment via the air intake and exhaust hole forming part, so that an amount of the air ventilated inside of the first electric device is controlled.
    • 一种用于电子设备的冷却结构,包括彼此叠置的多个电子设备,每个电子设备具有下部,其中空气通风部分构造成使空气通风以冷却电子设备,该冷却结构包括: 进气排气孔形成部分,其形成在第一电子设备的上部并且设置在第一电子设备上的第二电子设备的空气通风部分的下方。 电子设备外部的空气被吸入第一电子设备的内部,或者第二电子设备内部的空气经由进气和排气孔形成部件被排出到电子设备的外部,使得空气量 控制第一电气设备内的通风。