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    • 1. 发明申请
    • METHOD AND APPARATUS FOR IDENTIFYING THE CHEMICAL COMPOSITION OF A GAS
    • 用于识别气体化学成分的方法和装置
    • US20110177625A1
    • 2011-07-21
    • US13076409
    • 2011-03-30
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • H01L21/66H01L21/3065
    • G01N7/00G01N21/68
    • Embodiments of the present invention relate to the analysis of the components of one or more gases, for example a gas mixture sampled from a semiconductor manufacturing process such as plasma etching or plasma enhanced chemical vapor deposition (PECVD). Particular embodiments provide sufficient power to a plasma of the sample, to dissociate a large number of the molecules and molecular fragments into individual atoms. With sufficient power (typically a power density of between 3-40 W/cm3) delivered into the plasma, most of the emission peaks result from emission of individual atoms, thereby creating spectra conducive to simplifying the identification of the chemical composition of the gases under investigation. Such accurate identification of components of the gas may allow for the precise determination of the stage of the process being performed, and in particular for detection of process endpoint.
    • 本发明的实施例涉及一种或多种气体的组分的分析,例如从诸如等离子体蚀刻或等离子体增强化学气相沉积(PECVD)的半导体制造工艺中采样的气体混合物。 特定的实施方案为样品的等离子体提供足够的功率,以将大量分子和分子片段解离成单独的原子。 通过输送到等离子体中的足够的功率(通常为3-40W / cm 3的功率密度),大多数发射峰由单个原子的发射产生,从而产生有助于简化气体的化学组成的鉴定的光谱 调查 气体组分的这种精确识别可以允许精确确定正在执行的过程的阶段,特别是用于检测过程终点。
    • 2. 发明授权
    • Method and apparatus for identifying the chemical composition of a gas
    • 用于识别气体的化学成分的方法和装置
    • US08237928B2
    • 2012-08-07
    • US13076409
    • 2011-03-30
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01N21/00
    • G01N7/00G01N21/68
    • Embodiments of the present invention relate to the analysis of the components of one or more gases, for example a gas mixture sampled from a semiconductor manufacturing process such as plasma etching or plasma enhanced chemical vapor deposition (PECVD). Particular embodiments provide sufficient power to a plasma of the sample, to dissociate a large number of the molecules and molecular fragments into individual atoms. With sufficient power (typically a power density of between 3-40 W/cm3) delivered into the plasma, most of the emission peaks result from emission of individual atoms, thereby creating spectra conducive to simplifying the identification of the chemical composition of the gases under investigation. Such accurate identification of components of the gas may allow for the precise determination of the stage of the process being performed, and in particular for detection of process endpoint.
    • 本发明的实施例涉及一种或多种气体的组分的分析,例如从诸如等离子体蚀刻或等离子体增强化学气相沉积(PECVD)的半导体制造工艺中采样的气体混合物。 特定的实施方案为样品的等离子体提供足够的功率,以将大量分子和分子片段解离成单独的原子。 通过输送到等离子体中的足够的功率(通常为3-40W / cm 3的功率密度),大多数发射峰由单个原子的发射产生,从而产生有助于简化气体的化学组成的鉴定的光谱 调查 气体组分的这种精确识别可以允许精确确定正在执行的过程的阶段,特别是用于检测过程终点。
    • 3. 发明授权
    • Use of modeled parameters for real-time semiconductor process metrology applied to semiconductor processes
    • 使用模拟参数实时半导体工艺测量应用于半导体工艺
    • US07695984B1
    • 2010-04-13
    • US11409308
    • 2006-04-20
    • Joseph R MonkowskiBarton Lane
    • Joseph R MonkowskiBarton Lane
    • H01L21/00
    • H01J37/32935H01J37/32963H01L22/26
    • Method and system for detecting endpoint for a plasma etch process are provided. In accordance with one embodiment, the method provides a semiconductor substrate having a film to be processed thereon. The film is processed in a plasma environment during a time period to provide for device structures. Information associated with the plasma process is collected. The information is characterized by a first signal intensity. Information on a change in the first signal intensity is extracted. The change in the first signal intensity has a second signal intensity. The change in signal intensity at the second signal intensity is associated to an endpoint of processing the film in the plasma environment. The second signal intensity may be about 0.25% and less of the first signal intensity.
    • 提供了用于检测等离子体蚀刻工艺的端点的方法和系统。 根据一个实施例,该方法提供了具有待处理膜的半导体衬底。 在一段时间内在等离子体环境中处理膜以提供器件结构。 收集与等离子体处理相关的信息。 该信息的特征在于第一信号强度。 提取关于第一信号强度变化的信息。 第一信号强度的变化具有第二信号强度。 在第二信号强度下的信号强度的变化与在等离子体环境中处理膜的终点有关。 第二信号强度可以是第一信号强度的约0.25%和更小。
    • 4. 发明申请
    • METHOD AND APPARATUS FOR THE MEASUREMENT OF ATMOSPHERIC LEAKS IN THE PRESENCE OF CHAMBER OUTGASSING
    • 用于测量室外大气存在的大气泄漏的方法和装置
    • US20100018293A1
    • 2010-01-28
    • US12509375
    • 2009-07-24
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01M3/04
    • G01M3/38G01M3/202
    • Embodiments of the present invention employ measurement of argon as the means to detect the presence of an atmospheric leak in a processing chamber. Argon detected inside the process chamber is conclusive evidence of a leak. Furthermore, the amount of detected argon provides information on the rate of air entering through the leak. In one embodiment, leak detection takes place in the main plasma inside the processing chamber. In another embodiment, leak detection takes place in the self-contained plasma generated in a remote plasma sensor. Additional measurements can be performed, such as measuring the amount of oxygen, and/or the presence of moisture to help in detecting and quantifying outgassing from the processing chamber.
    • 本发明的实施例采用氩的测量作为检测处理室中大气泄漏的存在的手段。 在处理室内检测到的氩是确定的泄漏证据。 此外,检测到的氩气的量提供关于通过泄漏进入的空气的速率的信息。 在一个实施例中,泄漏检测发生在处理室内的主等离子体中。 在另一个实施例中,在远程等离子体传感器中产生的独立等离子体中发生泄漏检测。 可以进行额外的测量,例如测量氧的量和/或湿气的存在,以帮助检测和定量从处理室排气。
    • 5. 发明授权
    • Techniques for calibration of gas flows
    • 气流校准技术
    • US07757541B1
    • 2010-07-20
    • US11855052
    • 2007-09-13
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01F25/00
    • G01F25/0053G01N21/68
    • An embodiment of a method in accordance with the present invention to determine the flow rate of a second gas relative to a first gas, comprises, setting a flow of a first gas to a known level, taking a first measurement of the first gas with a measurement technique sensitive to a concentration of the first gas, and establishing a flow of a second gas mixed with the first gas. A second measurement of the first gas is taken with a measurement technique that is sensitive to the concentration of the first gas, and the flow of the second gas is determined by a calculation involving a difference between the first measurement and the second measurement. In alternative embodiments, the first measurement may be taken of a flow of two or more gases combined, with the second measurement taken with one of the gases removed from the mixture. Certain embodiments of methods of the present invention may be employed in sequence in order to determine flow rates of more than two gases.
    • 根据本发明的用于确定第二气体相对于第一气体的流量的方法的实施例包括:将第一气体的流量设定为已知水平,对第一气体进行第一次测量 测量技术对第一气体的浓度敏感,并建立与第一气体混合的第二气体的流动。 采用对第一气体的浓度敏感的测量技术对第一气体进行第二测量,并且通过涉及第一测量和第二测量之间的差的计算来确定第二气体的流量。 在替代实施例中,可以采用组合的两种或多种气体的流动进行第一测量,其中从混合物中除去气体之一进行第二测量。 本发明方法的某些实施方案可以按顺序使用,以确定多于两种气体的流速。
    • 6. 发明申请
    • METHOD AND APPARATUS FOR IDENTIFYING THE CHEMICAL COMPOSITION OF A GAS
    • 用于识别气体化学成分的方法和装置
    • US20090180113A1
    • 2009-07-16
    • US12184574
    • 2008-08-01
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01J3/443G01J3/28G01L21/30
    • G01N7/00G01N21/68
    • Embodiments of the present invention relate to the analysis of the components of one or more gases, for example a gas mixture sampled from a semiconductor manufacturing process such as plasma etching or plasma enhanced chemical vapor deposition (PECVD). Particular embodiments provide sufficient power to a plasma of the sample, to dissociate a large number of the molecules and molecular fragments into individual atoms. With sufficient power (typically a power density of between 3-40 W/cm3) delivered into the plasma, most of the emission peaks result from emission of individual atoms, thereby creating spectra conducive to simplifying the identification of the chemical composition of the gases under investigation. Such accurate identification of components of the gas may allow for the precise determination of the stage of the process being performed, and in particular for detection of process endpoint.
    • 本发明的实施例涉及一种或多种气体的组分的分析,例如从诸如等离子体蚀刻或等离子体增强化学气相沉积(PECVD)的半导体制造工艺中采样的气体混合物。 特定的实施方案为样品的等离子体提供足够的功率,以将大量分子和分子片段解离成单独的原子。 通过输送到等离子体中的足够的功率(通常为3-40W / cm 3的功率密度),大多数发射峰由单个原子的发射产生,从而产生有助于简化气体的化学组成的鉴定的光谱 调查 气体组分的这种精确识别可以允许精确确定正在执行的过程的阶段,特别是用于检测过程终点。
    • 7. 发明授权
    • Method and apparatus for identifying the chemical composition of a gas
    • 用于识别气体的化学成分的方法和装置
    • US07940395B2
    • 2011-05-10
    • US12184574
    • 2008-08-01
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01N21/00
    • G01N7/00G01N21/68
    • Embodiments of the present invention relate to the analysis of the components of one or more gases, for example a gas mixture sampled from a semiconductor manufacturing process such as plasma etching or plasma enhanced chemical vapor deposition (PECVD). Particular embodiments provide sufficient power to a plasma of the sample, to dissociate a large number of the molecules and molecular fragments into individual atoms. With sufficient power (typically a power density of between 3-40 W/cm3) delivered into the plasma, most of the emission peaks result from emission of individual atoms, thereby creating spectra conducive to simplifying the identification of the chemical composition of the gases under investigation. Such accurate identification of components of the gas may allow for the precise determination of the stage of the process being performed, and in particular for detection of process endpoint.
    • 本发明的实施例涉及一种或多种气体的组分的分析,例如从诸如等离子体蚀刻或等离子体增强化学气相沉积(PECVD)的半导体制造工艺中采样的气体混合物。 特定的实施方案为样品的等离子体提供足够的功率,以将大量分子和分子片段解离成单独的原子。 通过输送到等离子体中的足够的功率(通常为3-40W / cm 3的功率密度),大多数发射峰由单个原子的发射产生,从而产生有助于简化气体的化学组成的鉴定的光谱 调查 气体组分的这种精确识别可以允许精确确定正在执行的过程的阶段,特别是用于检测过程终点。
    • 8. 发明授权
    • Method and apparatus for the measurement of atmospheric leaks in the presence of chamber outgassing
    • 在室内除气的情况下测量大气泄漏的方法和装置
    • US08393197B2
    • 2013-03-12
    • US12509375
    • 2009-07-24
    • Joseph R. MonkowskiBarton Lane
    • Joseph R. MonkowskiBarton Lane
    • G01M3/38G01M3/40
    • G01M3/38G01M3/202
    • Embodiments of the present invention employ measurement of argon as the means to detect the presence of an atmospheric leak in a processing chamber. Argon detected inside the process chamber is conclusive evidence of a leak. Furthermore, the amount of detected argon provides information on the rate of air entering through the leak. In one embodiment, leak detection takes place in the main plasma inside the processing chamber. In another embodiment, leak detection takes place in the self-contained plasma generated in a remote plasma sensor. Additional measurements can be performed, such as measuring the amount of oxygen, and/or the presence of moisture to help in detecting and quantifying outgassing from the processing chamber.
    • 本发明的实施例采用氩的测量作为检测处理室中大气泄漏的存在的手段。 在处理室内检测到的氩是确定的泄漏证据。 此外,检测到的氩气的量提供关于通过泄漏进入的空气的速率的信息。 在一个实施例中,泄漏检测发生在处理室内的主等离子体中。 在另一个实施例中,在远程等离子体传感器中产生的独立等离子体中发生泄漏检测。 可以进行额外的测量,例如测量氧的量和/或湿气的存在,以帮助检测和定量从处理室排气。