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1. 发明授权

US5277749A Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps 失效
标题翻译：当执行利用高应力金属和/或多个蒸发步骤的剥离过程时，减轻应力和抵抗模板分层的方法和装置
公开(公告)号：US5277749A
公开(公告)日：1994-01-11
申请号：US778496
申请日：1991-10-17
申请人： Jonathan H. Griffith , John I. Kim , Thomas L. Leong , William J. Tilly , Sari Wacks
发明人： Jonathan H. Griffith , John I. Kim , Thomas L. Leong , William J. Tilly , Sari Wacks
IPC分类号： G03F7/09 , H01L21/027 , H01L21/768 , C23C14/00
CPC分类号： H01L21/7688 , G03F7/094 , H01L21/0272 , H01L21/76885
摘要： A layer of photoresist provides a stress relief (or cushion) layer between a lift-off polymer layer and a barrier of multi-level lift-off structures. When multiple evaporation steps are required using the same lift-off pattern, the adhesion between organosilicon and organic film is stressed by a first blanked metal film. To prevent delamination between the lift-off polymer layer and RIE barrier photoresist is applied on top of the lift-off polymer and sandwiched between the organosilicon and organic materials. This photoresist acts as a cushion and as an adhesion promoter to reduce delamination after the metal deposition(s).
摘要翻译：一层光致抗蚀剂在剥离聚合物层和多层剥离结构的屏障之间提供应力消除（或缓冲）层。当使用相同的剥离图案需要多个蒸发步骤时，有机硅和有机薄膜之间的粘合力被第一冲裁金属薄膜所压制。为了防止剥离聚合物层和RIE阻挡光致抗蚀剂之间的分层施加在剥离聚合物的顶部并夹在有机硅和有机材料之间。该光致抗蚀剂用作缓冲垫和作为粘合促进剂以减少金属沉积之后的分层。

2. 发明授权

US07572726B2 Method of forming a bond pad on an I/C chip and resulting structure 有权
标题翻译：在I / C芯片上形成接合焊盘的方法和结构
公开(公告)号：US07572726B2
公开(公告)日：2009-08-11
申请号：US11271760
申请日：2005-11-10
申请人： Julie C. Biggs , Tien-Jen Cheng , David E. Eichstadt , Lisa A. Fanti , Jonathan H. Griffith , Randolph F. Knarr , Sarah H. Knickerbocker , Kevin S. Petrarca , Roger A. Quon , Wolfgang Sauter , Kamalesh K. Srivastava , Richard P. Volant
发明人： Julie C. Biggs , Tien-Jen Cheng , David E. Eichstadt , Lisa A. Fanti , Jonathan H. Griffith , Randolph F. Knarr , Sarah H. Knickerbocker , Kevin S. Petrarca , Roger A. Quon , Wolfgang Sauter , Kamalesh K. Srivastava , Richard P. Volant
IPC分类号： H01L21/44
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05083 , H01L2224/05147 , H01L2224/05155 , H01L2224/05181 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/4847 , H01L2224/48624 , H01L2224/48644 , H01L2224/48655 , H01L2224/85205 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/04953 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
摘要： A method of forming wire bonds in (I/C) chips comprising: providing an I/C chip having a conductive pad for a wire bond with at least one layer of dielectric material overlying the pad; forming an opening through the dielectric material exposing a portion of said pad. Forming at least a first conductive layer on the exposed surface of the pad and on the surface of the opening. Forming a seed layer on the first conductive layer; applying a photoresist over the seed layer; exposing and developing the photoresist revealing the surface of the seed layer surrounding the opening; removing the exposed seed layer; removing the photoresist material in the opening revealing the seed layer. Plating at least one second layer of conductive material on the seed layer in the opening, and removing the first conductive layer on the dielectric layer around the opening. The invention also includes the resulting structure.
摘要翻译：一种在（I / C）芯片中形成引线键合的方法，包括：提供具有导电焊盘的I / C芯片，所述导电焊盘与覆盖所述焊盘的至少一层电介质材料进行引线接合; 通过暴露所述垫的一部分的电介质材料形成开口。在衬垫的暴露表面和开口表面上形成至少第一导电层。在第一导电层上形成种子层; 在种子层上施加光致抗蚀剂; 曝光和显影光致抗蚀剂，其显露出围绕开口的种子层的表面; 去除暴露的种子层; 去除开口中的光致抗蚀剂材料，露出种子层。在开口中的种子层上电镀至少一层第二导电材料层，以及去除围绕开口的电介质层上的第一导电层。本发明还包括所得到的结构。

3. 发明授权

US06293457B1 Integrated method for etching of BLM titanium-tungsten alloys for CMOS devices with copper metallization 有权
标题翻译：用于铜镀金属CMOS器件的BLM钛 - 钨合金蚀刻的集成方法
公开(公告)号：US06293457B1
公开(公告)日：2001-09-25
申请号：US09590119
申请日：2000-06-08
申请人： Kamalesh K. Srivastava , Jonathan H. Griffith , Mary C. Cullinan-Scholl , William H. Brearley , Peter C. Wade
发明人： Kamalesh K. Srivastava , Jonathan H. Griffith , Mary C. Cullinan-Scholl , William H. Brearley , Peter C. Wade
IPC分类号： B23K3102
CPC分类号： H01L24/05 , C23F1/26 , H01L21/76804 , H01L24/03 , H01L24/11 , H01L24/81 , H01L2224/0347 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05082 , H01L2224/05624 , H01L2224/05647 , H01L2224/1147 , H01L2224/11912 , H01L2224/13023 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/3011 , H01L2924/00014
摘要： Form a solder connector on a semiconductor device starting with a first step of forming at least one dielectric layer over a doped semiconductor substrate. Then form a hole through the dielectric layer down to the semiconductor substrate. Form a metal conductor in the hole. Form intermediate layers over the metal conductor and the dielectric layer. Then form a tapered opening down to the surface of the metal conductor. Form BLM layers including a titanium-tungsten (TiW) layer over the metal conductor and the dielectric layer with the remainder of the BLM layers being formed over the TiW layer. Form a mask over the top surface of the BLM layers with a patterning through hole located above the metal conductor exposing a portion of the surface of the BLM layers. Plate a C4 solder bump on the BLM layers in the patterning hole. Remove the mask. Wet etch away the BLM layers aside from the solder bump leaving a residual TiW layer over the dielectric layer. Perform a dry etching process to remove the residual TiW layer aside from the solder bump. Then, end the dry etching when the end point has been reached. Finally, heat the solder bump in a reflow process to form a C4 solder ball.
摘要翻译：在半导体器件上形成焊料连接器，从在掺杂半导体衬底上形成至少一个电介质层的第一步骤开始。然后通过介电层形成一个穿过半导体衬底的孔。在孔中形成金属导体。在金属导体和电介质层上形成中间层。然后形成锥形开口，直到金属导体的表面。在金属导体上形成包括钛 - 钨（TiW）层的BLM层，其中剩余的BLM层形成在TiW层上。在BLM层的顶表面上形成掩模，其中图案化通孔位于金属导体上方，露出BLM层表面的一部分。在图案化孔中的BLM层上贴上C4焊料凸块。取下面具。湿式蚀刻除了焊料凸块之外的BLM层，在电介质层上留下残留的TiW层。执行干蚀刻工艺以除去焊料凸块之外的残余TiW层。然后，当达到终点时结束干蚀刻。最后，在回流焊过程中加热焊料凸块以形成C4焊球。

4. 发明授权

US06228665B1 Method of measuring oxide thickness during semiconductor fabrication 失效
标题翻译：测量半导体制造过程中氧化物厚度的方法
公开(公告)号：US06228665B1
公开(公告)日：2001-05-08
申请号：US09597637
申请日：2000-06-20
申请人： Jonathan H. Griffith , Ronald L. Smith , Roger L. Verkuil
发明人： Jonathan H. Griffith , Ronald L. Smith , Roger L. Verkuil
IPC分类号： G01R3126
CPC分类号： H01L22/12
摘要： A measurement of thickness of a metal oxide layer on a solder ball connection during semiconductor fabrication is demonstrated by an in-situ capacitance measurement of the oxide layer. A linear relationship is shown between the reactance of the metal oxide and its thickness. This linearity is derived empirically, and correlated to Auger Spectroscopy test results for accuracy. The linear relationship demonstrated with these measurements exhibits a linear correlation coefficient, R2, greater than or equal to 0.974. This close, linear relationship allows for accurate testing of the oxide thickness using standard electrical parameter measurements during wafer fabrication. The method requires the determination of an analytical relationship between dielectric thickness and dielectric capacitance; the performance of an in-situ test of the dielectric layer capacitance including measuring the dielectric layer capacitance; and, the calculation of the dielectric layer thickness by using reactance values, calculated from the measured dielectric layer capacitance, as a variable within the analytical relationship.
摘要翻译：通过氧化物层的原位电容测量来证明在半导体制造期间焊球连接上的金属氧化物层的厚度的测量。金属氧化物的电抗与其厚度之间呈线性关系。这种线性是经验派生的，并与俄歇光谱测试结果相关，以获得准确性。用这些测量证明的线性关系表现出线性相关系数R2，大于或等于0.974。这种密切的线性关系允许在晶片制造期间使用标准电参数测量来精确测量氧化物厚度。该方法需要确定介电厚度和介电电容之间的分析关系; 介质层电容的原位测试的性能包括测量介电层电容; 并且通过使用由测量的介电层电容计算的电抗值作为分析关系中的变量来计算电介质层厚度。

5. 发明授权

US08753460B2 Reduction of edge chipping during wafer handling 有权
标题翻译：在晶片处理期间减少边缘切屑
公开(公告)号：US08753460B2
公开(公告)日：2014-06-17
申请号：US13015638
申请日：2011-01-28
申请人： Sarah H. Knickerbocker , Jonathan H. Griffith
发明人： Sarah H. Knickerbocker , Jonathan H. Griffith
IPC分类号： B32B37/02
CPC分类号： H01L21/6835 , H01L2221/68327
摘要： Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.
摘要翻译：公开了用于加强结合到载体的半导体晶片的周边的方法和系统。在一个实施例中，在粘合之前将另外的粘合剂施加到半导体晶片。附加的粘合剂渗入载体和晶片之间的缝隙并提供增强。在另一个实施例中，在将晶片结合到玻璃载体上之后，通过分配器将粘合剂施加到缝隙。

6. 发明授权

US08314500B2 Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers 有权
标题翻译：用于使用无铅焊料的倒装芯片的互连并具有改进的反应阻挡层
公开(公告)号：US08314500B2
公开(公告)日：2012-11-20
申请号：US11616919
申请日：2006-12-28
申请人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valérie Anne Oberson , Da-Yuan Shih , Kamalesh K Srivastava , Michael J. Sullivan
发明人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valérie Anne Oberson , Da-Yuan Shih , Kamalesh K Srivastava , Michael J. Sullivan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05599 , H01L2224/114 , H01L2224/11462 , H01L2224/1147 , H01L2224/116 , H01L2224/11849 , H01L2224/119 , H01L2224/13023 , H01L2224/13111 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/30107 , H01L2924/01083 , H01L2924/01049 , H01L2224/13099
摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
摘要翻译：一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

7. 发明授权

US4588471A Process for etching composite chrome layers 失效
标题翻译：蚀刻复合铬层的工艺
公开(公告)号：US4588471A
公开(公告)日：1986-05-13
申请号：US715253
申请日：1985-03-25
申请人： Jonathan H. Griffith , Everton H. Henriques , James L. Kehoe, III , Marshall J. Suskie
发明人： Jonathan H. Griffith , Everton H. Henriques , James L. Kehoe, III , Marshall J. Suskie
IPC分类号： C23F1/26 , H05K3/06 , H05K3/24 , H05K3/38 , C23F1/02
CPC分类号： C03C17/40 , C23F1/26 , C03C2218/33 , H05K3/067 , H05K3/244 , H05K3/388
摘要： Chrome/copper/chrome conductor arrays deposited on glass plates are etched with an aqueous acidic composition which contains an acid and a thiourea compound.
摘要翻译：用含有酸和硫脲化合物的酸性组合物蚀刻沉积在玻璃板上的铬/铜/铬导体阵列。

8. 发明申请

US20120193014A1 REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING 有权
标题翻译：在流水处理期间减少边缘剪切
公开(公告)号：US20120193014A1
公开(公告)日：2012-08-02
申请号：US13015638
申请日：2011-01-28
申请人： SARAH H. KNICKERBOCKER , Jonathan H. Griffith
发明人： SARAH H. KNICKERBOCKER , Jonathan H. Griffith
IPC分类号： B32B37/12 , B32B37/06 , B32B38/10 , B32B37/10 , B32B37/14 , B32B38/00 , B32B37/02 , B32B37/08
CPC分类号： H01L21/6835 , H01L2221/68327
摘要： Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.
摘要翻译：公开了用于加强结合到载体的半导体晶片的周边的方法和系统。在一个实施例中，在粘合之前将另外的粘合剂施加到半导体晶片。附加的粘合剂渗入载体和晶片之间的缝隙并提供增强。在另一个实施例中，在将晶片结合到玻璃载体上之后，通过分配器将粘合剂施加到缝隙。

9. 发明授权

US07767575B2 Forming robust solder interconnect structures by reducing effects of seed layer underetching 有权
标题翻译：通过减少种子层脱落的影响，形成坚固的焊料互连结构
公开(公告)号：US07767575B2
公开(公告)日：2010-08-03
申请号：US12348143
申请日：2009-01-02
申请人： Kamalesh K. Srivastava , Subhash L. Shinde , Tien-Jen Cheng , Sarah H. Knickerbocker , Roger A. Quinn , William E. Sablinski , Julie C. Biggs , David E. Eichstadt , Jonathan H. Griffith
发明人： Kamalesh K. Srivastava , Subhash L. Shinde , Tien-Jen Cheng , Sarah H. Knickerbocker , Roger A. Quinn , William E. Sablinski , Julie C. Biggs , David E. Eichstadt , Jonathan H. Griffith
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： H01L24/11 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/0347 , H01L2224/0361 , H01L2224/03912 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05556 , H01L2224/05572 , H01L2224/05647 , H01L2224/05655 , H01L2224/1147 , H01L2224/13006 , H01L2224/13007 , H01L2224/13027 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , Y02P80/30 , H01L2924/00 , H01L2224/13 , H01L2924/00014
摘要： A method for forming an interconnect structure for a semiconductor device includes defining a via in a passivation layer so as expose a top metal layer in the semiconductor device. A seed layer is formed over the passivation layer, sidewalls of the via, and the top metal layer. A barrier layer is formed over an exposed portion of the seed layer, the exposed portion defined by a first patterned opening of a first diameter, and a solder material is formed over the barrier layer using a second patterned opening of a second diameter. The second patterned opening is configured such that the second diameter is larger than the first diameter.
摘要翻译：用于形成半导体器件的互连结构的方法包括在钝化层中限定通孔，以暴露半导体器件中的顶部金属层。在钝化层，通孔的侧壁和顶部金属层上形成种子层。阻挡层形成在种子层的暴露部分上，由第一直径的第一图案化开口限定的暴露部分和使用第二直径的第二图案化开口在阻挡层上形成焊料材料。第二图案化开口被配置为使得第二直径大于第一直径。

10. 发明申请

US20080157395A1 INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING IMPROVED REACTION BARRIER LAYERS 有权
标题翻译：使用无铅焊盘和改进的反应障碍层进行片芯互连
公开(公告)号：US20080157395A1
公开(公告)日：2008-07-03
申请号：US11616919
申请日：2006-12-28
申请人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valerie Anne Oberson , Da-Yuan Shih , Kamalesh K. Srivastava , Michael J. Sullivan
发明人： Luc Belanger , Stephen L. Buchwalter , Leena Paivikki Buchwalter , Ajay P. Giri , Jonathan H. Griffith , Donald W. Henderson , Sung Kwon Kang , Eric H. Laine , Christian Lavoie , Paul A. Lauro , Valerie Anne Oberson , Da-Yuan Shih , Kamalesh K. Srivastava , Michael J. Sullivan
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/12 , H01L24/03 , H01L24/05 , H01L24/11 , H01L2224/0401 , H01L2224/05599 , H01L2224/114 , H01L2224/11462 , H01L2224/1147 , H01L2224/116 , H01L2224/11849 , H01L2224/119 , H01L2224/13023 , H01L2224/13111 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/30107 , H01L2924/01083 , H01L2924/01049 , H01L2224/13099
摘要： An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
摘要翻译：一种适于将微电子器件芯片倒装连接到封装的互连结构，包括二层，三层或四层限流冶金，包括粘附/反应阻挡层，并且具有与含锡的组分反应的焊料可湿性层无铅焊料，使得可焊接层在焊接期间可以完全消耗，但在焊接期间与无铅焊料接触后，阻挡层保持不变。一个或多个无铅焊料球选择性地位于焊料润湿层上，该无铅焊球包含锡作为主要成分和一种或多种合金成分。

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