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1. 发明申请

US20080073557A1 Methods and apparatuses for directing an ion beam source 审中-公开
标题翻译：用于引导离子束源的方法和装置
公开(公告)号：US20080073557A1
公开(公告)日：2008-03-27
申请号：US11493703
申请日：2006-07-26
申请人： John German , Klaus Hartig , John E. Madocks
发明人： John German , Klaus Hartig , John E. Madocks
IPC分类号： H01J27/00
CPC分类号： H01J27/143 , C23C14/221 , C23C14/225 , C23C14/562 , C23C14/564 , H01J37/08 , H01J2237/061 , H01J2237/083 , H01J2237/3151
摘要： A method and apparatus for directing an ion beam toward a surface of a substrate is disclosed. Certain embodiments of the invention relate generally to ion beam sources adapted to direct ion beams toward a surface of a substrate at an oblique angle of incidence relative to the surface. Certain embodiments of the invention are adapted to direct two ion beam portions toward a substrate surface, the ion beam portions having substantially equal throw distances. Preferred embodiments of the invention may be useful in etching applications, where the angle of incidence and throw distance of two ion beam portions are well suited for etching the surface of a substrate.
摘要翻译：公开了一种用于将离子束朝向衬底的表面引导的方法和装置。本发明的某些实施例一般涉及适于将离子束以相对于表面的入射角倾斜地朝向衬底表面的离子束源。本发明的某些实施例适于将两个离子束部分引向衬底表面，离子束部分具有基本相等的投射距离。本发明的优选实施例可用于蚀刻应用，其中两个离子束部分的入射角和投射距离非常适合蚀刻衬底的表面。

2. 发明授权

US07993496B2 Cylindrical target with oscillating magnet for magnetron sputtering 有权
标题翻译：圆柱靶用磁控溅射的振荡磁体
公开(公告)号：US07993496B2
公开(公告)日：2011-08-09
申请号：US11171054
申请日：2005-06-30
申请人： Klaus Hartig , Steve E. Smith , John E. Madocks
发明人： Klaus Hartig , Steve E. Smith , John E. Madocks
IPC分类号： C23C14/00
CPC分类号： H01J37/3455 , H01J37/3405 , H01J37/3423 , H01J37/3497
摘要： In some embodiments, the invention includes a cylindrical cathode target assembly for use in sputtering target material onto a substrate that comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, an elongated magnet carried within the target for generation of a plasma-containing magnetic field exterior to but adjacent the target, a framework for supporting the magnet against rotation within the target, and a power train for causing the magnet to oscillate within and axially of the target in a substantially asynchronous manner to promote generally uniform target utilization along its length, as well as its method of use. In some embodiments, the magnet is oscillated in response to rotation of the target.
摘要翻译：在一些实施例中，本发明包括用于将目标材料溅射到基板上的圆柱形阴极靶组件，该基板包括大致圆柱形的靶，用于在溅射操作期间使靶围绕其轴旋转的装置，用于产生的靶内的细长磁体位于目标外部但邻近目标的等离子体磁场，用于支撑磁体以防止目标内的旋转的框架和用于使磁体以基本上异步的方式在目标内部和轴向振荡的传动系，以促进一般沿其长度的均匀目标利用率及其使用方法。在一些实施例中，磁体响应于目标的旋转而振荡。

3. 发明申请

US20060118408A1 Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films 有权
标题翻译：用于沉积亲水涂层的方法和设备，以及用于薄膜的沉积技术
公开(公告)号：US20060118408A1
公开(公告)日：2006-06-08
申请号：US11129820
申请日：2005-05-16
申请人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
发明人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
IPC分类号： C23C14/32 , C23C14/00
CPC分类号： C23C14/568 , C03C17/002 , C03C17/22 , C03C17/34 , C03C2217/71 , C03C2218/154 , C03C2218/36 , C03C2218/365 , C23C14/352
摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.
摘要翻译：本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。这些目标中的第一个包括硅，而第二个目标包括钛。此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。本发明还提供了用于沉积各种涂层类型的技术和装置。例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

4. 发明授权

US08092660B2 Methods and equipment for depositing hydrophilic coatings, and deposition technologies for thin films 有权
标题翻译：用于沉积亲水涂层的方法和设备，以及用于薄膜的沉积技术
公开(公告)号：US08092660B2
公开(公告)日：2012-01-10
申请号：US11129820
申请日：2005-05-16
申请人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
发明人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
IPC分类号： C23C14/00
CPC分类号： C23C14/568 , C03C17/002 , C03C17/22 , C03C17/34 , C03C2217/71 , C03C2218/154 , C03C2218/36 , C03C2218/365 , C23C14/352
摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.
摘要翻译：本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。这些目标中的第一个包括硅，而第二个目标包括钛。此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。本发明还提供了用于沉积各种涂层类型的技术和装置。例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

5. 发明申请

US20070080056A1 Method and apparatus for cylindrical magnetron sputtering using multiple electron drift paths 审中-公开
标题翻译：使用多个电子漂移路径的圆柱形磁控溅射的方法和装置
公开(公告)号：US20070080056A1
公开(公告)日：2007-04-12
申请号：US11245651
申请日：2005-10-07
申请人： John German , Klaus Hartig
发明人： John German , Klaus Hartig
IPC分类号： C23C14/32 , C23C14/00
CPC分类号： C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/342 , H01J37/3461
摘要： A cylindrical cathode target assembly for use in sputtering target material onto a substrate comprises a generally cylindrical target, means for rotating the target about its axis during a sputtering operation, a magnetic array carried within the target for generation of a plasma-containing field including a plurality of electron drift paths adjacent an outer surface of the target, and a device for supporting the magnetic array independently of rotation of the target. In certain embodiments of the invention, the magnetic array may include a plurality of magnetic elements arranged to form a plurality of electron drift paths spaced along a substantial length of the target to promote generally uniform film deposition and uniform target utilization along its length.
摘要翻译：用于将目标材料溅射到衬底上的圆柱形阴极靶组件包括大致圆柱形的靶，用于在溅射操作期间使靶围绕其轴旋转的装置，用于产生包含等离子体的场的靶内的磁阵列与靶的外表面相邻的多个电子漂移路径，以及用于独立于靶的旋转而支撑磁阵列的装置。在本发明的某些实施例中，磁性阵列可以包括多个磁性元件，其被布置成形成沿靶的相当长度间隔开的多个电子漂移路径，以促进大体均匀的膜沉积并沿着其长度均匀的靶材利用。

6. 发明申请

US20100326816A1 LOW-MAINTENANCE COATING TECHNOLOGY 有权
标题翻译：低维护涂料技术
公开(公告)号：US20100326816A1
公开(公告)日：2010-12-30
申请号：US12875208
申请日：2010-09-03
申请人： Kari B. Myli , Annette J. Krisko , John German , Klaus Hartig
发明人： Kari B. Myli , Annette J. Krisko , John German , Klaus Hartig
IPC分类号： C23C14/34
CPC分类号： C03C17/2456 , C03C17/002 , C03C17/3411 , C03C2217/212 , C03C2217/219 , C03C2217/23 , C03C2217/71 , C03C2217/91 , C03C2218/154 , C23C14/024 , C23C14/083 , C23C14/3464 , C23C14/352 , Y10T428/261 , Y10T428/265 , Y10T428/31678
摘要： The invention provides methods and equipment for depositing a low-maintenance coating.
摘要翻译：本发明提供了用于沉积低维护涂层的方法和设备。

7. 发明授权

US07820296B2 Low-maintenance coating technology 有权
标题翻译：低维护涂层技术
公开(公告)号：US07820296B2
公开(公告)日：2010-10-26
申请号：US12209788
申请日：2008-09-12
申请人： Kari B. Myli , Annette J. Krisko , John German , Klaus Hartig
发明人： Kari B. Myli , Annette J. Krisko , John German , Klaus Hartig
IPC分类号： B32B17/06
CPC分类号： C03C17/2456 , C03C17/002 , C03C17/3411 , C03C2217/212 , C03C2217/219 , C03C2217/23 , C03C2217/71 , C03C2217/91 , C03C2218/154 , C23C14/024 , C23C14/083 , C23C14/3464 , C23C14/352 , Y10T428/261 , Y10T428/265 , Y10T428/31678
摘要： The invention provides a substrate bearing a low-maintenance coating. In some embodiments, the coating includes a low-maintenance film that includes a thickness of film comprising titania, wherein only part of that thickness includes tungsten. The thickness includes an inner portion and an outer portion, the outer portion being the part that includes tungsten. The invention also provides methods and equipment for depositing such coatings.
摘要翻译：本发明提供一种具有低维护性涂层的基材。在一些实施方案中，涂层包括低维护性膜，其包括包含二氧化钛的膜的厚度，其中仅一部分厚度包括钨。厚度包括内部部分和外部部分，外部部分是包括钨的部分。本发明还提供了沉积这种涂层的方法和设备。

8. 发明申请

US20060121315A1 Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films 有权
标题翻译：亲水性涂料，沉积亲水性涂料的方法和改进的薄膜沉积技术
公开(公告)号：US20060121315A1
公开(公告)日：2006-06-08
申请号：US11293032
申请日：2005-12-02
申请人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
发明人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
IPC分类号： B32B18/00 , B32B19/00
CPC分类号： C23C14/08 , C03C17/36 , C03C17/366 , C03C2217/71 , C03C2217/75 , C03C2217/78 , C03C2218/154 , C03C2218/365 , C23C14/3464 , Y10T428/252 , Y10T428/266
摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.
摘要翻译：本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。这些目标中的第一个包括硅，而第二个目标包括钛。此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。本发明还提供了用于沉积各种涂层类型的技术和装置。例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

9. 发明授权

US07923114B2 Hydrophilic coatings, methods for depositing hydrophilic coatings, and improved deposition technology for thin films 有权
标题翻译：亲水性涂料，沉积亲水性涂料的方法和改进的薄膜沉积技术
公开(公告)号：US07923114B2
公开(公告)日：2011-04-12
申请号：US11293032
申请日：2005-12-02
申请人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
发明人： Kari Myli , Gary Pfaff , James Brownlee , John German , Annette Krisko , Klaus Hartig
IPC分类号： B32B9/00
CPC分类号： C23C14/08 , C03C17/36 , C03C17/366 , C03C2217/71 , C03C2217/75 , C03C2217/78 , C03C2218/154 , C03C2218/365 , C23C14/3464 , Y10T428/252 , Y10T428/266
摘要： The invention provides certain embodiments that involve sputtering techniques for applying a mixed oxide film comprising silica and titania. In these embodiments, the techniques involve sputtering at least two targets in a common chamber (e.g., in a shared gaseous atmosphere). A first of these targets includes silicon, while a second of the targets includes titanium. Further, the invention provides embodiments involving a substrate bearing a hydrophilic coating, which can be deposited by sputtering or any other suitable thin film deposition technique. The invention also provides techniques and apparatuses useful for depositing a wide variety of coating types. For example, the invention provides thin film deposition technologies in which sputtering apparatuses or other thin film deposition apparatuses are employed.
摘要翻译：本发明提供了涉及用于施加包含二氧化硅和二氧化钛的混合氧化物膜的溅射技术的某些实施方案。在这些实施例中，这些技术涉及在公共室中（例如，在共享气体气氛中）溅射至少两个靶。这些目标中的第一个包括硅，而第二个目标包括钛。此外，本发明提供了涉及具有亲水涂层的基底的实施例，其可以通过溅射或任何其它合适的薄膜沉积技术进行沉积。本发明还提供了用于沉积各种涂层类型的技术和装置。例如，本发明提供了使用溅射装置或其它薄膜沉积装置的薄膜沉积技术。

10. 发明申请

US20120132261A1 CADMIUM STANNATE SPUTTER 审中-公开
公开(公告)号：US20120132261A1
公开(公告)日：2012-05-31
申请号：US13171987
申请日：2011-06-29
申请人： Benyamin Buller , Douglas Dauson , Scott Mills , Dale Roberts , Yu Yang , Zhibo Zhao , Keith Burrows , Klaus Hartig , Annette Krisko
发明人： Benyamin Buller , Douglas Dauson , Scott Mills , Dale Roberts , Yu Yang , Zhibo Zhao , Keith Burrows , Klaus Hartig , Annette Krisko
IPC分类号： H01L31/048 , H01L31/0224
CPC分类号： C23C14/3414 , C23C14/086 , H01L31/022466 , H01L31/03925 , H01L31/073 , H01L31/1884 , Y02E10/543 , Y02P70/521
摘要： A structure includes a barrier layer which can include a silicon aluminum oxide, and a transparent conductive oxide layer which can include a layer of cadmium and tin.
摘要翻译：结构包括可以包括硅氧化铝的阻挡层和可以包括镉和锡层的透明导电氧化物层。

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