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1. 发明授权

US11004718B2 Sectional porous carrier forming a temporary impervious support 有权
公开(公告)号：US11004718B2
公开(公告)日：2021-05-11
申请号：US16177251
申请日：2018-10-31
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/18 , H01L21/56 , B32B15/02 , B32B37/14 , B32B38/18 , B32B37/00
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

2. 发明申请

US20120077132A1 PROCESSESS AND COMPOSITIONS FOR REMOVING SUBSTANCES FROM SUBSTRATES 有权
标题翻译：从基材中除去物质的方法和组合物
公开(公告)号：US20120077132A1
公开(公告)日：2012-03-29
申请号：US12891745
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
IPC分类号： G03F7/30
CPC分类号： G03F7/422 , G03F7/425 , G03F7/426 , H01L21/02057 , H01L21/31133
摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。

3. 发明申请

US20190074207A1 Sectional Porous Carrier Forming a Temporary Impervious Support 审中-公开
公开(公告)号：US20190074207A1
公开(公告)日：2019-03-07
申请号：US16177251
申请日：2018-10-31
申请人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
发明人： John Cleaon Moore , Alexander Joseph Brewer , Jared Michael Pettit , Alman XiMin Law
IPC分类号： H01L21/683 , B32B15/02 , B32B17/06 , B32B7/12 , B32B37/12 , B32B37/14 , B32B37/18 , H01L21/56 , B32B37/00 , B32B38/18
摘要： Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

4. 发明申请

US20120073607A1 POLYMERIC OR MONOMERIC COMPOSITIONS COMPRISING AT LEAST ONE MONO-AMIDE AND/OR AT LEAST ONE DIAMIDE FOR REMOVING SUBSTANCES FROM SUBSTRATES AND METHODS FOR USING THE SAME 审中-公开
标题翻译：包含至少一个单酰胺和/或至少一个二胺的聚合物或单体组合物用于从基底去除物质及其使用方法
公开(公告)号：US20120073607A1
公开(公告)日：2012-03-29
申请号：US12891698
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
IPC分类号： B08B3/00 , G03F7/42
CPC分类号： C09D4/06 , C09D9/005 , C11D3/378 , C11D7/263 , C11D7/3218 , C11D11/0047 , C11D11/0058
摘要： Compositions and methods useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Methods are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. The compositions and methods may be suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基板去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并立即用水冲洗以实现完全去除。组合物和方法可适用于除去和完全溶解正极和负极品种的光致抗蚀剂以及来自电子器件的热固性聚合物。

5. 发明申请

US20100242998A1 COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES 失效
标题翻译：用于去除有机物质的组合物和方法
公开(公告)号：US20100242998A1
公开(公告)日：2010-09-30
申请号：US12413085
申请日：2009-03-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore
IPC分类号： B08B3/08 , G03F7/42
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。

6. 发明申请

US20100151118A1 CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS 审中-公开
标题翻译：载体溶剂组合物，涂料组合物和生产厚聚合物涂料的方法
公开(公告)号：US20100151118A1
公开(公告)日：2010-06-17
申请号：US12336593
申请日：2008-12-17
申请人： Michael Wayne Quillen , Loady Palmer Holbrook, JR. , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
发明人： Michael Wayne Quillen , Loady Palmer Holbrook, JR. , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
IPC分类号： B05D5/12 , C09K3/00 , C08K5/101 , C08K5/07
CPC分类号： G03F7/0048
摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.
摘要翻译：提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

7. 发明申请

US20220279842A1 PORTABLE VAPORIZING APPARATUS AND A METHOD THEREOF 有权
公开(公告)号：US20220279842A1
公开(公告)日：2022-09-08
申请号：US17688630
申请日：2022-03-07
申请人： John Cleaon Moore
发明人： John Cleaon Moore
IPC分类号： A24F40/10 , A24F40/42 , A61M15/00
摘要： A portable vaporizing apparatus for inhalation therapy and method of operation of the portable vaporizing apparatus are disclosed. The portable vaporizing apparatus includes a liquid cartridge comprising therapeutic substance, and ultrasonic activating tip removably coupled to proximal end of liquid cartridge. Furthermore, portable vaporizing apparatus includes mouthpiece having airflow outlet removably coupled to outer edge of proximal end of liquid cartridge. Thereafter, portable vaporizing apparatus includes power source removably coupled to distal end of liquid cartridge. The portable vaporizing apparatus receives ambient air via mouthpiece and power from power source to liquid cartridge. Further, portable vaporizing apparatus agitates ultrasonic waves in ultrasonic activating tip using received power.
Furthermore, portable vaporizing apparatus vaporizes therapeutic substance comprised in liquid cartridge, based on agitated ultrasonic waves and ambient air. Also, portable vaporizing apparatus creates aerosol from vaporized therapeutic substance, to pass into mouthpiece for breathing into airway of user.

8. 发明授权

US08444768B2 Compositions and methods for removing organic substances 失效
标题翻译：组合物和去除有机物质的方法
公开(公告)号：US08444768B2
公开(公告)日：2013-05-21
申请号：US12413085
申请日：2009-03-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
IPC分类号： G03F7/42
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。

9. 发明授权

US08309502B2 Compositions and methods for removing organic substances 有权
标题翻译：组合物和去除有机物质的方法
公开(公告)号：US08309502B2
公开(公告)日：2012-11-13
申请号：US12715978
申请日：2010-03-02
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
IPC分类号： C11D7/50
CPC分类号： C11D11/0047 , C11D3/2068 , C11D3/3472 , C11D3/43 , C11D7/263 , C11D7/34 , C11D7/5022 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译：提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。

10. 发明申请

US20110165772A1 CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS 审中-公开
标题翻译：载体溶剂组合物，涂料组合物和生产厚聚合物涂料的方法
公开(公告)号：US20110165772A1
公开(公告)日：2011-07-07
申请号：US13047377
申请日：2011-03-14
申请人： Michael Wayne Quillen , Loady Palmer Holbrook , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
发明人： Michael Wayne Quillen , Loady Palmer Holbrook , Stephanie Ann Roane , Dale Edward O'Dell , John Cleaon Moore
IPC分类号： H01L21/28 , H01L21/31
CPC分类号： G03F7/0048
摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.
摘要翻译：提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

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