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1. 发明申请

US20140008004A1 METHOD AND COUPLER FOR JOINING POLYMERIC TUBULAR OBJECTS 审中-公开
标题翻译：用于接合聚合管状物体的方法和耦合器
公开(公告)号：US20140008004A1
公开(公告)日：2014-01-09
申请号：US13542001
申请日：2012-07-05
申请人： Joel A. Dyksterhouse , Edward J. Gordon
发明人： Joel A. Dyksterhouse , Edward J. Gordon
IPC分类号： F16L47/02 , B32B41/00 , B32B37/06
CPC分类号： F16L47/02 , B29C65/3456 , B29C65/348 , B29C65/3492 , B29C65/3496 , B29C65/3656 , B29C65/368 , B29C65/3696 , B29C66/0342 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/305 , B29C66/5221 , B29C66/636 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/723 , B29C66/72321 , B29C66/72341 , B29C66/73921 , B29C66/73941 , B29C66/8264 , B29C66/91216 , B29C66/91221 , B29C66/91411 , B29C66/91443 , B29C66/91643 , B29C66/91651 , B29C66/91655 , B29C66/961 , B29C66/974 , B29K2023/065 , B29K2023/086 , B29K2309/08 , B29K2083/00 , B29K2019/00 , B29K2023/06
摘要： The specification discloses a method and a coupler for joining polymeric tubular objects, such as pipe. The coupler includes (a) a rigid, electromagnetically inductive carrier, (b) a temperature-responsive expandable material on the carrier, and (c) a polymeric material on the expandable material. The method includes the steps of (a) inserting the coupler into the ends of two adjacent polymeric tubular objects, (b) creating an electromagnetic field about the coupler causing the carrier to heat, in turn causing the expandable material to expand and force the polymeric material against the tubular objects, and further in turn causing the polymeric material to melt, soften, or liquefy, and (c) terminating the electromagnetic field allowing the polymeric material to cure or solidify to bond to the tubular objects.
摘要翻译：本说明书公开了一种用于连接诸如管道的聚合物管状物体的方法和联接器。耦合器包括（a）刚性的电磁感应载体，（b）载体上的温度响应可膨胀材料，和（c）可膨胀材料上的聚合材料。该方法包括以下步骤：（a）将耦合器插入两个相邻的聚合物管状物体的端部，（b）围绕耦合器产生电磁场，使载体加热，从而使可膨胀材料膨胀并迫使聚合物材料抵抗管状物体，进一步导致聚合材料熔化，软化或液化，和（c）终止电磁场，使聚合物材料固化或固化以结合到管状物体上。

2. 发明授权

US08809144B2 On-chip capacitors with a variable capacitance for a radiofrequency integrated circuit 有权
标题翻译：具有用于射频集成电路的可变电容的片上电容器
公开(公告)号：US08809144B2
公开(公告)日：2014-08-19
申请号：US13534355
申请日：2012-06-27
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H01L21/8234
CPC分类号： H01G7/00 , G06F17/5054 , H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Methods of fabricating an on-chip capacitor with a variable capacitance, as well as methods of adjusting the capacitance of an on-chip capacitor and design structures for an on-chip capacitor. The method includes forming first and second ports configured to be powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. The method includes configuring the first voltage-controlled unit to selectively couple the first electrode with the first port, and the second voltage-controlled unit to selectively couple the second electrode with the second port. When the first electrode is coupled by the first voltage-controlled unit with the first port and the second electrode is coupled by the second voltage-controlled unit with the second port, the capacitance of the on-chip capacitor increases.
摘要翻译：制造具有可变电容的片上电容器的方法，以及调节片上电容器的电容和片上电容器的设计结构的方法。该方法包括形成配置为以相反极性供电的第一和第二端口，第一和第二电极以及第一和第二压力控制单元。该方法包括配置第一电压控制单元以选择性地将第一电极与第一端口耦合，以及第二电压控制单元以选择性地将第二电极与第二端口耦合。当第一电极通过第一电压控制单元与第一端口耦合，并且第二电极通过第二电压控制单元与第二端口耦合时，片上电容器的电容增加。

3. 发明申请

US20100237468A1 ON-CHIP CAPACITORS WITH A VARIABLE CAPACITANCE FOR A RADIOFREQUENCY INTEGRATED CIRCUIT 有权
标题翻译：具有适用于无线电综合电路的可变电容的片上电容器
公开(公告)号：US20100237468A1
公开(公告)日：2010-09-23
申请号：US12552317
申请日：2009-09-02
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H01L29/93 , G06F17/50 , H01L21/329
CPC分类号： H01G7/00 , G06F17/5054 , H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： On-chip capacitors with a variable capacitance, as well as design structures for a radio frequency integrated circuit, and method of fabricating and method of tuning on-chip capacitors. The on-chip capacitor includes first and second ports powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. Each of the first and second voltage-controlled units is switched between a first state in which the first and second electrodes are electrically isolated from the first and second ports and a second state. When the first voltage-controlled unit is switched to the second state, the first electrode is electrically connected with the first port. When the second voltage-controlled unit is switched to the second state the second electrode is electrically connected with the second port. The on-chip capacitor has a larger capacitance value when the first and second voltage-controlled units are in the second state.
摘要翻译：具有可变电容的片上电容器，以及用于射频集成电路的设计结构，以及制造方法和片上电容器的调谐方法。片上电容器包括由相反极性供电的第一和第二端口，第一和第二电极以及第一和第二电压控制单元。第一和第二压控单元中的每一个在第一和第二电极与第一和第二端口电隔离的第一状态和第二状态之间切换。当第一电压控制单元切换到第二状态时，第一电极与第一端口电连接。当第二电压控制单元切换到第二状态时，第二电极与第二端口电连接。当第一和第二电压控制单元处于第二状态时，片上电容器具有较大的电容值。

4. 发明授权

US08169050B2 BEOL wiring structures that include an on-chip inductor and an on-chip capacitor, and design structures for a radiofrequency integrated circuit 有权
标题翻译：包括片上电感器和片上电容器的BEOL接线结构以及射频集成电路的设计结构
公开(公告)号：US08169050B2
公开(公告)日：2012-05-01
申请号：US12146555
申请日：2008-06-26
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H01L29/00 , H01L21/44
CPC分类号： H01L27/0688 , H01L23/5223 , H01L23/5227 , H01L2924/0002 , H01L2924/3011 , H03H2001/0092 , H01L2924/00
摘要： Back-end-of-line (BEOL) wiring structures that include an on-chip inductor and an on-chip capacitor, as well as design structures for a radiofrequency integrated circuit. The on-chip inductor and an on-chip capacitor, which are fabricated as conductive features in different metallization levels, are vertically aligned with each other. The on-chip capacitor, which is located between the on-chip inductor and the substrate, may serve as a Faraday shield for the on-chip inductor. Optionally, the BEOL wiring structure may include an optional Faraday shield located vertically either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the top surface of the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the electrodes of the on-chip capacitor to permit tuning, during circuit operation, of a resonance frequency of an LC resonator that further includes the on-chip inductor.
摘要翻译：包括片上电感器和片上电容器的后端行（BEOL）布线结构以及射频集成电路的设计结构。制造为不同金属化水平的导电特征的片上电感器和片上电容器彼此垂直对准。位于片上电感器和衬底之间的片上电容器可以用作片上电感器的法拉第屏蔽。可选地，BEOL布线结构可以包括位于片上电容器和片上电感器之间或片上电容器与衬底顶表面之间的可选法拉第屏蔽。 BEOL布线结构可以包括能够与片上电容器的电极选择性耦合的至少一个浮动电极，以允许在电路操作期间调谐进一步包括片上电感器的LC谐振器的谐振频率。

5. 发明授权

US07811919B2 Methods of fabricating a BEOL wiring structure containing an on-chip inductor and an on-chip capacitor 有权
标题翻译：制造包含片上电感器和片上电容器的BEOL布线结构的方法
公开(公告)号：US07811919B2
公开(公告)日：2010-10-12
申请号：US12146546
申请日：2008-06-26
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H01L21/44
CPC分类号： H01L27/0794 , H01F2017/0046 , H01F2017/008 , H01F2021/125 , H01L23/5222 , H01L23/5227 , H01L28/10 , H01L28/20 , H01L2924/0002 , H01L2924/3011 , H03H2001/0014 , H03H2001/0092 , H01L2924/00
摘要： Methods for fabricating a back-end-of-line (BEOL) wiring structure that includes an on-chip inductor and an on-chip capacitor, as well as methods for tuning and fabricating a resonator that includes the on-chip inductor and on-chip capacitor. The fabrication methods generally include forming the on-chip capacitor and on-chip inductor in different metallization levels of the BEOL wiring structure and laterally positioned to be substantially vertical alignment. The on-chip capacitor may serve as a Faraday shield for the on-chip inductor. Optionally, a Faraday shield may be fabricated either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the directly-connected electrodes of the on-chip capacitor for tuning, during circuit operation, a resonance frequency of an LC resonator that further includes the on-chip inductor.
摘要翻译：用于制造包括片上电感器和片上电容器的后端行（BEOL）布线结构的方法，以及用于调谐和制造包括片上电感器和在线电感器的谐振器的方法，片式电容器。制造方法通常包括在BEOL布线结构的不同金属化水平下形成片上电容器和片上电感器，并且横向定位成基本上垂直对准。片上电容器可以用作片上电感器的法拉第屏蔽。可选地，法拉第屏蔽可以制造在片上电容器和片上电感器之间，或在片上电容器和衬底之间。 BEOL布线结构可以包括至少一个浮动电极，其能够与片上电容器的直接连接的电极选择性地耦合，用于在电路操作期间调谐LC谐振器的谐振频率，该谐振频率还包括片上电感器。

6. 发明授权

US07739636B2 Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise 失效
标题翻译：结合半导体器件结构的设计结构，可以将接合焊盘屏蔽电气噪声
公开(公告)号：US07739636B2
公开(公告)日：2010-06-15
申请号：US11877155
申请日：2007-10-23
申请人： David S. Collins , Mete Erturk , Edward J. Gordon , Robert Groves , Robert M. Rassel
发明人： David S. Collins , Mete Erturk , Edward J. Gordon , Robert Groves , Robert M. Rassel
IPC分类号： G06F17/50 , G06F9/45
CPC分类号： H01L23/5225 , H01L21/823475 , H01L23/3171 , H01L23/552 , H01L24/05 , H01L27/0688 , H01L2224/02166 , H01L2224/04042 , H01L2224/05 , H01L2224/05093 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025
摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes active circuitry on a substrate, a bond pad carried by the substrate, and a shielding structure disposed between the substrate and the bond pad. The shielding structure includes a plurality of electrically characterized devices configured to reduce noise transmission from the active circuitry to the bond pad.
摘要翻译：用于设计，制造或测试设计的机器可读介质中体现的设计结构。该设计结构包括衬底上的有源电路，由衬底承载的接合焊盘以及设置在衬底和焊盘之间的屏蔽结构。屏蔽结构包括被配置为减少从有源电路到接合焊盘的噪声传输的多个电特征化器件。

7. 发明申请

US20120262229A1 ON-CHIP CAPACITORS WITH A VARIABLE CAPACITANCE FOR A RADIOFREQUENCY INTEGRATED CIRCUIT 有权
标题翻译：具有适用于无线电综合电路的可变电容的片上电容器
公开(公告)号：US20120262229A1
公开(公告)日：2012-10-18
申请号：US13534355
申请日：2012-06-27
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H01L29/93 , G06F17/50 , H01L21/329
CPC分类号： H01G7/00 , G06F17/5054 , H01L23/5223 , H01L28/60 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Methods of fabricating an on-chip capacitor with a variable capacitance, as well as methods of adjusting the capacitance of an on-chip capacitor and design structures for an on-chip capacitor. The method includes forming first and second ports configured to be powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. The method includes configuring the first voltage-controlled unit to selectively couple the first electrode with the first port, and the second voltage-controlled unit to selectively couple the second electrode with the second port. When the first electrode is coupled by the first voltage-controlled unit with the first port and the second electrode is coupled by the second voltage-controlled unit with the second port, the capacitance of the on-chip capacitor increases.
摘要翻译：制造具有可变电容的片上电容器的方法，以及调节片上电容器的电容和片上电容器的设计结构的方法。该方法包括形成配置为以相反极性供电的第一和第二端口，第一和第二电极以及第一和第二压力控制单元。该方法包括配置第一电压控制单元以选择性地将第一电极与第一端口耦合，以及第二电压控制单元以选择性地将第二电极与第二端口耦合。当第一电极通过第一电压控制单元与第一端口耦合，并且第二电极通过第二电压控制单元与第二端口耦合时，片上电容器的电容增加。

8. 发明申请

US20090020856A1 SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE 审中-公开
标题翻译：半导体器件结构和电子屏蔽屏蔽的方法
公开(公告)号：US20090020856A1
公开(公告)日：2009-01-22
申请号：US11778902
申请日：2007-07-17
申请人： David S. Collins , Mete Erturk , Edward J. Gordon , Robert Groves , Robert M. Rassel
发明人： David S. Collins , Mete Erturk , Edward J. Gordon , Robert Groves , Robert M. Rassel
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/5225 , H01L23/552 , H01L23/642 , H01L24/05 , H01L27/0203 , H01L2224/02166 , H01L2224/05093 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025
摘要： Semiconductor device structures and methods for shielding a bond pad from electrical noise generated by active circuitry of an integrated circuit carried on a substrate. The structure includes electrically characterized devices placed in a pre-determined arrangement under the bond pad. The pre-determined arrangement of the electrically characterized devices provides for a consistent high frequency environment under the bond pad, which simplifies modeling of the bond pad by a circuit designer.
摘要翻译：用于屏蔽接合焊盘的电子器件结构和方法，其由承载在衬底上的集成电路的有源电路产生的电噪声。该结构包括以特定的布置放置在接合焊盘下方的电特征化器件。电气特征化器件的预定布置提供了在焊盘下方的一致的高频环境，这简化了电路设计者对接合焊盘的建模。

9. 发明授权

US6039579A Sealed socket assembly for a plug-in lamp and a method for assembling same 失效
标题翻译：用于插入式灯的密封插座组件及其组装方法
公开(公告)号：US6039579A
公开(公告)日：2000-03-21
申请号：US121935
申请日：1998-07-24
申请人： Donald C. Paul , Joseph C. Bennett , Joseph A. Bettini , Edward J. Gordon
发明人： Donald C. Paul , Joseph C. Bennett , Joseph A. Bettini , Edward J. Gordon
IPC分类号： H01R33/09 , H01R33/965 , H01R9/09
CPC分类号： H01R33/09 , H01R33/965
摘要： A plug-in lamp socket assembly is provided that maintains connections sealed to the environment between the electrical lamp leads, electrical socket contacts and circuits of the circuit carrier. The assembly has a lamp socket member for receiving a lamp in an aligned manner. A cap plate connects to the lamp socket member and is non-removable therefrom. The lamp socket has tabs that require proper alignment of the tabs for insertion into a circuit carrier having circuits molded therein. An O-ring seals the removable connection between the lamp socket, cap plate, assembly and the circuit carrier. The circuit carrier is sealed to the lens housing.
摘要翻译：提供插入式灯插座组件，其保持与电灯导线，电插座触点和电路载体的电路之间的环境密封的连接。组件具有用于以对齐的方式接收灯的灯座构件。盖板连接到灯座构件并且不可拆卸。灯座具有突出部，其需要用于插入到具有在其中模制的电路的电路载体中的突片的适当对准。 O形圈密封灯座，盖板，组件和电路托架之间的可拆卸连接。电路载体被密封到透镜壳体。

10. 发明申请

US20090322446A1 Methods of Fabricating a BEOL Wiring Structure Containing an On-Chip Inductor and an On-Chip Capacitor 有权
标题翻译：制造包含片上电感和片上电容器的BEOL接线结构的方法
公开(公告)号：US20090322446A1
公开(公告)日：2009-12-31
申请号：US12146546
申请日：2008-06-26
申请人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
发明人： Douglas M. Daley , Mete Erturk , Edward J. Gordon
IPC分类号： H03H7/00 , H01L21/02
CPC分类号： H01L27/0794 , H01F2017/0046 , H01F2017/008 , H01F2021/125 , H01L23/5222 , H01L23/5227 , H01L28/10 , H01L28/20 , H01L2924/0002 , H01L2924/3011 , H03H2001/0014 , H03H2001/0092 , H01L2924/00
摘要： Methods for fabricating a back-end-of-line (BEOL) wiring structure that includes an on-chip inductor and an on-chip capacitor, as well as methods for tuning and fabricating a resonator that includes the on-chip inductor and on-chip capacitor. The fabrication methods generally include forming the on-chip capacitor and on-chip inductor in different metallization levels of the BEOL wiring structure and laterally positioned to be substantially vertical alignment. The on-chip capacitor may serve as a Faraday shield for the on-chip inductor. Optionally, a Faraday shield may be fabricated either between the on-chip capacitor and the on-chip inductor, or between the on-chip capacitor and the substrate. The BEOL wiring structure may include at least one floating electrode capable of being selectively coupled with the directly-connected electrodes of the on-chip capacitor for tuning, during circuit operation, a resonance frequency of an LC resonator that further includes the on-chip inductor.
摘要翻译：用于制造包括片上电感器和片上电容器的后端行（BEOL）布线结构的方法，以及用于调谐和制造包括片上电感器和在线电感器的谐振器的方法，片式电容器。制造方法通常包括在BEOL布线结构的不同金属化水平下形成片上电容器和片上电感器，并且横向定位成基本上垂直对准。片上电容器可以用作片上电感器的法拉第屏蔽。可选地，法拉第屏蔽可以制造在片上电容器和片上电感器之间，或在片上电容器和衬底之间。 BEOL布线结构可以包括至少一个浮动电极，其能够与片上电容器的直接连接的电极选择性地耦合，用于在电路操作期间调谐LC谐振器的谐振频率，该谐振频率还包括片上电感器。

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