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1. 发明授权

US09581639B2 Organic space transformer attachment and assembly 有权
标题翻译：有机空间变压器附件和组装
公开(公告)号：US09581639B2
公开(公告)日：2017-02-28
申请号：US14142752
申请日：2013-12-28
申请人： Jin Yang , Erkan Acar , Todd P. Albertson , Joe F. Walczyk
发明人： Jin Yang , Erkan Acar , Todd P. Albertson , Joe F. Walczyk
IPC分类号： G01R1/073 , G01R31/28 , H05K3/32
CPC分类号： G01R31/2889 , H05K3/325 , Y10T29/4902
摘要： Electronic device assemblies and methods including an organic substrate based space transformer are described. One assembly includes a space transformer comprising an organic substrate. The assembly also includes a carrier on which the space transformer is positioned, and a clamp positioned to couple the space transformer to the carrier. The assembly also includes a probe array positioned on the space transformer, wherein the space transformer is positioned between the probe array and the carrier. The assembly also includes a printed circuit board, wherein the carrier is positioned between the printed circuit board and the space transformer. The assembly also includes electrical connections to electrically couple the space transformer to the printed circuit board. Other embodiments are described and claimed.
摘要翻译：描述了包括基于有机衬底的空间变换器的电子器件组件和方法。一个组件包括空间变压器，其包括有机衬底。组件还包括其上定位有空间变压器的载体和用于将空间变压器耦合到载体的夹具。组件还包括位于空间变压器上的探针阵列，其中空间变换器位于探针阵列和载体之间。组件还包括印刷电路板，其中载体位于印刷电路板和空间变压器之间。组件还包括将空间变压器电耦合到印刷电路板的电连接。描述和要求保护其他实施例。

2. 发明授权

US08891235B2 Thermal interface for multi-chip packages 有权
标题翻译：多芯片封装的热接口
公开(公告)号：US08891235B2
公开(公告)日：2014-11-18
申请号：US13539279
申请日：2012-06-29
申请人： Joseph F. Walczyk , Jin Yang , James G. Maveety , Todd P. Albertson , Ashish Gupta , Jin Pan , Arun Krishnamoorthy
发明人： Joseph F. Walczyk , Jin Yang , James G. Maveety , Todd P. Albertson , Ashish Gupta , Jin Pan , Arun Krishnamoorthy
IPC分类号： H05K7/20 , F28F9/007
CPC分类号： F28F9/007 , G01R31/2874 , H01L23/40 , H01L23/473 , H01L2023/4056 , H01L2224/16 , H05K7/205
摘要： A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).
摘要翻译：热接口单元包括基座，底座下方的第一接触表面以与第一管芯和扁平弹簧相接合，以使得第一接触表面适应于多芯片封装（MCP）的第一管芯的可变高度，。

3. 发明申请

US20140002994A1 THERMAL INTERFACE FOR MULTI-CHIP PACKAGES 有权
标题翻译：多芯片封装的热接口
公开(公告)号：US20140002994A1
公开(公告)日：2014-01-02
申请号：US13539279
申请日：2012-06-29
申请人： Joseph F. Walczyk , Jin Yang , James G. Maveety , Todd P. Albertson , Ashish Gupta , Jin Pan , Arun Krishnamoorthy
发明人： Joseph F. Walczyk , Jin Yang , James G. Maveety , Todd P. Albertson , Ashish Gupta , Jin Pan , Arun Krishnamoorthy
IPC分类号： F28F9/007 , H05K7/20
CPC分类号： F28F9/007 , G01R31/2874 , H01L23/40 , H01L23/473 , H01L2023/4056 , H01L2224/16 , H05K7/205
摘要： A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).
摘要翻译：热接口单元包括基座，底座下方的第一接触表面以与第一管芯和扁平弹簧相接合，以使得第一接触表面适应于多芯片封装（MCP）的第一管芯的可变高度，。

4. 发明申请

US20150002181A1 PROBE TIP FORMATION FOR DIE SORT AND TEST 有权
标题翻译：用于DIE排序和测试的探针提示
公开(公告)号：US20150002181A1
公开(公告)日：2015-01-01
申请号：US13931866
申请日：2013-06-29
申请人： Keith J. Martin , Kip P. Stevenson , Kamil S. Salloum , Todd P. Albertson
发明人： Keith J. Martin , Kip P. Stevenson , Kamil S. Salloum , Todd P. Albertson
IPC分类号： G01R3/00 , G01R1/073
CPC分类号： G01R3/00 , G01R1/06738 , Y10T29/49124
摘要： Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.
摘要翻译：探针尖端形成描述为模具分类和测试。在一个示例中，准备测试探头的电线末端用作测试探针。电线连接到测试头头基板。与衬底相对的端部具有尖端。当连接到测试头上时，电线的尖端被抛光以形成锐化点。

5. 发明申请

US20140091821A1 COMPOSITE WIRE PROBES FOR TESTING INTEGRATED CIRCUITS 有权
标题翻译：用于测试集成电路的复合电线探头
公开(公告)号：US20140091821A1
公开(公告)日：2014-04-03
申请号：US13631599
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson , Kip P. Stevenson
发明人： David Shia , Todd P. Albertson , Kip P. Stevenson
IPC分类号： G01R1/067 , G01R31/26
CPC分类号： G01R1/06761 , G01R3/00 , G01R31/2886
摘要： An electrical probe of an aspect includes a high yield strength wire core. The high yield strength wire core includes predominantly one or more materials selected from tungsten, tungsten-copper alloy, tungsten-nickel alloy, beryllium-copper alloy, molybdenum, stainless steel, and combinations thereof. The high mechanical strength wire core has a yield strength of at least 1 gigapascal (GPa) at temperature of 250° C. The electrical probe also includes a low electrical resistivity layer concentrically around the high yield strength wire core. The concentric layer includes predominantly one or more materials selected from silver, gold, copper, and combinations thereof. The low electrical resistivity layer has an electrical resistivity of no more than 2×10−8 Ohm-meters. The electrical probe has an outer cross-sectional dimension of the electrical probe that is no more than 50 micrometers. Between 60 to 85% of the outer cross-sectional dimension is provided by the high mechanical strength wire core. Between 10 to 30% of the outer cross-sectional dimension is provided by the low electrical resistivity layer.
摘要翻译：一个方面的电探针包括高屈服强度的线芯。高屈服强度线芯主要包括选自钨，钨 - 铜合金，钨 - 镍合金，铍 - 铜合金，钼，不锈钢及其组合中的一种或多种材料。高机械强度线芯在250℃的温度下具有至少1千兆帕（GPa）的屈服强度。电探针还包括围绕高屈服强度线芯同心的低电阻率层。同心层主要包括一种或多种选自银，金，铜及其组合的材料。低电阻率层的电阻率不超过2×10-8欧姆米。电探针具有不大于50微米的电探针的外横截面尺寸。外横截面尺寸的60％至85％是由高机械强度线芯提供的。外部横截面尺寸的10至30％由低电阻率层提供。

6. 发明申请

US20120074975A1 MICRO POSITIONING TEST SOCKET AND METHODS FOR ACTIVE PRECISION ALIGNMENT AND CO-PLANARITY FEEDBACK 有权
标题翻译：微型定位测试插座和主动精度对齐与平面反馈的方法
公开(公告)号：US20120074975A1
公开(公告)日：2012-03-29
申请号：US12888579
申请日：2010-09-23
申请人： Abram M. Detofsky , Todd P. Albertson , David Shia
发明人： Abram M. Detofsky , Todd P. Albertson , David Shia
IPC分类号： G01R31/28 , G01B11/14 , H01R13/64
CPC分类号： G01R1/0408 , G01B7/31 , G01R1/0483 , G01R1/06794 , G01R31/2891 , H05K1/0268 , H05K2203/162 , H05K2203/166
摘要： Methods and structures for testing a microelectronic packaging structure/device are described. Those methods may include placing a device in a floating carrier, wherein the floating carrier is coupled to a socket housing by pin dowels disposed in four corners of the socket housing, and wherein at least two actuating motors are disposed within the socket housing, and micro adjusting the device by utilizing a capacitive coupled or a fiber optic alignment system wherein a maximum measured capacitance or maximum measured intensity between alignment structures disposed in the socket housing and alignment package balls disposed within the device indicate optimal alignment of the device. Methods further include methods for active co-planarity detection through the use of a capacitive-coupled techniques.
摘要翻译：描述了用于测试微电子封装结构/器件的方法和结构。这些方法可以包括将设备放置在浮动载体中，其中浮动载体通过设置在插座壳体的四个角落中的销钉联接到插座壳体，并且其中至少两个致动马达设置在插座壳体内，并且微型通过利用电容耦合或光纤对准系统来调节装置，其中设置在插座壳体中的对准结构和设置在装置内的对准封装球之间的最大测量电容或最大测量强度表示装置的最佳对准。方法还包括通过使用电容耦合技术进行有源共平面检测的方法。

7. 发明授权

US09535095B2 Anti-rotation for wire probes in a probe head of a die tester 有权
标题翻译：在模具测试仪的探头中的线探头的防旋转
公开(公告)号：US09535095B2
公开(公告)日：2017-01-03
申请号：US14013422
申请日：2013-08-29
申请人： David Shia , Todd P. Albertson , Keith J. Martin
发明人： David Shia , Todd P. Albertson , Keith J. Martin
IPC分类号： G01R1/073 , G01R1/067 , G01R3/00
CPC分类号： G01R1/07371 , G01R1/06733 , G01R1/07357 , G01R3/00 , Y10T29/49124
摘要： Wire probes are described that resist rotation during assembly into a probe head of a die tester. One example includes probe wires with a protrusion at a pre-determined position along the length of the wire. A probe substrate with pads on one side each to attach to and electrically connect with a probe wire and a pads on the opposite side to connect to test equipment and a probe holder above the substrate with holes. Each hole holds a respective one of the probe wires against the probe substrate. Each hole also has a key to mate with a protrusion of a respective probe wire so that the protrusions engage the keys to prevent rotation of the respective wire.
摘要翻译：描述了在组装到模具测试器的探针头期间抵抗旋转的线探针。一个例子包括沿导线长度的预定位置具有突起的探针线。探针基板，其一侧具有焊盘，每个探针基板附接到探针线和相对侧上的电极，以连接到测试设备，并且在基板上方具有孔。每个孔将相应的探针线保持在探针基板上。每个孔还具有与相应探针线的突起配合的键，使得突起接合键以防止相应线的旋转。

8. 发明授权

US09134343B2 Sort probe gripper 有权
标题翻译：分选探针夹具
公开(公告)号：US09134343B2
公开(公告)日：2015-09-15
申请号：US13630141
申请日：2012-09-28
申请人： David Shia , Todd P. Albertson
发明人： David Shia , Todd P. Albertson
IPC分类号： G01R31/00 , G01R1/067 , G01R3/00 , G01R1/073
CPC分类号： G01R1/06705 , G01R1/07307 , G01R3/00
摘要： An apparatus includes a robot and a sort probe gripper. The sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers.
摘要翻译：一种装置包括机器人和分选探针夹持器。分类探针夹持器包括主体，插入到主体中的卡爪安装件，安装在卡爪安装件中的多个夹具和可沿主体滑动以与多个夹持器接合的致动器套筒。

9. 发明授权

US07345495B2 Temperature and voltage controlled integrated circuit processes 有权
标题翻译：温控电压集成电路
公开(公告)号：US07345495B2
公开(公告)日：2008-03-18
申请号：US10882905
申请日：2004-06-30
申请人： Daniel J. Dangelo , Todd P. Albertson , Hon Lee Kon , Jin Pan
发明人： Daniel J. Dangelo , Todd P. Albertson , Hon Lee Kon , Jin Pan
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2879 , G01R31/2863 , G01R31/2874 , G01R31/2886
摘要： The present application relates to apparatus and methods for burn-in and other diagnostics performed on integrated circuits. In one embodiment, the invention includes a plurality of sockets, each to hold an integrated circuit (IC), and coupling power to the respective IC from a remote power supply, a plurality of voltage detectors, each coupled to a socket to sense the voltage of the power coupled to the respective IC, and a plurality of remote voltage regulators, each coupled between the power supply and a respective socket, to receive the sensed voltage from the respective voltage detector and to adjust the voltage of the respective coupled power in accordance therewith.
摘要翻译：本申请涉及在集成电路上执行的用于老化和其他诊断的装置和方法。在一个实施例中，本发明包括多个插座，每个插座用于保持集成电路（IC），并且从远程电源（多个电压检测器）将功率耦合到相应的IC，每个电压检测器耦合到插座以感测电压耦合到相应IC的功率，以及多个远程电压调节器，每个远程电压调节器分别耦合在电源和相应的插座之间，以从相应的电压检测器接收感测的电压，并根据相应的电压调节相应的耦合功率的电压随之而来。

10. 发明授权

US06360544B1 Anticyclone powered active thermal control unit 失效
标题翻译：反气动动力主动热控单元
公开(公告)号：US06360544B1
公开(公告)日：2002-03-26
申请号：US09741454
申请日：2000-12-19
申请人： Todd P. Albertson
发明人： Todd P. Albertson
IPC分类号： F25B2102
CPC分类号： F25B21/04
摘要： A thermal control unit for regulating the temperature of a component or device under test is disclosed. The thermal control unit includes a three-dimensional control structure having a base member and an extension member extending from one surface of the base member to divide the base member into first and second portions. The base member has another surface to thermally couple to the device. The thermal control unit further includes at least one heat transfer assembly in thermal contact with the first portion of the base member and one face of the extension member and at least one other heat transfer assembly in thermal contact with the second portion of the base member and another face of the extension member.
摘要翻译：公开了一种用于调节被测部件或装置的温度的热控制单元。热控制单元包括三维控制结构，其具有基部构件和从基座构件的一个表面延伸的延伸构件，以将基座构件分成第一和第二部分。基座部件具有热连接到该装置的另一表面。热控制单元还包括至少一个热传导组件，其与基部构件的第一部分和延伸构件的一个表面热接触，并且至少一个其它传热组件与基部构件的第二部分热接触，扩展成员的另一面。

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