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    • 3. 发明授权
    • Hollow cathode enhanced magnetron sputter device
    • 空心阴极增强磁控溅射装置
    • US4588490A
    • 1986-05-13
    • US736918
    • 1985-05-22
    • Jerome J. CuomoHarold R. KaufmanStephen M. Rossnagel
    • Jerome J. CuomoHarold R. KaufmanStephen M. Rossnagel
    • C23F4/00C23C14/35H01J37/34
    • H01J37/3405
    • A plasma sputter etching/deposition system comprising an electron-emitting hollow cathode arc-source combined with a conventional plasma sputter etching/deposition system such as a magnetron. The electrons emitted are coupled into the intrinsic high energy, e.g., magnetic field and are accelerated by the plasma potential and cause a significant increase plasma density. The resultant combination allows much greater sputtering/deposition efficiency than was possible with previous devices. According to a further aspect of the invention, switched operation is possible, whereby etching may vary from isotropic to anisotropic. A side discharge hollow cathode structure is also described for enhancing certain sputtering/deposition processes, wherein electrons may be emitted from one or more openings at the side of a hollow cathode chamber to achieve more uniform electron emission in a large process chamber.
    • 等离子体溅射蚀刻/沉积系统,其包括与常规等离子体溅射蚀刻/沉积系统如磁控管组合的电子发射空心阴极电弧源。 所发射的电子被耦合到固有的高能量例如磁场中,并被等离子体电势加速并且引起显着增加的等离子体密度。 所得到的组合允许比以前的装置更大的溅射/沉积效率。 根据本发明的另一方面,切换操作是可能的,由此蚀刻可以从各向同性到各向异性。 还描述了用于增强某些溅射/沉积工艺的侧面放电中空阴极结构,其中电子可以从中空阴极室侧面的一个或多个开口发射,以在大的处理室中实现更均匀的电子发射。
    • 4. 发明授权
    • Low energy ion beam oxidation process
    • 低能离子束氧化过程
    • US4351712A
    • 1982-09-28
    • US214929
    • 1980-12-10
    • Jerome J. CuomoJames M. E. Harper
    • Jerome J. CuomoJames M. E. Harper
    • C23F4/00C23C14/48H01L21/302H01L21/3065H01L21/31H01L21/316H01L39/24H01L49/00C23C15/00H01L39/22
    • H01L21/31683H01L39/2493H01L45/00Y10S505/817Y10T29/49014
    • A surface reaction process for controlled oxide growth is disclosed using a directed, low energy ion beam for compound or oxide formation. The technique is evaluated by fabricating Ni-oxide-Ni and Cr-oxide-Ni tunneling junctions, using directed oxygen ion beams with energies ranging from about 30 to 180 eV. In one embodiment, high ion current densities are achieved at these low energies by replacing the conventional dual grid extraction system of the ion source with a single fine mesh grid. Junction resistance decreases with increasing ion energy, and oxidation time dependence shows a characteristic saturation, both consistent with a process of simultaneous oxidation and sputter etching, as in the conventional r.f. oxidation process. In contrast with r.f. oxidized junctions, however, ion beam oxidized junctions contain less contamination by backsputtering, and the quantitative nature of ion beam techniques allows greater control over the growth process.
    • 公开了一种用于受控氧化物生长的表面反应方法,该方法使用用于化合物或氧化物形成的定向低能量离子束。 通过使用约30至180eV的能量的定向氧离子束,通过制备Ni氧化物-Ni和Cr-氧化物-NN隧穿结来评估该技术。 在一个实施例中,通过用单个细网格网代替离子源的常规双栅格提取系统,在这些低能量下实现高离子电流密度。 结电阻随着离子能量的增加而降低,而氧化时间依赖性显示出特征饱和度,这与常规的r.f.中同时氧化和溅射蚀刻的过程一致。 氧化过程。 与r.f.相反。 氧化结,然而,离子束氧化连接通过反溅射含有较少的污染,并且离子束技术的定量性质允许更好地控制生长过程。
    • 6. 发明授权
    • Etching by sputtering from an intermetallic target to form negative
metallic ions which produce etching of a juxtaposed substrate
    • 通过溅射从金属间化合物靶上蚀刻形成负金属离子,产生并列衬底的蚀刻
    • US4132614A
    • 1979-01-02
    • US844541
    • 1977-10-26
    • Jerome J. CuomoRichard J. GambinoJames M. E. Harper
    • Jerome J. CuomoRichard J. GambinoJames M. E. Harper
    • C23F4/00H01J37/34H01L21/302H01L21/3065C23C15/00
    • H01J37/3426H01J37/34
    • Bombardment some intermetallic compounds above a sufficient target voltage V.sub.o can be used for etching substrates. Etching a substrate located in an evacuated chamber involves bombardment of an intermetallic compound or alloy comprising for example Au, Pt, etc. and a metallic element such as Eu, La, Cs, etc. with ions so that a large flux of negative Au, Pt, etc. ions is produced which etches a substrate located nearby. Such bombardment is achieved by placing an Au, Pt, etc. intermetallic composition target in a sputtering chamber using an argon sputtering gas, located opposite from a substrate. A gold alloy or compound target can be SmAu, EuAu, LaAu, CsAu, etc. The target of Au, Pt, etc. and a rare earth element, etc. is bombarded by sputtering gas atoms excited by RF or D.C. energy, creating negative metal ions by sputtering. Instead of depositing upon the substrate, the negative ions cause a cascade of energetic sputtering gas atoms and metal atoms to etch the substrate surface directly beneath the target as outlined by ground shields. Outside that region negative ion and rare earth metals deposit on the substrate. Bombardment with an ion gun, neutral atoms or energetic particle sources or an ionic molecular source may produce negative ions. A use is ion milling. A target material is useful as a negative ion source of metal B in an intermetallic compound of metals A and B if A has ionization potential I.sub.A and B has electron affinity EA.sub.B such that I.sub.A -EA.sub.B > about 3.4 electron volts or if there is a electronegativity difference .DELTA.X greater than about 2.55.
    • 超过足够目标电压Vo的一些金属间化合物可用于蚀刻基板。 蚀刻位于真空室中的衬底包括用离子轰击包含例如Au,Pt等的金属间化合物或合金以及诸如Eu,La,Cs等的金属元素,使得大量的Au, 产生Pt等离子,其蚀刻位于附近的衬底。 通过使用与衬底相对的氩气溅射气体将Au,Pt等金属间化合物靶放置在溅射室中来实现这种轰击。 金合金或复合靶可以是SmAu,EuAu,LaAu,CsAu等。通过由RF或DC能量激发的溅射气体原子轰击Au,Pt等稀土元素等的靶,产生负 金属离子溅射。 代替沉积在衬底上,负离子引起高能溅射气体原子和金属原子的级联来蚀刻目标正下方的衬底表面,如由接地屏蔽所概述的。 在该区域外,负离子和稀土金属沉积在基底上。 使用离子枪,中性原子或能量粒子源或离子分子源进行轰击可能产生负离子。 使用离子铣削。 如果A具有电离电位IA和B具有电子亲和力EAB使得IA-EAB>约3.4电子伏特或如果存在电负性,则目标材料可用作金属A和B的金属间化合物中金属B的负离子源 差异DELTA X大于2.55。
    • 10. 发明授权
    • System and method for deflecting and focusing a broad ion beam
    • 用于偏转和聚焦宽离子束的系统和方法
    • US4381453A
    • 1983-04-26
    • US221661
    • 1980-12-31
    • Jerome J. CuomoJames M. E. Harper
    • Jerome J. CuomoJames M. E. Harper
    • H01J37/08C23C14/32H01J37/147H01J37/30H01J37/305H01J37/317H01L21/302
    • H01J37/3053
    • A method and system for deflecting a broad ion plasma beam which includes an ion source for forming an ion plasma, an extraction means for extracting a broad ion plasma beam from the ion plasma, and deflection means including a non-grounded surface located in the path of the ion plasam beam and at an angle to the path for deflecting the ion plasma beam to a target material. A grounded, screen grid is located in front of the deflecting means in the path of the ion plasma. The screen grid has openings which permit passage of the ions in the ion plasma, but block passage of the electrons. The plasma beam is deflected by the deflection means and the grounded, screen grid onto the target material for sputter cleaning, deposition and ion milling applications.
    • 一种用于偏转宽离子等离子体束的方法和系统,其包括用于形成离子等离子体的离子源,用于从离子等离子体提取宽离子等离子体束的提取装置,以及包括位于路径中的非接地表面的偏转装置 的离子等离子束并且与用于将离子等离子体束偏转到目标材料的路径成一定角度。 接地的屏栅位于离子等离子体路径中的偏转装置的前面。 筛栅具有允许离子在离子等离子体中通过但阻挡电子通过的开口。 等离子体束被偏转装置和接地的筛网偏转到目标材料上用于溅射清洗,沉积和离子铣削应用。