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    • 7. 发明授权
    • Bimodal cured intermixed polymeric networks which are stable at high
temperature
    • 在高温下稳定的双峰固化混合聚合物网络
    • US5331018A
    • 1994-07-19
    • US935863
    • 1992-08-26
    • Vincent D. McGinnissJames L. WhiteHiroyuki Mikuni
    • Vincent D. McGinnissJames L. WhiteHiroyuki Mikuni
    • C08G85/00C08F2/50C08F283/00C08G77/442C08F18/14C08F18/18
    • C08G77/442C08F283/00
    • The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, T.sub.uv ; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, T.sub..DELTA.. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, T.sub.s, wherein T.sub.s is equal to or lower than T.sub.uv, and T.sub.uv is at least about 50.degree. C. lower than T.sub..DELTA..
    • 本发明涉及一种非发射双峰固化的聚合物网络,其具有高于基础聚合物的起始降解温度约100℃的起始降解温度。 新型固化的聚合物网络包括以下成分的固化反应产物:(a)一种或多种液体载体单体或预聚物的组合,其组合是通过暴露于紫外线(UV)辐射在有 UV光敏剂在温度下,Tuv; 和(b)基于组分(a)的一种或多种单体或预聚物的组合的约10至100重量%,所述组合通过在温度T DELTA下加热而形成固化的高温稳定聚合物。 成分(b)在成分(a)中可溶或可分散于温度Ts,其中Ts等于或低于Tuv,Tuv比T DELTA低至少约50℃。
    • 9. 发明授权
    • Electronic device backplane interconnect method and apparatus
    • 电子设备背板互连方法和装置
    • US06795885B1
    • 2004-09-21
    • US09887798
    • 2001-06-21
    • James J. deBlancDavid M. DickeyJames L. White
    • James J. deBlancDavid M. DickeyJames L. White
    • G06F1314
    • G06F11/2007H01R31/005H05K1/14H05K7/1441
    • Apparatus for connecting a plurality of electronic devices with corresponding backplanes to improve reliability of accessing the devices are described. In one embodiment, the apparatus includes first and second backplanes having connectors for at least one device. A device having a plurality of data paths has a first data path coupled to a data path connector of the first backplane. A second data path of the device is coupled to a data path connector of the second backplane. Alternatively, a Y-adapter is used to connect a single data path device to data path connectors of distinct backplanes. In various embodiments, the backplanes lie in a common plane. Alternatively, the backplanes lie in distinct parallel planes.
    • 描述了用于将多个电子设备与相应的背板连接以提高访问设备的可靠性的装置。 在一个实施例中,该设备包括具有用于至少一个设备的连接器的第一和第二背板。 具有多个数据路径的设备具有耦合到第一背板的数据路径连接器的第一数据路径。 设备的第二数据路径耦合到第二背板的数据路径连接器。 或者,Y适配器用于将单个数据路径设备连接到不同背板的数据路径连接器。 在各种实施例中,背板位于公共平面中。 或者,背板位于不同的平行平面中。
    • 10. 发明授权
    • Fault tolerant bus for highly available storage enclosure
    • 高可用存储机箱的容错总线
    • US06910089B2
    • 2005-06-21
    • US09872924
    • 2001-06-01
    • James J. deBlancCarl R. HaynieJames L. White
    • James J. deBlancCarl R. HaynieJames L. White
    • G06F3/00G06F13/40G06F13/14
    • G06F13/409
    • A backplane apparatus for an electronic device enclosure includes a common bus comprising a plurality of signal lines, each signal line having a current limiting element, RA. Isolation circuitry is provided for electrically coupling each of the plurality of signal lines of the common bus to a corresponding plurality of signal lines of the electronic device to enable signal communication between the common bus and the electronic device through the isolation circuitry. In one embodiment, the backplane apparatus further comprises connectors to enable removably attaching the electronic devices such as disk drives. In one embodiment, the isolation circuitry coupling each signal line of the common bus to the connector comprises an inline resistor, RD. The isolation circuitry associated with some of the signal lines may include pull up resistors. The values of RA and RD are selected to ensure that the common bus meets pre-determined current and voltage requirements so that the common bus can change states even if one or more of the devices fail by shorting to ground.
    • 一种用于电子设备外壳的背板设备包括一个包含多条信号线的公共总线,每条信号线都有一个限流元件RA。 提供隔离电路用于将公共总线的多个信号线的每一个电耦合到电子设备的对应的多个信号线,以使公共总线与电子设备之间通过隔离电路进行信号通信。 在一个实施例中,背板装置还包括能够可移除地附接诸如磁盘驱动器的电子装置的连接器。 在一个实施例中,将公共总线的每个信号线耦合到连接器的隔离电路包括内联电阻器RD。 与一些信号线相关联的隔离电路可以包括上拉电阻。 选择RA和RD的值以确保公共总线满足预定的电流和电压要求,以使公共总线可以改变状态,即使一个或多个设备通过短路到地故障。