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    • 1. 发明授权
    • Replaceable image sensor array
    • 可更换图像传感器阵列
    • US4860075A
    • 1989-08-22
    • US295175
    • 1989-01-01
    • Mehdi N. AraghiJagdish C. Tandon
    • Mehdi N. AraghiJagdish C. Tandon
    • H01L21/306H01L27/144H01L27/146
    • H01L21/30608H01L27/1446H01L27/146
    • An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
    • 一种图像传感器阵列和制造方法,其有助于将一系列阵列中的有缺陷的阵列对接在一起以形成更长的扫描阵列,其中具有一排光泽的(110)硅晶片具有通过取向相关蚀刻在其上蚀刻的分离线 沿着(111)平面,阵列的相对端的分隔线每一个由第一和第二部分边界线组成,第一和第二部分边界线彼此纵向彼此相互连接,由第三边界线连接,使得阵列的端部具有通常 L形偏移允许在更换有缺陷的阵列时双向分离和对准插入运动。 在第二实施例中,阵列形成在具有交替“钉头”和“台面”头形状的(100)硅上,以便于去除和更换缺陷阵列。
    • 2. 发明授权
    • Image sensor array for assembly with like arrays to form a longer array
    • 图像传感器阵列,用于组装类似阵列以形成更长的阵列
    • US4695716A
    • 1987-09-22
    • US923516
    • 1986-10-27
    • Jagdish C. TandonMehdi N. Araghi
    • Jagdish C. TandonMehdi N. Araghi
    • H01L21/306H01L21/78H01L27/144H01L25/04
    • H01L27/1446H01L21/30608H01L21/78
    • Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provides a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any cap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.
    • 从具有一列光电子的(110)硅衬底制造传感器阵列的装置和方法,以提供具有均匀光滑和成角度的端部的传感器阵列芯片,其被设计成允许芯片与其它类似芯片端对端地对接以形成 全长扫描阵列,其中衬底被蚀刻以在芯片的期望边界处沿(111)面分离,蚀刻边界限定芯片端部在选定的一对光电子之间运行,以提供整个光电子直到直到末端 芯片,以避免在与其他芯片的交点处的光电子之间的任何盖子或中断。 在第二实施例中,芯片端部形成为互补的不规则形状,以增强芯片彼此的定位和对接,并且在第三实施例中,在行中的每个光电子之间蚀刻凹槽以确保光泽均匀性并防止交叉 光照之间的谈话
    • 3. 发明授权
    • Image sensor array for assembly with like arrays to form a longer array
    • 图像传感器阵列,用于组装类似阵列以形成更长的阵列
    • US4668333A
    • 1987-05-26
    • US808797
    • 1985-12-13
    • Jagdish C. TandonMehdi N. Araghi
    • Jagdish C. TandonMehdi N. Araghi
    • H01L27/146H01L21/306H01L21/78H01L27/14H01L27/144H04N1/028B44C1/22
    • H01L21/78H01L21/30608H01L27/1446
    • Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provide a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any gap or interruption between the photosites at the junctions with other chips.In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.
    • 从具有一列光电子的(110)硅衬底制造传感器阵列的装置和方法,以提供具有均匀平滑和成角度的端部的传感器阵列芯片,其被设计成允许芯片与其它类似的芯片端对端地对接以形成 全长扫描阵列,其中衬底被蚀刻以在芯片的期望边界处沿(111)面分离,蚀刻边界限定芯片端部在选定的一对光电子之间运行,以提供整个光电子直到直到末端 芯片,以避免在与其他芯片的交点处的光斑之间的任何间隙或中断。 在第二实施例中,芯片端部形成为互补的不规则形状,以增强芯片彼此的定位和对接,并且在第三实施例中,在行中的每个光电子之间蚀刻凹槽以确保光泽均匀性并防止交叉 光照之间的谈话
    • 4. 发明授权
    • Replaceable image sensor array
    • 可更换图像传感器阵列
    • US4698131A
    • 1987-10-06
    • US808799
    • 1985-12-13
    • Mehdi N. AraghiJagdish C. Tandon
    • Mehdi N. AraghiJagdish C. Tandon
    • H01L21/306H01L27/144H01L27/146H04N1/028B44C1/22
    • H01L21/30608H01L27/1446H01L27/146
    • An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
    • 一种图像传感器阵列和制造方法,其有助于将一系列阵列中的有缺陷的阵列对接在一起以形成更长的扫描阵列,其中具有一排光泽的(110)硅晶片具有通过取向相关蚀刻在其上蚀刻的分离线 沿着(111)平面,阵列的相对端的分隔线每一个由第一和第二部分边界线组成,第一和第二部分边界线彼此纵向彼此相互连接,由第三边界线连接,使得阵列的端部具有通常 L形偏移允许在更换有缺陷的阵列时双向分离和对准插入运动。 在第二实施例中,阵列形成在具有交替“钉头”和“台面”头形状的(100)硅上,以便于去除和更换缺陷阵列。
    • 5. 发明授权
    • Method of replacing an image sensor array
    • 更换图像传感器阵列的方法
    • US4830985A
    • 1989-05-16
    • US39057
    • 1987-04-16
    • Mehdi N. AraghiJagdish C. Tandon
    • Mehdi N. AraghiJagdish C. Tandon
    • H01L21/306H01L27/144H01L27/146
    • H01L21/30608H01L27/1446H01L27/146Y10T29/49131Y10T29/4973
    • An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array.In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
    • 一种图像传感器阵列和制造方法,其有助于将一系列阵列中的有缺陷的阵列对接在一起以形成更长的扫描阵列,其中具有一排光泽的(110)硅晶片具有通过取向相关蚀刻在其上蚀刻的分离线 沿着(111)平面,阵列的相对端的分隔线每一个由第一和第二部分边界线组成,第一和第二部分边界线彼此纵向彼此相互连接,由第三边界线连接,使得阵列的端部具有通常 L形偏移允许在更换有缺陷的阵列时双向分离和对准插入运动。 在第二实施例中,阵列形成在具有交替“钉头”和“台面”头形状的(100)硅上,以便于去除和更换缺陷阵列。
    • 9. 发明授权
    • Laser range sensor system optics adapter and method
    • 激光测距传感器系统光学适配器和方法
    • US07859649B2
    • 2010-12-28
    • US11741129
    • 2007-04-27
    • Eric G. GesnerDavid B. KayMehdi N. Araghi
    • Eric G. GesnerDavid B. KayMehdi N. Araghi
    • G01C3/08
    • G01C11/00G01S17/08
    • An adapter and method for through the lens (TTL) laser range sensor probes enables use of a TTL probe of a given exit pupil size to be used with a shared objective lens requiring a entrance pupil size, as entered from the laser range sensor, that is different from the TTL probe exit pupil size. Embodiments of the adapter include optics, such as a first lens and a resolving second lens that expand or contract the TTL laser radiation depending on whether the first lens is a diverging, a negative focal length lens, or a converging, positive focal length lens, and the second lens is converging or diverging, respectively, in a Galilean arrangement. Embodiments also provide a Keplerian arrangement, can function with non-collimated radiation, and can include mirrors to yield a more compact adapter. Additional embodiments include at least one adjustable lens element between the first and second lenses, the at least one adjustable lens element being connected to an actuator for movement along the optical path. The adapter can be arranged in a folded configuration in which mirrors are used to form a more compact adapter.
    • 用于通过透镜(TTL)激光范围传感器探针的适配器和方法使得能够使用给定出射光瞳尺寸的TTL探头与需要从激光范围传感器输入的入射光瞳尺寸的共享物镜一起使用, 与TTL探头出口光瞳尺寸不同。 适配器的实施例包括根据第一透镜是发散的,负焦距透镜或会聚正焦距透镜来扩展或收缩TTL激光辐射的诸如第一透镜和分辨率第二透镜的光学器件, 并且第二透镜分别在伽利略布置中会聚或发散。 实施例还提供开普勒装置,可以与非准直辐射一起工作,并且可以包括镜子以产生更紧凑的适配器。 另外的实施例包括在第一和第二透镜之间的至少一个可调透镜元件,所述至少一个可调透镜元件连接到致动器以沿着光路移动。 适配器可以布置成折叠配置,其中使用反射镜形成更紧凑的适配器。
    • 10. 发明授权
    • Method of fabricating image sensor arrays
    • 制作图像传感器阵列的方法
    • US4604161A
    • 1986-08-05
    • US729705
    • 1985-05-02
    • Mehdi N. Araghi
    • Mehdi N. Araghi
    • H01L27/148H01L21/301H01L21/304H01L21/306B44C1/22C03C15/00C03C25/06
    • H01L21/3043Y10T225/12
    • A sensor array for butting against other like arrays to form a full width array. The active surface of the array chip is first etched to form a V-shaped groove defining an array end; then a parallel groove is cut in the opposite inactive surface with a centerline parallel to but offset from the centerline of the V-shaped groove by an amount sufficient to allow extension of the wafer (111) crystalline plane from the V-shaped groove to the cut groove; then the water is supported in cantilever fashion along an edge substantially coplanar with the V-shaped groove and a downward force is applied to the wafer free end to cause the wafer to fracture along the (111) crystalline plane thereby cleaving the chip from the wafer and providing a uniformly smooth and straight array end for butting against the end of a like array.
    • 用于对接其他类似阵列以形成全宽阵列的传感器阵列。 首先蚀刻阵列芯片的有源表面以形成限定阵列端的V形槽; 那么在相反的无效表面上切割平行的凹槽,其中心线平行于V形槽的中心线但偏离足以允许晶片(111)晶面从V形槽延伸到 切槽; 然后沿着与V形槽基本上共面的边缘以悬臂方式支撑水,并且向晶片自由端施加向下的力,以使晶片沿着(111)晶面断开,从而将晶片从晶片切断 并且提供均匀平滑且直的阵列端,用于对接类似阵列的端部。