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1. 发明授权

US09066184B2 Acoustic sensor and fabrication method thereof 有权
标题翻译：声传感器及其制造方法
公开(公告)号：US09066184B2
公开(公告)日：2015-06-23
申请号：US13557108
申请日：2012-07-24
申请人： Jae Woo Lee , Chang Han Je , Woo Seok Yang , Jong Dae Kim
发明人： Jae Woo Lee , Chang Han Je , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R31/00 , H04R19/00 , H04R19/04
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R19/04 , H04R31/00 , Y10T29/49005 , H01L2924/00014
摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.
摘要翻译：根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

2. 发明授权

US08705777B2 MEMS microphone and method of manufacturing the same 失效
标题翻译： MEMS麦克风及其制造方法相同
公开(公告)号：US08705777B2
公开(公告)日：2014-04-22
申请号：US13601896
申请日：2012-08-31
申请人： Chang Han Je , Jae Woo Lee , Woo Seok Yang , Jong Dae Kim
发明人： Chang Han Je , Jae Woo Lee , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R1/00 , H04R31/00
CPC分类号： H04R1/00 , B81B3/007 , B81B2201/0257 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
摘要： Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.
摘要翻译：公开了一种MEMS麦克风及其制造方法。 MEMS麦克风包括：基板; 形成在所述基板的前表面内的后声室; 形成在所述基板上并具有排气孔的振动板; 形成在振动板上的固定电极; 以及由后声室的底部支撑并通过排气孔连接到固定电极的固定电极支撑件。

3. 发明申请

US20130100779A1 ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF 有权
标题翻译：声学传感器及其制造方法
公开(公告)号：US20130100779A1
公开(公告)日：2013-04-25
申请号：US13557108
申请日：2012-07-24
申请人： Jae Woo LEE , Chang Han Je , Woo Seok Yang , Jong Dae Kim
发明人： Jae Woo LEE , Chang Han Je , Woo Seok Yang , Jong Dae Kim
IPC分类号： H04R17/00 , H04R31/00
CPC分类号： H04R19/005 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R19/04 , H04R31/00 , Y10T29/49005 , H01L2924/00014
摘要： A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.
摘要翻译：根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

4. 发明申请

US20120098076A1 ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：声学传感器及其制造方法
公开(公告)号：US20120098076A1
公开(公告)日：2012-04-26
申请号：US13012489
申请日：2011-01-24
申请人： Jaewoo LEE , Chang Han Je , Woo Seok Yang , Jongdae Kim
发明人： Jaewoo LEE , Chang Han Je , Woo Seok Yang , Jongdae Kim
IPC分类号： H01L29/84 , H01L21/02
CPC分类号： H04R31/00 , H04R19/005 , H04R19/02
摘要： Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.
摘要翻译：提供了一种声学传感器。声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

5. 发明申请

US20130094675A1 MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译： MEMS麦克风及其制造方法
公开(公告)号：US20130094675A1
公开(公告)日：2013-04-18
申请号：US13601896
申请日：2012-08-31
申请人： Chang Han Je , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
发明人： Chang Han Je , Jaewoo Lee , Woo Seok Yang , Jongdae Kim
IPC分类号： H04R1/00 , H04R31/00
CPC分类号： H04R1/00 , B81B3/007 , B81B2201/0257 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003
摘要： Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole.
摘要翻译：公开了一种MEMS麦克风及其制造方法。 MEMS麦克风包括：基板; 形成在所述基板的前表面内的后声室; 形成在所述基板上并具有排气孔的振动板; 形成在振动板上的固定电极; 以及由后声室的底部支撑并通过排气孔连接到固定电极的固定电极支撑件。

6. 发明授权

US08415717B2 Acoustic sensor 有权
标题翻译：声传感器
公开(公告)号：US08415717B2
公开(公告)日：2013-04-09
申请号：US13012489
申请日：2011-01-24
申请人： Jaewoo Lee , Chang Han Je , Woo Seok Yang , Jongdae Kim
发明人： Jaewoo Lee , Chang Han Je , Woo Seok Yang , Jongdae Kim
IPC分类号： H01L29/84
CPC分类号： H04R31/00 , H04R19/005 , H04R19/02
摘要： Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.
摘要翻译：提供了一种声学传感器。声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

7. 发明授权

US07585113B2 Micro-electro mechanical systems switch and method of fabricating the same 有权
标题翻译：微机电系统开关及其制造方法
公开(公告)号：US07585113B2
公开(公告)日：2009-09-08
申请号：US11440863
申请日：2006-05-24
申请人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
发明人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
IPC分类号： G02B6/00
CPC分类号： H01H59/0009 , B81B3/0013 , B81B3/0072 , B81B2201/016
摘要： A MEMS switch and a method of manufacturing the same are disclosed. The MEMS switch includes: a substrate including a trench, a ground line and a signal line having an opened portion; a moving plate separated from the substrate at a predetermined space and including a contact member for connecting an electrode plate and the opened portion and having a deep corrugate to insert the trench; and a supporting member for supporting the moving plate. Such a MEMS switch prevents the thermal expansion and the stiction problem.
摘要翻译：公开了一种MEMS开关及其制造方法。 MEMS开关包括：包括沟槽，接地线和具有开口部分的信号线的衬底; 移动板在预定的空间处与基板分离，并且包括用于连接电极板和开口部分并具有深波纹以便插入沟槽的接触部件; 以及用于支撑移动板的支撑构件。这样的MEMS开关可防止热膨胀和静电问题。

8. 发明授权

US07546677B2 Method for fabricating a micro-electromechanical system switch 有权
标题翻译：微机电系统开关的制造方法
公开(公告)号：US07546677B2
公开(公告)日：2009-06-16
申请号：US11898002
申请日：2007-09-07
申请人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
发明人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
IPC分类号： H01H11/00 , H01H65/00
CPC分类号： H01H59/0009 , H01G5/16 , H01G5/18 , H01H2059/0072 , H01P1/127 , Y10T29/417 , Y10T29/49105 , Y10T29/49117 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208
摘要： A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.
摘要翻译：一种方法包括在基板上形成信号线以具有预定的开口部分; 至少一个支撑框架，每个形成在信号线两侧的基板上; 形成在支撑框架和信号线之间的基板上的接地线; 移动板在其两侧固定到支撑框架，移动板可向上和向下移动; 位于移动板上的切换单元，切换单元包括用于连接打开的信号线的接触装置; 以及用于支撑所述移动板和所述切换单元的支撑层，其中所述支撑层包括用于保持与所述基板的距离的支撑突出部分。

9. 发明授权

US07283025B2 Micro-electromechanical systems switch and method of fabricating the same 失效
标题翻译：微机电系统开关及其制造方法
公开(公告)号：US07283025B2
公开(公告)日：2007-10-16
申请号：US11086320
申请日：2005-03-23
申请人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
发明人： Jae Woo Lee , Chang Han Je , Sung Weon Kang
IPC分类号： H01H51/22
CPC分类号： H01H59/0009 , H01G5/16 , H01G5/18 , H01H2059/0072 , H01P1/127 , Y10T29/417 , Y10T29/49105 , Y10T29/49117 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208
摘要： Provided is a micro-electromechanical systems switch for controlling signal delivery in a high frequency band wireless communication and a radio frequency (RF) system and, comprising: a substrate; a signal line formed on the substrate and having a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.
摘要翻译：提供了一种用于控制高频无线通信和射频（RF）系统中的信号传送的微机电系统开关，并且包括：基板; 形成在所述基板上并具有预定开口部分的信号线; 至少一个支撑框架，每个形成在信号线两侧的基板上; 形成在支撑框架和信号线之间的基板上的接地线; 移动板在其两侧固定到支撑框架，移动板可上下移动; 位于移动板上的切换单元，切换单元包括用于连接打开的信号线的接触装置; 以及用于支撑所述移动板和所述切换单元的支撑层，其中所述支撑层包括用于保持与所述基板的距离的支撑突出部分。

10. 发明授权

US08603848B2 Three-dimensional MEMS structure and method of manufacturing the same 有权
标题翻译：三维MEMS结构及其制造方法相同
公开(公告)号：US08603848B2
公开(公告)日：2013-12-10
申请号：US12853522
申请日：2010-08-10
申请人： Chang Han Je
发明人： Chang Han Je
IPC分类号： H01L33/12
CPC分类号： B81C1/0015
摘要： Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.
摘要翻译：提供一种三维（3D）MEMS结构及其制造方法。制造具有浮动结构的3D MEMS结构的方法包括在衬底上沉积第一蚀刻掩模，蚀刻第一蚀刻掩模的至少两个区域以暴露衬底，并且在蚀刻区域中形成至少一个步骤，部分蚀刻使用第一蚀刻掩模的衬底的暴露区域，并且形成至少两个沟槽，在沟槽的侧壁上沉积第二蚀刻掩模，并且执行蚀刻工艺以将至少两个沟槽的下部区域彼此连接，并形成至少一个浮动结构。

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