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1. 发明授权

US4924291A Flagless semiconductor package 失效
标题翻译：无旗半导体封装
公开(公告)号：US4924291A
公开(公告)日：1990-05-08
申请号：US261439
申请日：1988-10-24
申请人： Israel A. Lesk , George W. Hawkins , Ronald E. Thomas , William L. Hunter , James J. Casto , Michael B. McShane
发明人： Israel A. Lesk , George W. Hawkins , Ronald E. Thomas , William L. Hunter , James J. Casto , Michael B. McShane
IPC分类号： H01L23/34 , H01L23/16 , H01L23/28 , H01L23/31 , H01L23/433 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49568 , H01L23/16 , H01L23/3107 , H01L23/4334 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L2224/32245 , H01L2924/10253 , H01L2924/12044 , H01L2924/1815
摘要： A molded semiconductor package having a flagless leadframe wherein a semiconductor die is disposed in or above a die opening of a leadframe. This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings to protect high stress areas of the semiconductor die from damage and heat spreaders to more effectively spread heat dissipated by the semiconductor die.

2. 发明授权

US4928162A Die corner design having topological configurations 失效
标题翻译：具有拓扑结构的模角设计
公开(公告)号：US4928162A
公开(公告)日：1990-05-22
申请号：US158486
申请日：1988-02-22
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins , James M. Rugg
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins , James M. Rugg
IPC分类号： H01L23/50 , H01L23/485 , H01L23/495
CPC分类号： H01L24/06 , H01L23/49503 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01015 , H01L2924/01082 , H01L2924/10253
摘要： An improved semiconductor die for plastic encapsulated semiconductor devices which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Topological configurations are processed in the die corners of the semiconductor die which are void of circuitry. The topological configurations act as barriers and slow the delamination progression. This leaves the operational circuitry unaffected for an increased time thereby increasing device lifetime.
摘要翻译：用于塑料封装的半导体器件的改进的半导体管芯，其阻止由半导体管芯和塑料封装的不同膨胀系数引起的固有分层。拓扑结构在半导体管芯的模具角处被处理，这些电路没有电路。拓扑结构作为障碍，减缓分层进程。这使得操作电路不受影响以增加时间，从而增加器件寿命。

3. 发明授权

US5119171A Semiconductor die having rounded or tapered edges and corners 失效
标题翻译：半导体管芯具有圆形或锥形边缘和拐角
公开(公告)号：US5119171A
公开(公告)日：1992-06-02
申请号：US674291
申请日：1991-03-22
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
IPC分类号： H01L21/02 , H01L29/06
CPC分类号： H01L29/0657
摘要： An improved semiconductor die for plastic encapsulated semiconductor device packages which impedes the inherent delamination caused by the differing expansion coefficients of the semiconductor die and plastic encapsulation. Rounded or tapered die corners and die edges decrease the stress from the plastic encapsulation that acts upon the semiconductor die. This reduced stress slows the delamination progression and leaves the operational circuitry unaffected for an increased period of time thereby increasing device lifetime.
摘要翻译：用于塑料封装的半导体器件封装的改进的半导体管芯，其阻止由半导体管芯和塑料封装的不同膨胀系数引起的固有分层。圆角或锥形模角和模头边缘减小了作用在半导体管芯上的塑料封装的应力。这种减小的应力使得分层进程减慢，并使操作电路不受影响的时间增加，从而增加器件寿命。

4. 发明授权

US4832996A Semiconductor die for plastic encapsulation having an adhesion promoter 失效
标题翻译：具有粘合促进剂的用于塑料封装的半导体管芯
公开(公告)号：US4832996A
公开(公告)日：1989-05-23
申请号：US159975
申请日：1988-02-24
申请人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
发明人： Israel A. Lesk , Ronald E. Thomas , George W. Hawkins
IPC分类号： H01L23/29 , H01L23/28 , H01L23/31
CPC分类号： H01L23/3142 , H01L2924/0002 , Y10S428/901 , Y10T428/23 , Y10T428/239 , Y10T428/24777 , Y10T428/24851 , Y10T428/24917 , Y10T428/24926 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31623 , Y10T428/31681 , Y10T428/31721
摘要： A semiconductor die for plastic encapsulation having an adhesion promoter selectively disposed on an outer surface enabling better adhesion between the semiconductor die and a plastic encapsulation. The improved adhesion allows for less relative motion between the semiconductor die and the plastic encapsulation. The reduction of relative motion significantly decreases the delamination progression throughout the semiconductor device and allows for an increased semiconductor device lifetime.
摘要翻译：一种用于塑料封装的半导体管芯，其具有选择性地设置在外表面上的粘合促进剂，从而能够在半导体管芯和塑料封装之间实现更好改善的粘附性允许半导体管芯和塑料封装之间的较小的相对运动。相对运动的减小显着降低了整个半导体器件的分层进程，并且允许增加的半导体器件寿命。

5. 发明授权

US06300679B1 Flexible substrate for packaging a semiconductor component 失效
标题翻译：用于封装半导体部件的柔性基板
公开(公告)号：US06300679B1
公开(公告)日：2001-10-09
申请号：US09087674
申请日：1998-06-01
申请人： Prosanto K. Mukerji , Ronald E. Thomas , George W. Hawkins , Rajesh Srinivasan , Colin B. Bosch , James H. Knapp , Laura J. Norton , Michael J. Seddon
发明人： Prosanto K. Mukerji , Ronald E. Thomas , George W. Hawkins , Rajesh Srinivasan , Colin B. Bosch , James H. Knapp , Laura J. Norton , Michael J. Seddon
IPC分类号： H01L2350
CPC分类号： H01L23/4985 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/16 , H01L2924/01079 , H01L2924/15311 , H01L2924/3011 , H05K1/189
摘要： A semiconductor component includes a semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501) having first and second surfaces opposite each other, a semiconductor device (301) in the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501), and a flexible substrate (120, 401, 510, 610, 710, 1000, 1050, 1300, 1401, 1510, 1520) packaging the semiconductor chip (341, 502, 601, 701, 1101, 1410, 1501).
摘要翻译：半导体元件包括具有彼此相对的第一和第二表面的半导体芯片（341,502,601,701,1101,1410,1501），半导体芯片（341,502,601,701， 1101,1410,1501）以及将半导体芯片（341,502,601,701,1101,1410）封装的柔性基板（120,401,510,610,710,110,1050,1300,1401,1510,1520），1501）。

6. 发明授权

US07121900B2 Outgassing shield for lamp socket 有权
标题翻译：灯座用除气罩
公开(公告)号：US07121900B2
公开(公告)日：2006-10-17
申请号：US10920517
申请日：2004-08-18
申请人： Ronald E. Thomas , Timothy J. Miller
发明人： Ronald E. Thomas , Timothy J. Miller
IPC分类号： H01R24/00
CPC分类号： F21S45/40 , F21S41/19 , F21S43/19 , F21S43/195 , F21S45/10 , H01R33/09
摘要： An outgassing shield (40) for a lamp socket (22) comprises a cup-shaped unit that fits over the end of the socket that penetrates a lamp reflector (12), reducing the temperature upon the socket body and substantially eliminating outgassing. The elimination of the outgassing prevents deleterious buildup of outgassed materials on the reflector surface and the interior of the lens, thereby enhancing light output.
摘要翻译：用于灯座（22）的除气罩（40）包括杯形单元，其装配在穿过灯反射器（12）的插座的端部上方，从而降低插座主体上的温度，并且基本上消除了除气。消除排气可以防止反射器表面和透镜内部的脱气材料的有害累积，从而增强光输出。

7. 发明授权

US5456248A Surgical smoke evacuator 失效
标题翻译：手术除烟器
公开(公告)号：US5456248A
公开(公告)日：1995-10-10
申请号：US960934
申请日：1992-10-14
申请人： Steven E. Holian , Donald R. Reiterman , Richard J. Greff , Ronald E. Thomas
发明人： Steven E. Holian , Donald R. Reiterman , Richard J. Greff , Ronald E. Thomas
IPC分类号： A61B18/00 , B01D46/24 , B01D46/42 , A62B7/10 , A62B19/00 , A62B23/02
CPC分类号： B01D46/2411 , A61B18/00 , B01D46/42 , B01D46/4227 , A61B2218/008 , B01D2265/022 , B01D2279/55
摘要： A surgical smoke evacuator includes a housing and means defining an air flow channel through the housing. At least one filter having a longitudinal axis is disposed in the air flow channel with portions of the housing defining an inlet for receiving the filter and a filter cavity for receiving the filter in the air flow channel. Tabs on the filter and associated guide slots on the housing, guide the filter along a circuitous path between the inlet and filter cavity during loading and unloading of the filter. This path includes axial portions which facilitate axial filter movement and angular portions which facilitate angular filter movement relative to the housing.
摘要翻译：手术排烟器包括壳体和限定通过壳体的空气流动通道的装置。具有纵向轴线的至少一个过滤器设置在空气流动通道中，其中壳体的部分限定用于接收过滤器的入口和用于在空气流动通道中接收过滤器的过滤腔。过滤器上的接片和壳体上相关的引导槽在过滤器的装载和卸载过程中沿着入口和过滤器腔之间的迂回路径引导过滤器。该路径包括促进轴向过滤器运动的轴向部分和有助于角过滤器相对于壳体运动的角部分。

8. 发明授权

US5971814A Lamp socket 有权
标题翻译：灯座
公开(公告)号：US5971814A
公开(公告)日：1999-10-26
申请号：US149415
申请日：1998-09-08
申请人： Steven M. Boyd , Michael J. Bonavita , Ronald E. Thomas , Richard P. Walker
发明人： Steven M. Boyd , Michael J. Bonavita , Ronald E. Thomas , Richard P. Walker
IPC分类号： F21S8/10 , H01R33/09 , H01R17/00
CPC分类号： H01R33/09
摘要： A lamp socket is provided that includes slidably engaging body and housing components. Resilient retention members are attached within the body component to grasp the base of a wedge base lamp to attach the lamp to the body component. Contacts extend into the body component to engage lead wires of the lamp. Such contacts extend out of the body component and through respective apertures in the housing component for electrical and mechanical attachment to a mating connector. The contacts are held in place relative to the body component by being inserted into body openings within the body component structured and arranged to hold the contacts in place.
摘要翻译：提供一种灯插座，其包括滑动接合体和壳体部件。弹性保持构件附接在身体部件内以抓住楔形基座灯的底部，以将灯附接到身体部件。触头延伸到主体部件中以接合灯的引线。这种接触件从身体部件延伸出并且穿过壳体部件中的相应的孔，用于电气和机械附接到配合连接器。触点通过插入主体部件内的身体开口中而相对于身体部件保持在适当位置，该主体部件构造和布置成将触点保持在适当位置。

9. 发明授权

US5905329A Lamp base housing, with geminal halves configured to engage a press seal 失效
标题翻译：灯座外壳，其中孪生半部配置成接合压力密封
公开(公告)号：US5905329A
公开(公告)日：1999-05-18
申请号：US844479
申请日：1997-04-18
申请人： Ronald E. Thomas , Michael J. Bonavita , Steven M. Boyd
发明人： Ronald E. Thomas , Michael J. Bonavita , Steven M. Boyd
IPC分类号： H01J5/56 , H01J5/60
CPC分类号： H01J5/56 , H01J5/60
摘要： 050128487A lamp assembly is provided which includes a lamp, a lamp base attached to the lamp, and a lamp heater. One or more abutment regions of the lamp and the lamp base mate with one another to provide axial and rotational orientation of the lamp relative to the lamp base. The lamp heater conforms to the surface of the lamp and may be bonded thereto by an adhesive. The lamp heater may include a heater element and thermistor adjacent to a surface of the lamp. The lamp, lamp heater and thermistor are connected to a connector. A thermal breaker is connected to the heater. The thermal breaker provides a safety device to control maximum lamp temperature. The thermistor controls the operating temperature of the lamp. The lamp assembly may include a display device wherein the lamp is secured to the display device.
摘要翻译：提供一种灯组件，其包括灯，附接到灯的灯座和灯加热器。灯的一个或多个邻接区域和灯底座彼此配合以提供灯相对于灯座的轴向和旋转定向。灯加热器符合灯的表面，并且可以通过粘合剂与其结合。灯加热器可以包括与灯的表面相邻的加热器元件和热敏电阻。灯，灯加热器和热敏电阻连接到连接器。热断路器连接到加热器。热断路器提供一个安全装置来控制最大灯温。热敏电阻控制灯的工作温度。灯组件可以包括显示装置，其中灯被固定到显示装置。

10. 发明授权

US5411407A Lamp socket 失效
标题翻译：灯座
公开(公告)号：US5411407A
公开(公告)日：1995-05-02
申请号：US300625
申请日：1994-09-02
申请人： Ronald E. Thomas
发明人： Ronald E. Thomas
IPC分类号： F21V19/00 , H01R33/08 , H01R13/52
CPC分类号： F21S48/1109 , H01R33/0809
摘要： A lamp socket comprising: a body disposed about a longitudinal axis and having a cavity therein for receiving a plurality of electrical contacts; a bottom to said cavity; a plurality of apertures in said bottom; a plurality of electrical contacts in said cavity, each of said contacts having a lamp receiving portion within said cavity and an elongated terminal portion extending through said apertures and being bent at substantially 90 degrees to said longitudinal axis, said elongated terminal portions extending beyond the periphery of said body; latching tabs formed on said body adjacent said bottom; and a housing having a body receiving compartment and an elongated terminal portion receiving shroud joined to said housing, said body receiving compartment including latching slots for cooperative engagement with said latching tabs, said body being mounted in said body receiving compartment with said latching tabs being engaged with said latching slots.
摘要翻译：一种灯座，包括：围绕纵向轴线设置的主体并且在其中具有用于容纳多个电触点的空腔; 底部到所述腔; 在所述底部的多个孔; 所述空腔中的多个电触头中的每一个，所述触头中的所述空腔内具有灯接收部分，延伸的端子部分延伸穿过所述孔并且与所述纵向轴线基本成90度弯曲，所述细长端子部分延伸超过外围的身体形成在所述主体上邻近所述底部的闩锁片; 以及壳体，其具有主体容纳隔间和连接到所述壳体的细长端子部分接收罩，所述主体接收隔间包括用于与所述闩锁突起协作接合的闩锁槽，所述主体安装在所述主体容纳隔室中，具有所述闩锁槽。

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