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1. 发明授权

US09147633B2 Heat removal in an integrated circuit assembly using a jumping-drops vapor chamber 有权
标题翻译：使用跳跃式蒸气室在集成电路组件中进行散热
公开(公告)号：US09147633B2
公开(公告)日：2015-09-29
申请号：US13784463
申请日：2013-03-04
申请人： INTEL CORPORATION
发明人： Feras Eid , Zhihua Li , Chau V. Ho
IPC分类号： H01L23/34 , H05K7/20 , H01L23/367 , H01L23/42 , H01L23/427
CPC分类号： H01L23/3675 , H01L23/42 , H01L23/427 , H01L2224/16 , H01L2224/73204 , H01L2224/73253 , H01L2924/16152 , H05K7/20309 , H05K7/20318 , Y10T29/49002
摘要： Embodiments of the present disclosure are directed towards techniques and configurations for thermal management of an integrated circuit assembly using a jumping-drops vapor chamber. In one embodiment, an apparatus includes a die having a first side including a plurality of integrated circuit devices that are configured to generate heat when in operation, and a second side disposed opposite to the first side, and a vapor chamber including a liquid, an evaporator including a surface that is thermally coupled with the second side of the die, the evaporator being configured to evaporate the liquid to vapor, and a condenser including a superhydrophobic surface and configured to condense the vapor, wherein energy released from coalescence of condensed vapor on the superhydrophobic surface causes the condensed vapor to jump from the superhydrophobic surface of the condenser to the surface of the evaporator. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例涉及使用跳跃式液滴蒸气室的集成电路组件的热管理的技术和配置。在一个实施例中，一种装置包括：模具，其具有包括多个集成电路装置的第一侧，所述多个集成电路装置被配置为在操作时产生热量，以及与第一侧相对设置的第二侧，以及包括液体的蒸气室，蒸发器，其包括与模具的第二侧热耦合的表面，蒸发器被配置为将液体蒸发成蒸汽，以及冷凝器，其包括超疏水表面并且构造成冷凝蒸气，其中从冷凝蒸气聚结释放的能量超疏水表面使冷凝的蒸气从冷凝器的超疏水表面跳跃到蒸发器的表面。可以描述和/或要求保护其他实施例。

2. 发明授权

US09943931B2 High performance transient uniform cooling solution for thermal compression bonding process 有权
公开(公告)号：US09943931B2
公开(公告)日：2018-04-17
申请号：US15221102
申请日：2016-07-27
申请人： Intel Corporation
发明人： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
IPC分类号： B23K37/00 , B23K3/08 , H01L23/00 , H05K3/34 , B23K20/02 , F25B21/02
CPC分类号： B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

3. 发明授权

US09282650B2 Thermal compression bonding process cooling manifold 有权
标题翻译：热压接工艺冷却歧管
公开(公告)号：US09282650B2
公开(公告)日：2016-03-08
申请号：US14132883
申请日：2013-12-18
申请人： Intel Corporation
发明人： Hemanth Dhavaleswarapu , Zhihua Li , Joseph Petrini , Steven B. Roach , Shankar Devasenathipathy , George Kostiew , Amram Eitan
IPC分类号： B23K37/00 , H05K3/34 , B23K1/00 , B23K3/04 , H01L23/00 , B23K3/08 , B23K20/02
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K3/085 , B23K20/002 , B23K20/023 , B23K20/026 , B23K20/26 , B23K35/0244 , B23K37/003 , B23K2101/42 , B33Y80/00 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75502 , H01L2224/7555 , H01L2224/81097 , H01L2224/81098 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81948 , H05K3/3436 , H05K3/3494 , H05K2203/04 , H05K2203/1121 , H01L2924/014 , H01L2924/00012
摘要： Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.
摘要翻译：公开了热压接（TCB）工艺冷却歧管，TCB工艺系统和使用冷却歧管的TCB方法的实施例。在一些实施例中，冷却歧管包括通过挡板与混合室分离的预混合室。挡板可以包括通过挡板形成的至少一个同心图案，使得预混合室中的主要冷却流体基本均匀地分布到混合室。预混合室可以连接到主冷却流体源。混合室可以具有被配置为接受主冷却流体的输入和输出以输出主冷却流体的输入。

4. 发明申请

US20160211238A1 THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD 有权
公开(公告)号：US20160211238A1
公开(公告)日：2016-07-21
申请号：US15062298
申请日：2016-03-07
申请人： Intel Corporation
发明人： Hemanth Dhavaleswarapu , Zhihua Li , Joseph Petrini , Steven B. Roach , Shankar Devasenathipathy , George S. Kostiew , Amram Eitan
IPC分类号： H01L23/00 , B23K20/00 , B23K35/02 , B23K20/02 , B23K20/26
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K3/085 , B23K20/002 , B23K20/023 , B23K20/026 , B23K20/26 , B23K35/0244 , B23K37/003 , B23K2101/42 , B33Y80/00 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75502 , H01L2224/7555 , H01L2224/81097 , H01L2224/81098 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81948 , H05K3/3436 , H05K3/3494 , H05K2203/04 , H05K2203/1121 , H01L2924/014 , H01L2924/00012
摘要： Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

5. 发明授权

US09397471B2 Heat removal from photonic devices 有权
标题翻译：从光子器件散热
公开(公告)号：US09397471B2
公开(公告)日：2016-07-19
申请号：US14541367
申请日：2014-11-14
申请人： INTEL CORPORATION
发明人： Zhihua Li , Qing Tan , Qinrong Yu
IPC分类号： H01L23/66 , H01S5/024 , H01L31/024 , H01S5/022 , H01L31/02 , H01L31/0232 , H01S5/02
CPC分类号： H01S5/02476 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01S5/02276 , H01S5/02469 , H01S5/02484 , H01L2924/00014
摘要： Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate. In still another embodiment, a stepped heat spreader, having a base portion and a pedestal portion, has the pedestal portion inserted through the microelectronic substrate, wherein the photonic device is in thermal contact with the pedestal portion proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the base portion.
摘要翻译：本说明书的实施例涉及将热量从微电子衬底从光子器件传递到散热器件的机构。在一个实施例中，微电子衬底可以包括高导热介电材料。在另一个实施例中，微电子衬底可以包括在微电子衬底内的导电插入物，其中光子器件与微电子衬底的一个表面附近的导电插入件热接触，并且散热器件与导电插件紧邻相对的热接触微电子衬底的表面。在另一个实施例中，具有基座部分和基座部分的台阶式散热器具有穿过微电子衬底插入的基座部分，其中光子器件与靠近微电子衬底的一个表面的基座部分热接触，散热装置与基座部分热接触。

6. 发明授权

US09748199B2 Thermal compression bonding process cooling manifold 有权
公开(公告)号：US09748199B2
公开(公告)日：2017-08-29
申请号：US15062298
申请日：2016-03-07
申请人： Intel Corporation
发明人： Hemanth Dhavaleswarapu , Zhihua Li , Joseph Petrini , Steven B. Roach , Shankar Devasenathipathy , George Kostiew , Amram Eitan
IPC分类号： B23K31/02 , H01L23/00 , H05K3/34 , B23K1/00 , B23K3/04 , B23K37/00 , B23K3/08 , B23K20/02 , B23K20/00 , B23K20/26 , B23K35/02 , B23K101/42 , B33Y80/00
CPC分类号： H01L24/81 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K3/085 , B23K20/002 , B23K20/023 , B23K20/026 , B23K20/26 , B23K35/0244 , B23K37/003 , B23K2101/42 , B33Y80/00 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75502 , H01L2224/7555 , H01L2224/81097 , H01L2224/81098 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81948 , H05K3/3436 , H05K3/3494 , H05K2203/04 , H05K2203/1121 , H01L2924/014 , H01L2924/00012
摘要： Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

7. 发明申请

US20170014957A1 HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS 审中-公开
标题翻译：高性能瞬态均热冷热解决方案
公开(公告)号：US20170014957A1
公开(公告)日：2017-01-19
申请号：US15221102
申请日：2016-07-27
申请人： Intel Corporation
发明人： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
IPC分类号： B23K37/00 , H05K3/34 , B23K20/02 , H01L23/00 , F25B21/02 , B23K3/08
CPC分类号： B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
摘要翻译：描述了热压接瞬态冷却方案的各种实施例。这些实施例包括耦合到加热器表面的垂直分离的微通道的阵列，其中每个出口微通道包括两个相邻的入口微通道，并且其中入口和出口歧管联接到微通道阵列，并且其中加热器表面并且微通道在同一块内耦合。

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