会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Environmental sensitive electronic device package having side wall barrier structure
    • 具有侧壁屏障结构的环境敏感电子器件封装
    • US09450202B2
    • 2016-09-20
    • US14065434
    • 2013-10-29
    • Industrial Technology Research Institute
    • Kuang-Jung Chen
    • H01L51/52G02F1/1333
    • H01L51/5246G02F1/133308G02F2001/133311G02F2201/50H01L51/5281
    • An environmental sensitive electronic device package having side wall barrier structure may include a first substrate, a second substrate, an environmental sensitive electronic device, a first adhesive, a third substrate, at least one first side wall barrier structure, and a second adhesive. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located between the first and second substrates and covers the environmental sensitive electronic device. The third substrate is located below the first substrate. The first substrate is located between the second and third substrates. The first side wall barrier structure is located on the third substrate and between the first and the third substrates, wherein the first side wall barrier structure is embedded in the first substrate. The second adhesive is located between the first and third substrates and covers the second first side wall barrier structure.
    • 具有侧壁阻挡结构的环境敏感的电子器件封装可以包括第一衬底,第二衬底,环境敏感电子器件,第一粘合剂,第三衬底,至少一个第一侧壁阻挡结构和第二粘合剂。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一和第二基底之间并覆盖环境敏感的电子设备。 第三基板位于第一基板的下方。 第一基板位于第二和第三基板之间。 第一侧壁阻挡结构位于第三基板上并且位于第一和第三基板之间,其中第一侧壁阻挡结构嵌入第一基板。 第二粘合剂位于第一和第三基底之间并且覆盖第二第一侧壁阻挡结构。
    • 10. 发明授权
    • Environmental sensitive electronic device package
    • 环保电子设备包装
    • US09288897B2
    • 2016-03-15
    • US14065435
    • 2013-10-29
    • Industrial Technology Research Institute
    • Kuang-Jung ChenWei-Yi Lin
    • H05K1/18H05K1/02
    • H05K1/0281H05K2201/10128H05K2201/2009H05K2201/2036
    • An environmental sensitive electronic device package includes a first substrate, a second substrate, an environmental sensitive electronic device, at least one side wall barrier structure, and a filler layer. The first substrate has at least one predetermined flexure area. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate and between the first substrate and the second substrate. The side wall barrier structure is located between the first substrate and the second substrate and surrounds the environmental sensitive electronic device. The side wall barrier structure has at least one flexure stress dispersing structure that is located in the predetermined flexure area. The filler layer is located between the first substrate and the second substrate and covers the side wall barrier structure and the environmental sensitive electronic device.
    • 环境敏感电子器件封装包括第一衬底,第二衬底,环境敏感电子器件,至少一个侧壁阻挡结构和填充层。 第一基板具有至少一个预定的弯曲区域。 第二基板位于第一基板的上方。 环境敏感电子器件位于第一衬底上,并位于第一衬底和第二衬底之间。 侧壁阻挡结构位于第一基板和第二基板之间并且环绕环境敏感的电子设备。 侧壁阻挡结构具有位于预定弯曲区域中的至少一个挠曲应力分散结构。 填充层位于第一基板和第二基板之间,并且覆盖侧壁阻挡结构和环境敏感电子设备。