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1. 发明授权

US11906574B2 Hybrid socket warp indicator 有权
公开(公告)号：US11906574B2
公开(公告)日：2024-02-20
申请号：US17369180
申请日：2021-07-07
申请人： International Business Machines Corporation
发明人： Stephen Michael Hugo , Theron Lee Lewis , Timothy Jennings , Timothy P. Younger , David J. Braun , Jennifer I. Bennett , John R. Dangler , James D. Bielick
IPC分类号： G01R31/28 , H01R12/57 , H05K1/11 , G01B7/16 , H05K3/40
CPC分类号： G01R31/281 , G01B7/20 , H01R12/57 , H05K1/111 , H05K3/4007 , H05K2201/068 , H05K2201/10734
摘要： Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

2. 发明授权

US12100910B2 Shape-memory alloy lock for connectors 有权
公开(公告)号：US12100910B2
公开(公告)日：2024-09-24
申请号：US17457737
申请日：2021-12-06
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Theron Lee Lewis , David J. Braun , James D. Bielick , John R. Dangler , Timothy P. Younger , Timothy Jennings , Jennifer I. Bennett , Stephen Michael Hugo
IPC分类号： H01R13/516 , H01R12/57 , H01R43/02
CPC分类号： H01R13/516 , H01R43/0256 , F16B2200/77 , H01R12/57
摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

3. 发明申请

US20140000105A1 APPARATUS AND METHOD FOR DETACHING A COMPONENT FROM A MOUNTING SURFACE 有权
标题翻译：用于从安装表面分离组件的装置和方法
公开(公告)号：US20140000105A1
公开(公告)日：2014-01-02
申请号：US13929250
申请日：2013-06-27
申请人： International Business Machines Corporation
发明人： James D. Bielick , Michk Huang , Yun Ting Lee
IPC分类号： H05K13/04
CPC分类号： H05K13/0486 , Y10T29/49124 , Y10T29/53274
摘要： Disclosed is an apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive. The apparatus includes a right-angled hook, a curved hook, a connecting body and an adjusting member. On one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface. On another side of the component, the curved hook protrudes into a second space between the component and the mounting surface. The connecting body connects the right-angled hook and the curved hook. In response to a thermal process, the adhesion of the adhesive is reduced, and an adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface. A method for detaching a component from a mounting surface is also disclosed.
摘要翻译：公开了一种用于通过粘合剂从部件附接到的安装表面上分离部件的装置。该装置包括直角钩，弯曲钩，连接体和调节构件。在组件的一侧，直角钩突出到组件和安装表面之间的第一空间中。在组件的另一侧，弯曲的钩突出到组件和安装表面之间的第二空间中。连接体连接直角钩和弯钩。响应于热处理，粘合剂的粘附性降低，并且调节构件的调节允许弯曲的钩提供剪切力以将部件从安装表面分离。还公开了一种用于从安装表面分离组件的方法。

4. 发明申请

US20230009784A1 HYBRID SOCKET WARP INDICATOR 有权
公开(公告)号：US20230009784A1
公开(公告)日：2023-01-12
申请号：US17369180
申请日：2021-07-07
申请人： International Business Machines Corporation
发明人： Stephen Michael Hugo , Theron Lee Lewis , Timothy Jennings , Timothy P. Younger , David J. Braun , Jennifer I. Bennett , John R. Dangler , James D. Bielick
IPC分类号： G01R31/28 , H01R12/57 , H05K1/11 , H05K3/40 , G01B7/16
摘要： Aspects include a hybrid socket dynamic warp indicator for socket connector systems and methods of using the same to measure the warpage of a printed circuit board assembly. The method can include providing a printed circuit board having a plurality of pads and a socket. A warp indicator having a plurality of solder joint connections and a resistor array is electrically coupled to the printed circuit board to build a printed circuit board assembly. The printed circuit board assembly is subjected to a thermal event. A resistance across the resistor array is measured after the thermal event. A number of separations between one or more pads of the printed circuit board and one or more solder joint connections of the warp indicator is determined based on a change in the resistance. A defective warpage condition for the socket is determined based on the number of separations.

5. 发明授权

US11245238B2 Tool for shaping contact tab interconnects at a circuit card edge 有权
公开(公告)号：US11245238B2
公开(公告)日：2022-02-08
申请号：US16157731
申请日：2018-10-11
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Timothy P. Younger , Theron L. Lewis , James D. Bielick , Jennifer Bennett , David J. Braun , Tim Bartsch , John R. Dangler , Stephen M. Hugo
IPC分类号： H01R43/16 , H01R43/22 , G06F13/38 , H01R12/72 , H01R12/89 , H05K3/22 , H05K1/11
摘要： A tool is provided for shaping contact tab interconnects at a circuit card edge. The tool includes a base member with a slot to receive a circuit card edge. The slot is sized such that the edge of the circuit card is slidable lengthwise within the slot. The tool further includes shaping dowels disposed within the base member, including at least two shaping dowels that define a set of adjacent shaping dowels extending at an angle relative to each other. The set of adjacent shaping dowels are exposed, at least in part, within the slot so that with lengthwise sliding of the edge of the circuit card within the slot, the edge of the circuit card contacts and slides across the set of adjacent shaping dowels rounding off, at least in part, ends of the contact tab interconnects at the edge of the circuit card.

6. 发明授权

US10881007B2 Recondition process for BGA using flux 有权
公开(公告)号：US10881007B2
公开(公告)日：2020-12-29
申请号：US15724883
申请日：2017-10-04
申请人： International Business Machines Corporation
发明人： Tim A. Bartsch , James D. Bielick , David J. Braun , Jennifer I. Bennett , Timothy P. Younger
IPC分类号： H05K3/34 , H05K3/22 , B23K1/00 , B23K1/008 , B23K1/20 , B23K101/42
CPC分类号： H05K3/225 , B23K1/008 , B23K1/0016 , B23K1/203 , H05K3/34 , B23K2101/42 , H05K3/3489 , H05K2203/043 , H05K2203/17
摘要： Methods for refurbishing a circuitry device are disclosed. The methods described herein include applying a first flux to solder contacts connecting a first member of a circuitry device to a second member of the circuitry device; performing a first setting process on the circuitry device with the first flux; applying a second flux to the solder contacts of the circuitry device; performing a second setting process on the circuitry device; and reflowing the solder contacts.

7. 发明申请

US20190157169A1 DYE AND PRY PROCESS FOR REMOVING QUAD FLAT NO-LEAD PACKAGES AND BOTTOM TERMINATION COMPONENTS 审中-公开
公开(公告)号：US20190157169A1
公开(公告)日：2019-05-23
申请号：US16255211
申请日：2019-01-23
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Tim A. Bartsch , Jennifer Bennett , James D. Bielick , David J. Braun , John R. Dangler , Stephen M. Hugo , Theron L. Lewis , Timothy P. Younger
IPC分类号： H01L21/66 , H01L21/48 , G01N21/95 , H01L23/00
摘要： Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.

8. 发明公开

US20240194558A1 HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL 审中-公开
公开(公告)号：US20240194558A1
公开(公告)日：2024-06-13
申请号：US18065365
申请日：2022-12-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Brent William Yardley , Theron Lee Lewis , James D. Bielick , Curtis Eugene Larsen , Karl Stathakis
IPC分类号： H01L23/367 , H01L21/48
CPC分类号： H01L23/367 , H01L21/4882 , H01L24/29
摘要： Mounting a heat sink to an electrical component by applying a thermal interface material on at least one of a surface of one of the electrical component and the heat sink, wherein the heat sink includes a heat pedestal including an interface surface with an apex having at least one curvature extending therethrough. The heat sink contacts the electrical component through the thermal interface material. The apex of the interface surface is an element of the heat sink closest to the electrical component. The interface surface that includes the apex and the at least one curvature cause the thermal interface material to flow during the contacting so that any space between the heat sink and the electrical component is filled with thermal interface material and is substantially free of voids.

9. 发明公开

US20240170903A1 CONTROLLED EXTRACTION OF ELECTRONIC CONNECTOR FROM ELECTRONIC CONNECTOR BOARD 审中-公开
公开(公告)号：US20240170903A1
公开(公告)日：2024-05-23
申请号：US18057418
申请日：2022-11-21
申请人： International Business Machines Corporation
发明人： Theron Lee Lewis , Timothy P. Younger , David J. Braun , James D. Bielick , John R. Dangler , Stephen Michael Hugo , Timothy Jennings
IPC分类号： H01R43/20
CPC分类号： H01R43/205
摘要： A controlled extraction of an electronic connector from an electronic circuit board includes a press mechanism of a device positioned in spaced relation over a base fixture of the device. The base fixture receiving an electronic circuit board which includes a connector. Shafts of a removal tool of the press mechanism can be inserted into a series of openings in the connector, respectively, in response to applying a downward force to the press mechanism. A capturing element on each of the shafts can be actuated where the capturing element couples to a wall defining the opening of each of the openings. The connector can be removed from the electronic circuit board by applying an upward force to the press mechanism which removes the connector with the capturing element of the shafts coupled to the wall of the opening, and releasing the press mechanism from the base fixture.

10. 发明公开

US20230178922A1 SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS 审中-公开
公开(公告)号：US20230178922A1
公开(公告)日：2023-06-08
申请号：US17457737
申请日：2021-12-06
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Theron Lee Lewis , David J. Braun , James D. Bielick , John R. Dangler , Timothy P. Younger , Timothy Jennings , Jennifer I. Bennett , Stephen Michael Hugo
IPC分类号： H01R13/516 , H01R43/02 , F16B1/00 , H01R12/57
CPC分类号： H01R13/516 , H01R43/0256 , F16B1/0014 , H01R12/57
摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

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