专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10553522B1 Semiconductor microcooler 有权
公开(公告)号：US10553522B1
公开(公告)日：2020-02-04
申请号：US16102252
申请日：2018-08-13
申请人： International Business Machines Corporation
发明人： Donald F. Canaperi , Daniel A. Corliss , Dario Goldfarb , Dinesh Gupta , Fee Li Lie , Kamal K. Sikka
IPC分类号： H01L23/473 , H01L23/427 , F28F3/12 , H01L23/373 , F28F3/04
摘要： A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

2. 发明授权

US09104113B2 Amplification method for photoresist exposure in semiconductor chip manufacturing 有权
标题翻译：半导体芯片制造中光致抗蚀剂曝光的放大方法
公开(公告)号：US09104113B2
公开(公告)日：2015-08-11
申请号：US13735232
申请日：2013-01-07
申请人： International Business Machines Corporation
发明人： Richard S. Wise , Daniel A. Corliss
IPC分类号： G03F7/20
CPC分类号： G03F7/70325 , G03F7/2004 , G03F7/2041 , G03F7/70058 , G03F7/70308 , G03F7/70375
摘要： An electrical field is applied through an extreme ultraviolet (EUV) photoresist layer along a direction perpendicular to an interface between the EUV photoresist layer and an underlying layer. Secondary electrons and thermal electrons are accelerated along the direction of the electrical field, and travel with directionality before interacting with the photoresist material for a chemical reaction. The directionality increases the efficiency of electron photoacid capture, reducing the required EUV dose for exposure. Furthermore, this directionality reduces lateral diffusion of the secondary and thermal electrons, and thereby reduces blurring of the image and improves the image resolution of feature edges formed in the EUV photoresist layer. The electrical field may be generated by applying a direct current (DC) and/or alternating current (AC) bias voltage across an electrostatic chuck and a conductive plate placed over the EUV photoresist layer with a hole for passing the EUV radiation through.
摘要翻译：沿着与EUV光致抗蚀剂层和下层之间的界面垂直的方向通过极紫外（EUV）光致抗蚀剂层施加电场。二次电子和热电子沿着电场的方向被加速，并且在与用于化学反应的光致抗蚀剂材料相互作用之前以方向性行进。方向性增加了电子光酸捕获的效率，降低了暴露所需的EUV剂量。此外，这种方向性减小了二次和热电子的横向扩散，从而减少了图像的模糊并改善了形成在EUV光致抗蚀剂层中的特征边缘的图像分辨率。可以通过在静电卡盘和放置在EUV光致抗蚀剂层上的导电板上施加直流（DC）和/或交流（AC）偏置电压来产生电场，所述导电板具有用于使EUV辐射通过的孔。

3. 发明授权

US10490481B1 Copper microcooler structure and fabrication 有权
公开(公告)号：US10490481B1
公开(公告)日：2019-11-26
申请号：US16132829
申请日：2018-09-17
申请人： International Business Machines Corporation
发明人： Fee Li Lie , Kamal K. Sikka , Donald Francis Canaperi , Daniel A. Corliss , Dinesh Gupta , Dario Goldfarb
IPC分类号： H01L23/34 , H01L23/373 , H01L23/367 , H01L23/473 , H01L23/00
CPC分类号： H01L23/3735 , H01L23/367 , H01L23/473 , H01L24/09
摘要： Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.

4. 发明授权

US10490480B1 Copper microcooler structure and fabrication 有权
公开(公告)号：US10490480B1
公开(公告)日：2019-11-26
申请号：US16106918
申请日：2018-08-21
申请人： International Business Machines Corporation
发明人： Fee Li Lie , Kamal K. Sikka , Donald Francis Canaperi , Daniel A. Corliss , Dinesh Gupta , Dario Goldfarb
IPC分类号： H01L23/34 , H01L23/373 , H01L23/00 , H01L23/473 , H01L23/367
CPC分类号： H01L23/3735 , H01L23/367 , H01L23/473 , H01L24/09
摘要： Techniques that facilitate a copper microcooler structure are provided. In one example, a device includes a first copper microcooler structure and a second copper microcooler structure. The first copper microcooler structure includes a first copper plate and a first set of copper channels attached to the first copper plate. The second copper microcooler structure includes a second copper plate and a second set of copper channels attached to the second copper plate. A surface of the second copper plate associated with the second copper microcooler structure is bonded to one or more surfaces of the first set of copper channels associated with the first copper microcooler structure via a fusion bond.

5. 发明申请

US20200051896A1 Semiconductor Microcooler 审中-公开
公开(公告)号：US20200051896A1
公开(公告)日：2020-02-13
申请号：US16102252
申请日：2018-08-13
申请人： International Business Machines Corporation
发明人： Donald F. Canaperi , Daniel A. Corliss , Dario Goldfarb , Dinesh Gupta , Fee Li Lie , Kamal K. Sikka
IPC分类号： H01L23/473 , H01L23/427 , F28F3/04 , F28F3/12 , H01L23/373
摘要： A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

6. 发明授权

US10553516B1 Semiconductor microcooler 有权
公开(公告)号：US10553516B1
公开(公告)日：2020-02-04
申请号：US16102309
申请日：2018-08-13
申请人： International Business Machines Corporation
发明人： Donald F. Canaperi , Daniel A. Corliss , Dario Goldfarb , Dinesh Gupta , Fee Li Lie , Kamal K. Sikka
IPC分类号： H01L23/367 , H01L23/373 , H01L21/48 , H01L23/473
摘要： A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are vertically aligned. The microcoolers may include an inlet passage to accept coolant and an outlet passage to expel the coolant. One or more microcoolers may be thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the passages and heat from the one or more microcoolers may transfer to the liquid coolant.

7. 发明申请

US20160205757A1 DUAL PULSE DRIVEN EXTREME ULTRAVIOLET (EUV) RADIATION SOURCE 有权
标题翻译：双脉冲驱动极端超紫外线（EUV）辐射源
公开(公告)号：US20160205757A1
公开(公告)日：2016-07-14
申请号：US15077187
申请日：2016-03-22
申请人： International Business Machines Corporation
发明人： Daniel A. Corliss , Sadanand V. Deshpande , Veeresh V. Deshpande , Oleg Gluschenkov , Sivarama Krishnan
IPC分类号： H05G2/00
CPC分类号： H05G2/005 , H05G2/003 , H05G2/008
摘要： An extreme ultraviolet (EUV) radiation source pellet includes at least one metal particle embedded within a heavy noble gas cluster contained within a noble gas shell cluster. The EUV radiation source assembly can be activated by a sequential irradiation of at least one first laser pulse and at least one second laser pulse. Each first laser pulse generates plasma by detaching outer orbital electrons from the at least one metal particle and releasing the electrons into the heavy noble gas cluster. Each second laser pulse amplifies the plasma embedded in the heavy noble gas cluster triggering a laser-driven self-amplifying process. The amplified plasma induces inter-orbital electron transitions in heavy noble gas and other constitute atoms leading to emission of EUV radiation. The laser pulsing units can be combined with a source pellet generation unit to form an integrated EUV source system.
摘要翻译：极紫外（EUV）辐射源颗粒包括至少一种金属颗粒，该金属颗粒嵌入到包含在惰性气体壳簇内的重稀有气体簇中。可以通过顺序照射至少一个第一激光脉冲和至少一个第二激光脉冲来激活EUV辐射源组件。每个第一激光脉冲通过从外部轨道电子从至少一个金属颗粒分离并将电子释放到重稀有气体簇中来产生等离子体。每个第二激光脉冲放大埋在重稀有气体簇中的等离子体，从而触发激光驱动的自放大过程。放大的等离子体引起重稀土气体中的轨道间电子跃迁，其他构成原子，导致发射EUV辐射。激光脉冲单元可以与源粒子产生单元组合以形成集成的EUV源系统。

8. 发明申请

US20200161216A1 Semiconductor Microcooler 审中-公开
公开(公告)号：US20200161216A1
公开(公告)日：2020-05-21
申请号：US16713611
申请日：2019-12-13
申请人： International Business Machines Corporation
发明人： Donald F. Canaperi , Daniel A. Corliss , Dario Goldfarb , Dinesh Gupta , Fee Li Lie , Kamal K. Sikka
IPC分类号： H01L23/473 , F28F3/04 , H01L23/373 , F28F3/12 , H01L23/427
摘要： A stacked semiconductor microcooler includes a first and second semiconductor microcooler. Each mircocooler includes silicon fins extending from a silicon substrate. A metal layer may be formed upon the fins. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

9. 发明授权

US10642161B1 Baseline overlay control with residual noise reduction 有权
公开(公告)号：US10642161B1
公开(公告)日：2020-05-05
申请号：US16156227
申请日：2018-10-10
申请人： International Business Machines Corporation
发明人： Daniel A. Corliss , Scott D. Halle , Richard C. Johnson , Christopher F. Robinson , Chumeng Zheng
IPC分类号： G03F7/20
CPC分类号： G03F7/70475 , G03F7/70358 , G03F7/70525 , G03F7/70633
摘要： Systems, methods and computer program products generally include a vector by vector subtraction method per wafer. A first layer is exposed to form a pattern image on a wafer and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a baseline reference are measured. The first layer is then reworked and exposed to form the same pattern image and the overlay data of alignment registration marks at multiple locations relative to alignment registration marks of a first layer are measured. The overlay data of the reworked first layer is subtracted from the overlay data of the first layer to provide an overlay difference at each of the multiple locations. The overlay difference is converted to a pre-correction factor of a magnitude opposite that of the overlay difference and is applied to exposure of a second layer provided on the first layer.

10. 发明申请

US20200051886A1 Semiconductor Microcooler 审中-公开
公开(公告)号：US20200051886A1
公开(公告)日：2020-02-13
申请号：US16102309
申请日：2018-08-13
申请人： International Business Machines Corporation
发明人： Donald F. Canaperi , Daniel A. Corliss , Dario Goldfarb , Dinesh Gupta , Fee Li Lie , Kamal K. Sikka
IPC分类号： H01L23/367 , H01L23/373 , H01L23/473 , H01L21/48
摘要： A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are vertically aligned. The microcoolers may include an inlet passage to accept coolant and an outlet passage to expel the coolant. One or more microcoolers may be thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the passages and heat from the one or more microcoolers may transfer to the liquid coolant.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式