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1. 发明申请

US20010028117A1 Method and structure for preventing adhesive bleed onto surfaces 失效
标题翻译：防止粘合剂渗透到表面上的方法和结构
公开(公告)号：US20010028117A1
公开(公告)日：2001-10-11
申请号：US09881466
申请日：2001-06-14
申请人： International Business Machines Corporation
发明人： Bernd K. Appelt , Gary A. Johansson , Gerald W. Jones , Luis J. Matienzo , Yenloan H. Nguyen , Konstantinos I. Papathomas
IPC分类号： H01L029/40
CPC分类号： B82Y30/00 , B82Y10/00 , H01L21/4864 , H01L23/49894 , H01L24/80 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/14
摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide nullSelf-Assembled Monolayersnull (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.
摘要翻译：提供了一种方法和结构，用于当将I / C芯片附接到基板时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属引线接合焊盘上的润湿或渗出。该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。碳氢化合物段在贵金属上呈现具有低分子表面张力的分子的特征的表面，从而防止了环氧粘合剂组分对贵金属的润湿。 SAMs一旦提供防止裸片附着胶粘剂的泄漏，在引线接合或焊接温度期间自解吸。

2. 发明申请

US20010005304A1 Printed circuit board capacitor structure and method 失效
公开(公告)号：US20010005304A1
公开(公告)日：2001-06-28
申请号：US09773998
申请日：2001-02-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bernd K. Appelt , John M. Lauffer
IPC分类号： H01G004/20
CPC分类号： H05K1/162 , H05K1/0366 , H05K3/429 , H05K3/4641 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , Y10T29/435 , Y10T29/49002 , Y10T29/4913 , Y10T29/49144 , Y10T29/5102
摘要： A capacitive element for a circuit board or chip carrier having improved capacitance and method of manufacturing the same is provided. The structure is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets at least one of which can be partially cured or softened followed by being fully cured or hardened. The lamination takes place by laminating a partially cured or softened sheet to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils; thus the single dielectric sheets does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness. The use of two or more sheets of dielectric material makes it very unlikely that two or more defects in the sheets of dielectric material will align thus greatly reducing the probability of a defect causing a failure in test or field use.

3. 发明申请

US20030162047A1 Electrically conductive filled through holes 审中-公开
标题翻译：导电填充通孔
公开(公告)号：US20030162047A1
公开(公告)日：2003-08-28
申请号：US10375333
申请日：2003-02-27
申请人： International Business Machines Corporation
发明人： Bernd K. Appelt , Jeffrey D. Gelorme , Sung Kwon Kang , Voya R. Markovich , Kostas Papathomas , Sampath Purushothaman
IPC分类号： B32B001/00
CPC分类号： H01L23/49827 , H01B1/02 , H01B1/22 , H01L23/49866 , H01L2924/0002 , H05K1/095 , H05K3/4069 , Y10T428/12181 , Y10T428/2991 , Y10T428/2993 , Y10T428/2998 , H01L2924/00
摘要： The present invention provides a unique conductive composition for filling vias or through holes to make reliable vertical or Z-connects. The through holes may be plated or unplated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.
摘要翻译：本发明提供了用于填充通孔或通孔以形成可靠的垂直或Z形连接的独特导电组合物。在填充之前可以对通孔进行电镀或未镀层。还公开了使用该特征制造高密度电子封装的描述。

4. 发明申请

US20010034937A1 Conductor interconnect with dendrites through film and method for producing same 失效
公开(公告)号：US20010034937A1
公开(公告)日：2001-11-01
申请号：US09859690
申请日：2001-05-17
申请人： International Business Machines Corporation
发明人： Bernd K. Appelt , Saswati Datta , Michael A. Gaynes , John M. Lauffer , James R. Wilcox
IPC分类号： H05K003/36 , H01R043/00
CPC分类号： H05K3/325 , H05K3/4614 , H05K2201/0373 , H05K2201/09536 , H05K2201/10666 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165 , Y10T29/49194
摘要： A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a nullthrough via.null

5. 发明申请

US20010013644A1 Chip carriers with enhanced wire bondabi lity 有权
标题翻译：芯片载体具有增强的线束键合性
公开(公告)号：US20010013644A1
公开(公告)日：2001-08-16
申请号：US09818305
申请日：2001-03-27
申请人： International Business Machines Corporation
发明人： Konstantinos Papathomas , Bernd K. Appelt , John J. Konrad
IPC分类号： H01L023/02 , C23C016/00 , B05D005/12
CPC分类号： H01L24/83 , H01L23/49894 , H01L24/28 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10S428/901 , Y10T428/3154 , Y10T428/31544 , Y10T428/31663 , Y10T428/31692 , H01L2924/00
摘要： A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4-(nnullm) nullnullIII wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.
摘要翻译：公开了基本上不能润湿粘合剂树脂的基底。用氟化硅烷组合物涂覆基材。优选的氟硅烷组合物包括式III的全氟烷基烷基硅烷：其中R5是全氟烷基烷基;其中R5是全氟烷基烷基;其中R5是全氟烷基烷基; R6是烷基或烯基; X是乙酰氧基，卤素或烷氧基; n为1或2; 并且m为0或1.组合物优选以溶液的形式施加，并且在蒸发溶剂后，形成耐久的，不润湿但良好粘附的表面。在优选实施例中，衬底是用于制造半导体器件的具有增强的引线接合性的芯片载体。

6. 发明申请

US20010022718A1 Printed circuit board capacitor structure and method 失效
标题翻译：印刷电路板电容器结构及方法
公开(公告)号：US20010022718A1
公开(公告)日：2001-09-20
申请号：US09822591
申请日：2001-03-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Bernd K. Appelt , John M. Lauffer
IPC分类号： H01G009/00
CPC分类号： H05K1/162 , H05K1/0366 , H05K3/429 , H05K3/4641 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/09309 , Y10T428/12569 , Y10T428/12597 , Y10T428/12903 , Y10T428/24124 , Y10T428/2476 , Y10T428/24994 , Y10T428/249952 , Y10T428/252 , Y10T428/264 , Y10T428/265 , Y10T428/269
摘要： A capacitive element for a circuit board or chip carrier having improved capacitance and method of manufacturing the same is provided. The structure is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured or softened followed by being fully cured or hardened. The lamination takes place by laminating a partially cured or softened sheet to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils; thus, the single dielectric sheet does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness. The use of two or more sheets of dielectric material makes it very unlikely that two or more defects in the sheets of dielectric material will align, thus greatly reducing the probability of a defect causing a failure in test or field use.
摘要翻译：提供了一种用于具有改进电容的电路板或芯片载体的电容元件及其制造方法。该结构由一对导电片形成，其间具有介质成分。电介质部件由两个或更多个电介质片形成，其中至少一个可部分固化或软化，然后完全固化或硬化。通过将部分固化或软化的片材层压到至少一种其它电介质材料片和导电材料片之一中来进行层压。两片电介质组件的总厚度不超过约4密耳，优选不超过约3密耳; 因此，单个电介质片材的厚度不超过约2密耳，优选不超过约1.5密耳。使用两层或更多层电介质材料使电介质材料片中的两个或多个缺陷非常不可能对齐，从而大大降低了导致测试或现场使用失败的缺陷的可能性。

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