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1. 发明授权

US08804305B2 Multilayer ceramic condenser and method for manufacturing the same 有权
标题翻译：多层陶瓷电容器及其制造方法
公开(公告)号：US08804305B2
公开(公告)日：2014-08-12
申请号：US13191890
申请日：2011-07-27
申请人： Hyung Joon Kim , Jong Hoon Kim
发明人： Hyung Joon Kim , Jong Hoon Kim
IPC分类号： H01G4/06
CPC分类号： H01G4/1227 , H01G4/008 , H01G4/012 , H01G4/232 , H01G4/2325 , H01G4/30 , Y10T29/435
摘要： Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.
摘要翻译：公开了一种多层陶瓷电容器及其制造方法。提供了一种多层陶瓷电容器，包括：多层主体，其中堆叠包括第一侧，第二侧，第三侧和第四侧的多个电介质层; 形成所述多个电介质层的第一覆盖层和第二覆盖层; 第一电介质层，设置在第一覆盖层和第二覆盖层之间，并印刷有第一内部电极图案，其被绘制到第一侧; 第二电介质层，与所述第一电介质层交替堆叠并且印刷有第二内部电极图案，所述第二内部电极图案被绘制到所述第三侧; 以及分别形成在彼此相对的第二侧和第四侧上的第一侧部和第二侧部。

2. 发明授权

US08508915B2 Multilayer ceramic condenser and method of manufacturing the same 有权
标题翻译：多层陶瓷电容器及其制造方法
公开(公告)号：US08508915B2
公开(公告)日：2013-08-13
申请号：US13276752
申请日：2011-10-19
申请人： Hyung Joon Kim , Jong Hoon Kim
发明人： Hyung Joon Kim , Jong Hoon Kim
IPC分类号： H01G4/06
CPC分类号： H01G4/0085 , H01G4/12 , H01G4/30 , Y10T29/43
摘要： Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed.
摘要翻译：公开了一种多层陶瓷冷凝器和制造多层陶瓷冷凝器的方法。提供一种制造多层陶瓷冷凝器的方法，包括：平行地在陶瓷生片上印刷多个条状内部电极图案; 通过堆叠形成多个条形内部电极图案的陶瓷生片来形成层压体; 切割层压体，使得第一内部电极图案和第二内部电极图案交替堆叠; 以及通过施加陶瓷浆料形成第一侧面部分和第二侧面部分，以覆盖第一内部电极图案和第二内部电极图案两者都露出的层压体的一侧。

3. 发明申请

US20120147515A1 MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷冷凝器及其制造方法
公开(公告)号：US20120147515A1
公开(公告)日：2012-06-14
申请号：US13191849
申请日：2011-07-27
申请人： Hyung Joon Kim , Jong Hoon Kim , Kang Heon Hur , Dae Bok Oh
发明人： Hyung Joon Kim , Jong Hoon Kim , Kang Heon Hur , Dae Bok Oh
IPC分类号： H01G4/30 , H01G7/00
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/43 , Y10T29/435
摘要： Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.
摘要翻译：公开了一种多层陶瓷电容器及其制造方法。该方法包括在陶瓷生片上平行印刷多条条状内部电极图案; 通过在其上印刷多个条形内部电极图案的陶瓷生片进行铆接来形成层压体; 切割层压体以具有第一和第二内部电极图案交替堆叠的结构; 以及通过施加陶瓷浆料形成第一侧面部分和第二侧面部分，以覆盖第一和第二内部电极图案所暴露的层压体的侧面。

4. 发明授权

US09159494B2 Multilayer ceramic condenser and method of manufacturing the same 有权
标题翻译：多层陶瓷电容器及其制造方法
公开(公告)号：US09159494B2
公开(公告)日：2015-10-13
申请号：US13191849
申请日：2011-07-27
申请人： Hyung Joon Kim , Jong Hoon Kim , Kang Heon Hur , Dae Bok Oh
发明人： Hyung Joon Kim , Jong Hoon Kim , Kang Heon Hur , Dae Bok Oh
IPC分类号： H01G7/00 , H01G4/30 , H01G4/12 , H01G4/008 , H01G4/012
CPC分类号： H01G4/30 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/43 , Y10T29/435
摘要： Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.
摘要翻译：公开了一种多层陶瓷电容器及其制造方法。该方法包括在陶瓷生片上平行印刷多条条状内部电极图案; 通过在其上印刷多个条形内部电极图案的陶瓷生片进行铆接来形成层压体; 切割层压体以具有第一和第二内部电极图案交替堆叠的结构; 以及通过施加陶瓷浆料形成第一侧面部分和第二侧面部分，以覆盖第一和第二内部电极图案所暴露的层压体的侧面。

5. 发明申请

US20120147516A1 MULTILAYER CERAMIC CONDENSER AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷冷凝器及其制造方法
公开(公告)号：US20120147516A1
公开(公告)日：2012-06-14
申请号：US13191890
申请日：2011-07-27
申请人： Hyung Joon KIM , Jong Hoon Kim
发明人： Hyung Joon KIM , Jong Hoon Kim
IPC分类号： H01G4/30 , H01G4/12
CPC分类号： H01G4/1227 , H01G4/008 , H01G4/012 , H01G4/232 , H01G4/2325 , H01G4/30 , Y10T29/435
摘要： Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other.
摘要翻译：公开了一种多层陶瓷电容器及其制造方法。提供了一种多层陶瓷电容器，包括：多层主体，其中堆叠包括第一侧，第二侧，第三侧和第四侧的多个电介质层; 形成所述多个电介质层的第一覆盖层和第二覆盖层; 第一电介质层，设置在第一覆盖层和第二覆盖层之间，并印刷有第一内部电极图案，其被绘制到第一侧; 第二电介质层，与所述第一电介质层交替堆叠并且印刷有第二内部电极图案，所述第二内部电极图案被绘制到所述第三侧; 以及分别形成在彼此相对的第二侧和第四侧上的第一侧部和第二侧部。

6. 发明申请

US20120147522A1 MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷冷凝器及其制造方法
公开(公告)号：US20120147522A1
公开(公告)日：2012-06-14
申请号：US13276752
申请日：2011-10-19
申请人： Hyung Joon KIM , Jong Hoon Kim
发明人： Hyung Joon KIM , Jong Hoon Kim
IPC分类号： H01G4/12 , H01G7/00
CPC分类号： H01G4/0085 , H01G4/12 , H01G4/30 , Y10T29/43
摘要： Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed.
摘要翻译：公开了一种多层陶瓷冷凝器和制造多层陶瓷冷凝器的方法。提供一种制造多层陶瓷冷凝器的方法，包括：平行地在陶瓷生片上印刷多个条状内部电极图案; 通过堆叠形成多个条形内部电极图案的陶瓷生片来形成层压体; 切割层压体，使得第一内部电极图案和第二内部电极图案交替堆叠; 以及通过施加陶瓷浆料形成第一侧面部分和第二侧面部分，以覆盖第一内部电极图案和第二内部电极图案两者都露出的层压体的一侧。

7. 发明授权

US08847377B2 Stacked wafer level package having a reduced size 有权
标题翻译：具有减小尺寸的堆叠晶片级封装
公开(公告)号：US08847377B2
公开(公告)日：2014-09-30
申请号：US13569600
申请日：2012-08-08
申请人： Jong Hoon Kim , Min Suk Suh , Seung Taek Yang , Seung Hyun Lee , Tae Min Kang
发明人： Jong Hoon Kim , Min Suk Suh , Seung Taek Yang , Seung Hyun Lee , Tae Min Kang
IPC分类号： H01L23/02 , H01L21/683 , H01L21/56 , H01L23/538 , H01L25/00 , H01L25/065 , H01L23/31 , H01L23/00 , H01L25/18
CPC分类号： H01L25/0652 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/96 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68345 , H01L2224/12105 , H01L2224/13024 , H01L2224/131 , H01L2224/2105 , H01L2224/221 , H01L2224/97 , H01L2225/06562 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H01L2924/014 , H01L2924/15311 , H01L2924/15788 , H01L2924/18161 , H01L2224/19 , H01L2924/00
摘要： A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.
摘要翻译：堆叠的晶片级封装包括具有第一焊盘的第一半导体芯片和具有第二焊盘的第二半导体芯片。半导体芯片的两个接合焊盘面向相同的方向。第二半导体芯片与第一半导体芯片平行设置。第三半导体芯片设置在用作支撑衬底的第一和第二半导体芯片上。第三半导体芯片具有在附接时在第一和第二半导体芯片之间露出的第三焊盘。最后，再分布结构电连接到第一，第二和第三键合焊盘。

8. 发明申请

US20120114535A1 COMPOUND FOR INHIBITING ACTIVITY OF RIBONUCLEASE, AND CONTAINER FOR STORING NUCLEIC ACID CONTAINING THE SAME 有权
标题翻译：用于抑制RIBONUCLEASE活性的化合物和用于储存含有其的核酸的容器
公开(公告)号：US20120114535A1
公开(公告)日：2012-05-10
申请号：US13377377
申请日：2009-06-12
申请人： Jong Hoon Kim , Hwangseo Park , Han Oh Park
发明人： Jong Hoon Kim , Hwangseo Park , Han Oh Park
IPC分类号： B01L3/00 , C07D403/06 , C07D405/12 , C07D405/06
CPC分类号： C07D403/06 , C07D231/38 , C07D403/12 , C07D405/06
摘要： Provided are an RNase activity inhibitory compound to effectively control the activity of the RNase promoting degradation of extracted RNAs and, in addition, a sample storage container including the same. The RNase activity inhibitory compound and the sample storage container according to the present invention may be effectively used to store RNAs during RNA extraction or the extracted RNAs.
摘要翻译：提供了一种RNase活性抑制化合物，用于有效控制RNA酶的活性，促进提取的RNA的降解，另外还含有包含其的样品储存容器。根据本发明的RNA酶活性抑制化合物和样品储存容器可以有效地用于在RNA提取期间或所提取的RNA中存储RNA。

9. 发明授权

US08026586B2 Semiconductor package 有权
标题翻译：半导体封装
公开(公告)号：US08026586B2
公开(公告)日：2011-09-27
申请号：US12647640
申请日：2009-12-28
申请人： Jong Hoon Kim
发明人： Jong Hoon Kim
IPC分类号： H01L23/02
CPC分类号： H01L23/13 , H01L23/3128 , H01L23/481 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L25/50 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor package comprises a substrate having bond fingers on an upper surface thereof and ball lands on a lower surface thereof; at least two chip modules stacked on the upper surface of the substrate, each of the at least two chip modules including a plurality of semiconductor chips having first connection members and stacked in a manner such that the first connection members of the semiconductor chips are connected to one another, the chip modules being stacked in a zigzag pattern such that connection parts of the chip modules project sideward; and second connection members electrically connecting the connection parts of the respective chip modules to the bond fingers of the substrate.
摘要翻译：半导体封装包括在其上表面上具有键合指状物的衬底，并且在其下表面上具有焊盘; 至少两个芯片模块堆叠在所述基板的上表面上，所述至少两个芯片模块中的每一个包括多个半导体芯片，所述多个半导体芯片具有第一连接构件，并且以使得所述半导体芯片的所述第一连接构件连接到另一方面，芯片模块以锯齿形图案堆叠，使得芯片模块的连接部分向侧面投射; 以及第二连接构件，其将各个芯片模块的连接部分电连接到基板的键合指状物。

10. 发明授权

US07745439B2 Indene derivatives and process for the preparation thereof 失效
标题翻译：茚衍生物及其制备方法
公开(公告)号：US07745439B2
公开(公告)日：2010-06-29
申请号：US10599913
申请日：2005-04-12
申请人： Hyae Gyeong Cheon , Sung-Eun Yoo , Sung Soo Kim , Sung-Don Yang , Kwang-Rok Kim , Sang Dal Rhee , Jin Hee Ahn , Seung Kyu Kang , Won Hoon Jung , Sung Dae Park , Nam Gee Kim , Sun Mee Kim , Kil Woong Mo , Jae Mok Lee , Hye Jung Kang , Koun Ho Lee , Jong Hoon Kim , Jeong-Hyung Lee , Seung Jun Kim
发明人： Hyae Gyeong Cheon , Sung-Eun Yoo , Sung Soo Kim , Sung-Don Yang , Kwang-Rok Kim , Sang Dal Rhee , Jin Hee Ahn , Seung Kyu Kang , Won Hoon Jung , Sung Dae Park , Nam Gee Kim , Sun Mee Kim , Kil Woong Mo , Jae Mok Lee , Hye Jung Kang , Koun Ho Lee , Jong Hoon Kim , Jeong-Hyung Lee , Seung Jun Kim
IPC分类号： A61K31/216 , A61K31/4402 , A61K31/5375 , C07C69/753 , C07D211/70 , C07D265/32
CPC分类号： C07D295/088 , C07C65/26 , C07C69/757 , C07C229/50 , C07C233/52 , C07C255/47 , C07C2601/14 , C07C2602/08 , C07D295/155
摘要： The inventive indene derivatives of formula (I) are capable of selectively modulating the activities of peroxisome proliferator activated receptors (PPARs), causing no adverse side effects, and thus, they are useful for the treatment and prevention of disorders modulated by PPARs, i.e., metabolic syndromes such as diabetes, obesity, arteriosclerosis, hyperlipidemia, hyperinsulinism and hypertension, inflammatory diseases such as osteoporosis, liver cirrhosis and asthma, and cancer.
摘要翻译：式（I）的本发明的茚衍生物能够选择性调节过氧化物酶体增殖物激活受体（PPAR）的活性，不引起副作用，因此它们可用于治疗和预防由PPARs调节的病症，糖尿病，肥胖，动脉硬化，高脂血症，高胰岛素血症和高血压等代谢综合征，骨质疏松症，肝硬化和哮喘等炎性疾病和癌症。

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