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    • 5. 发明授权
    • Method of fabricating MOS transistor
    • 制造MOS晶体管的方法
    • US07084039B2
    • 2006-08-01
    • US11024792
    • 2004-12-30
    • Hyun Soo Shin
    • Hyun Soo Shin
    • H01L21/331
    • H01L21/823878H01L21/823814H01L21/823864H01L21/823892
    • A method of fabricating a CMOS (complementary metal oxide semiconductor) transistor includes manufacturing steps, by which adverse transistor characteristics can be prevented from being degraded by high-temperature annealing for hardening a screen oxide layer. The method includes steps of forming a gate on a semiconductor substrate with a gate oxide layer therebetween, forming a screen oxide layer on the substrate and the gate, forming a nitride layer on the screen oxide layer, forming LDD regions in the substrate substantially aligned with the gate, removing the nitride layer, forming a spacer on the screen oxide layer and on at least a portion of a sidewall of the gate, and forming in the substrate source/drain regions extending from the LDD regions respectively in the substrate substantially aligned with the spacer.
    • 制造CMOS(互补金属氧化物半导体)晶体管的方法包括制造步骤,由此通过用于硬化屏幕氧化物层的高温退火可以防止不利的晶体管特性劣化。 该方法包括以下步骤:在半导体衬底上形成栅极氧化层之间的栅极,在衬底和栅极上形成屏蔽氧化物层,在栅极氧化层上形成氮化物层,在衬底中形成基本上与 栅极,去除氮化物层,在屏幕氧化物层上和栅极的侧壁的至少一部分上形成间隔物,并且在基板上形成基板源极/漏极区域,该基板源极/漏极区域分别从基板上的LDD区域延伸,基本上与 间隔物。
    • 7. 发明授权
    • Method for manufacturing MOS transistor of semiconductor device
    • 制造半导体器件的MOS晶体管的方法
    • US07704814B2
    • 2010-04-27
    • US11498680
    • 2006-08-02
    • Hyun Soo ShinJae Won Han
    • Hyun Soo ShinJae Won Han
    • H01L21/336
    • H01L21/823493H01L29/6659H01L29/7833
    • Disclosed is a method for manufacturing a semiconductor device including a low-voltage MOS transistor and a high-voltage MOS transistor. The present method includes a low-voltage well implantation process on a semiconductor substrate to form a first well in a first region of the substrate and a second well in a second region of the substrate; forming first and second gate oxide layers and first and second gate electrodes in the first and second regions, respectively; forming a first photoresist pattern to expose the first region; forming a first LDD region in the first region exposed by the first photoresist pattern and the first gate electrode; removing the first photoresist pattern; forming a second photoresist pattern to expose the second region; forming a second LDD region in the second region exposed by the second photoresist pattern and the second gate electrode; performing a compensational implantation on the second region to adjust a well concentration for the high-voltage MOS transistor; and removing the second photoresist pattern.
    • 公开了一种制造包括低电压MOS晶体管和高压MOS晶体管的半导体器件的方法。 本方法包括在半导体衬底上的低电压阱注入工艺,以在衬底的第一区域中形成第一阱,在衬底的第二区域中形成第二阱; 分别在第一和第二区域中形成第一和第二栅极氧化物层和第一和第二栅电极; 形成第一光致抗蚀剂图案以暴露第一区域; 在由第一光致抗蚀剂图案和第一栅电极暴露的第一区域中形成第一LDD区; 去除第一光致抗蚀剂图案; 形成第二光致抗蚀剂图案以暴露所述第二区域; 在由所述第二光致抗蚀剂图案和所述第二栅电极暴露的所述第二区域中形成第二LDD区域; 在所述第二区域上执行补偿注入以调整所述高压MOS晶体管的阱浓度; 并且去除第二光致抗蚀剂图案。
    • 10. 发明授权
    • Thin film transistor and the manufacturing method thereof
    • 薄膜晶体管及其制造方法
    • US07655951B2
    • 2010-02-02
    • US11433177
    • 2006-05-12
    • Jae Kyeong JeongJae Bon KooHyun Soo ShinYeon Gon Mo
    • Jae Kyeong JeongJae Bon KooHyun Soo ShinYeon Gon Mo
    • H01L29/786
    • H01L29/78603H01L29/66757H01L29/78675
    • A thin film transistor and a method for manufacturing the same capable of reducing a change in a threshold voltage of the thin film transistor formed on a flexible substrate. The thin film transistor includes: a substrate, the substrate being flexible; a buffer layer having a low dielectric constant from about 1.2 to about 4.0 and formed on the substrate; a semiconductor layer formed on the buffer layer; a gate electrode; first insulation layer formed between the gate electrode and the semiconductor layer; a second insulation layer formed on the semiconductor layer and the gate electrode; and a source/drain electrode electrically connected to the semiconductor layer through a contact hole formed in the second insulation layer. Therefore, the thin film transistor can reduce a change in its threshold voltage, thereby reducing changes in brightness, gray scale, contrast, etc., of light-emitting devices using the thin film transistor.
    • 一种薄膜晶体管及其制造方法,能够减小形成在柔性基板上的薄膜晶体管的阈值电压的变化。 所述薄膜晶体管包括:基板,所述基板是柔性的; 缓冲层,其介电常数为约1.2至约4.0,并形成在基底上; 形成在缓冲层上的半导体层; 栅电极; 形成在所述栅电极和所述半导体层之间的第一绝缘层; 形成在所述半导体层和所述栅电极上的第二绝缘层; 以及源极/漏极,其通过形成在第二绝缘层中的接触孔与半导体层电连接。 因此,薄膜晶体管可以减小其阈值电压的变化,从而减少使用薄膜晶体管的发光器件的亮度,灰度,对比度等的变化。